Multi-layered structure and method

Patent metadata

Field	Value
Publication number	US-2016005509-A1
Application number	US-201414323163-A
Country	US
Kind code	A1
Filing date	Jul 3, 2014
Priority date	Jul 3, 2014
Publication date	Jan 7, 2016
Grant date	—

Abstract

One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.

First claim

What is claimed is:

1 . A method for producing a layered structure comprising:
providing a substrate; forming a first layer onto at least part of the substrate, the first layer being a first polymer; forming a second layer onto at least part of the first layer, the second layer being a second polymer; wherein the substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive; and characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one tenth of the thickness of the substrate.

2 . The method according to claim 1 , wherein at least one of the first and second layers comprises an electrically conductive PEDOT material.

3 . The method according to claim 1 characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one fiftieth of the thickness of the substrate.

4 . The method according to claim 1 , wherein forming of at least one of the first and second layers comprises masking ends of the layer to define contact areas that are configured for attaching an electrically conducting contact.

5 . The method according to claim 1 , wherein forming of at least one of the first and second layers comprises using a conductive PEDOT polymer followed by using a chemical etch to change at least portions of the layer from conductive to insulative.

6 . The method according to claim 1 , further comprising forming a third layer over the second layer, the third layer comprising an insulative photoresist material.

7 . A layered structure comprising:
a substrate; a first layer over the substrate; and a second layer over the first layer; characterized in that the substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material, and that at least one of the first and second layers comprises an electrically conductive polymer.

8 . The layered structure of claim 7 characterized in that at least one of the first and second layers comprises electrically conductive PEDOT.

9 . The layered structure of claim 7 characterized in that each of the first and second layers are one tenth of the thickness of the substrate.

10 . The layered structure of claim 7 , wherein the layered structure has a length defining first and second ends and wherein at least one of the first and second layers extends substantially the length of the layered structure and includes contact areas proximate to the first and second ends that are configured for attaching an electrically conducting contact.

11 . The layered structure of claim 7 , wherein the thickness of at least one of the first and second layers is in a range from 0.05 μm to 10 μm.

12 . The layered structure of claim 7 , wherein the substrate comprises one of a metal wire and metal insertion needle and at least one of the first and second layers is electrically conductive PEDOT.

13 . The layered structure of claim 7 , wherein the substrate and the first and second layers are biocompatible such that the layered structure is configured for implantation into the human body.

14 . The layered structure of claim 7 , wherein the substrate has a sheet resistance of less than 10 kΩ.

15 . A layered structure comprising:
a conductive substrate; a first layer over the substrate, wherein the first layer comprises an insulating material and includes at least one access area; and a contact area at least partially within the access area and in conductive contact with the substrate; characterized in that the first layer has a thickness that is no more than one tenth of the thickness of the substrate.

16 . The layered structure of claim 15 , wherein the contact area is an electrically conductive PEDOT material.

17 . The layered structure of claim 15 , wherein the access area is a hole in the first layer having a diameter of less than 0.4 mm.

18 . The layered structure of claim 15 , wherein each of the first layer and the contact area are no more than one tenth the thickness of the substrate.

19 . The layered structure of claim 15 , wherein the substrate, the contact area and the contact area are biocompatible such that layered structure is configured for implantation into the human body.

20 . The layered structure of claim 15 characterized in that the thickness of the first layer is no more than one fiftieth of the thickness of the substrate.

Assignees

• Heraeus Precious Metals Gmbh

Inventors

• Hafiz Jami A
• Schibli Stefan
• Troetzschel Jens

Classifications

• A61N1/05 Primary

  for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) · CPC title

• H01B1/127 Primary

  comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes · CPC title

• H01B7/048 Primary

  for implantation into a human or animal body, e.g. pacemaker leads · CPC title

• H01B13/0036

  Details · CPC title

• H01B1/128

  comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes · CPC title