Biomass photosensitive material and method for manufacturing the same, and printed circuit board

Patent metadata

Field	Value
Publication number	US-2016004158-A1
Application number	US-201514792772-A
Country	US
Kind code	A1
Filing date	Jul 7, 2015
Priority date	Jul 7, 2014
Publication date	Jan 7, 2016
Grant date	—

Abstract

A method of forming a biomass photosensitive material is provided, which includes ( 1 ) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer, and ( 2 ) mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.

First claim

What is claimed is:

1 . A biomass photosensitive material, comprising:
a product of a ring-opening addition reaction from a copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond, wherein the copolymer is polymerized of (a) itaconic anhydride and (b) acrylate, and the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group are reacted in the ring-opening addition reaction.

2 . The biomass photosensitive material as claimed in claim 1 , comprising a plurality of carbon-carbon double bonds and a plurality of carboxyl groups.

3 . The biomass photosensitive material as claimed in claim 1 , wherein the (a) itaconic anhydride and the (b) acrylate have a molar ratio of 1:0.8 to 1:5, and the (a) itaconic anhydride and the (c) the monomer with the single hydroxy group and the carbon-carbon double bond have a molar ratio of 1:0.2 to 1:1.

4 . The biomass photosensitive material as claimed in claim 1 , wherein the (b) acrylate comprises methyl methacrylate, butyl methacrylate, butyl acrylate, isooctyl acrylate, isobornyl acrylate, or a combination thereof.

5 . The biomass photosensitive material as claimed in claim 1 , wherein the (c) the monomer with the single hydroxy group and the carbon-carbon double bond comprises pentaerythritol triacrylate, 2-hydroxyethyl acrylate, or a combination thereof.

6 . The biomass photosensitive material as claimed in claim 1 , further comprising (d) polylactic acid to react with the copolymer in the ring-opening addition reaction, wherein the (a) itaconic anhydride and a hydroxy group of the (d) polylactic acid are reacted in the ring-opening addition reaction.

7 . The biomass photosensitive material as claimed in claim 6 , wherein the (a) itaconic anhydride and the (d) poly lactic acid have a molar ratio of 1:0.005 to 1:0.7.

8 . The biomass photosensitive material as claimed in claim 1 , further comprising (e) water, alcohol, or a combination thereof to react with the copolymer in the ring-opening addition reaction, wherein the (a) itaconic anhydride and a hydroxy group of the (e) water, alcohol, or a combination thereof are reacted in the ring-opening reaction.

9 . The biomass photosensitive material as claimed in claim 8 , wherein the (a) itaconic anhydride and the (e) water, alcohol, or a combination thereof have a molar ratio of 1:0.001 to 1:0.3.

10 . A printed circuit board, comprising:
an integrated circuit; and an anti-solder layer on the integrated circuit, and the anti-solder layer is formed by pattering a photoresist material; wherein the photoresist material includes the biomass photosensitive material and a photo initiator.

11 . The printed circuit board as claimed in claim 10 , wherein the photoresist material further comprises acrylate monomer, epoxy resin, inorganic filler, thermal curing agent, defoamer, diluent, thermal inhibitor, or a combination thereof.

12 . A method for manufacturing a biomass photosensitive material, comprising:
(1) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer; and (2) mixing the copolymer and (c) monomer with a single hydroxy group and a carbon-carbon double bond for a ring-opening addition reaction to form a biomass photosensitive material, wherein the (a) itaconic anhydride and the single hydroxy group of the (c) monomer with the single hydroxy group and the carbon-carbon double bond are reacted in the ring-opening addition reaction.

13 . The method as claimed in claim 12 , wherein the biomass photosensitive material includes a plurality of carbon-carbon double bonds and a plurality of carboxyl groups.

14 . The method as claimed in claim 12 , wherein the (a) itaconic anhydride and the (b) acrylate have a molar ratio of 1:0.8 to 1:5, and the (a) itaconic anhydride and the (c) the monomer with the single hydroxy group and the carbon-carbon double bond have a molar ratio of 1:0.2 to 1:1.

15 . The method as claimed in claim 12 , wherein the (b) acrylate comprises methyl methacrylate, butyl methacrylate, butyl acrylate, isooctyl acrylate, isobornyl acrylate, or a combination thereof.

16 . The method as claimed in claim 12 , wherein the (c) the monomer with the single hydroxy group and the carbon-carbon double bond comprises pentaerythritol triacrylate, 2-hydroxyethyl acrylate, or a combination thereof.

17 . The method as claimed in claim 12 , further comprising adding (d) polylactic acid into step (2) to react with the copolymer in the ring-opening addition reaction, wherein the (a) itaconic anhydride and a hydroxy group of the (d) polylactic acid are reacted in the ring-opening addition reaction.

18 . The method as claimed in claim 17 , wherein the (a) itaconic anhydride and the (d) poly lactic acid have a molar ratio of 1:0.005 to 1:0.7.

19 . The method as claimed in claim 12 , further comprising adding (e) water, alcohol, or a combination thereof into step (2) to react with the copolymer in the ring-opening addition reaction, wherein the (a) itaconic anhydride and a hydroxy group of the (e) water, alcohol, or a combination thereof are reacted in the ring-opening reaction.

20 . The method as claimed in claim 19 , wherein the (a) itaconic anhydride and the (e) water, alcohol, or a combination thereof have a molar ratio of 1:0.001 to 1:0.3.

Assignees

• Ind Tech Res Inst

Inventors

• Chen Man-Lin
• Lin Hsien-Kuang
• Chen Sue-May
• Chen Su-Huey
• Liu Yu-Lin

Classifications

• G03F7/0388 Primary

  with ethylenic or acetylenic bands in the side chains of the photopolymer · CPC title

• H05K1/02

  Details · CPC title

• H05K1/0313 Primary

  Organic insulating material · CPC title

• H05K3/287

  Photosensitive compositions · CPC title

• H05K1/0326

  containing O · CPC title