Manufacturing method of power-module substrate

Patent metadata

Field	Value
Publication number	US-2016001388-A1
Application number	US-201414768041-A
Country	US
Kind code	A1
Filing date	Feb 28, 2014
Priority date	Mar 7, 2013
Publication date	Jan 7, 2016
Grant date	—

Abstract

A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

First claim

What is claimed is:

1 . A manufacturing method of power-module substrate wherein a plurality of copper-circuit plates are bonded at intervals on a ceramic plate having an area wherein ceramic substrates can be formed abreast, and then the ceramic plate is divided between the copper-circuit plates so as to manufacture the power-module substrates, comprising:
a laminating step of forming bonding-material layers of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates on one of the ceramic plate or the plurality of copper-circuit plates, spreading temporal-stick material including polyethylene glycol as a major ingredient on the other of the ceramic plate or the plurality of copper-circuit plates, and temporary sticking the bonding-material layers and the copper-circuit plates in a state of laminating with positioning on the ceramic plate by the temporal-stick material; and a bonding step of bonding the ceramic plate and the copper-circuit plates by pressurizing and heating a laminated assembly thereof in a laminating direction.

2 . The manufacturing method of power-module substrate according to claim 1 , wherein:
the bonding-material layers are formed by spreading a paste on a surface of the ceramic plate; and the copper-circuit plates in which the temporal-stick material is spread are laminated respectively on the bonding-material layers on the ceramic plate in the laminating step.

3 . The manufacturing method of power-module substrate according to claim 1 , wherein at least one or more of the copper-circuit plates are formed by connecting circuit elements by bridge portions, and back surfaces of the bridge portions are formed as recessed portions from back surfaces of the circuit elements.

4 . The manufacturing method of power-module substrate according to claim 2 , wherein at least one or more of the copper-circuit plates are formed by connecting circuit elements by bridge portions, and back surfaces of the bridge portions are formed as recessed portions from back surfaces of the circuit elements.

Assignees

• Mitsubishi Materials Corp

Inventors

• Oohiraki Tomoya
• Oi Sotaro
• Nishikawa Kimihito
• Hayashi Hiromasa

Classifications

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• C04B37/026

  consisting of metals or metal salts · CPC title

• C04B2237/343

  Alumina or aluminates · CPC title