Pressure Sensor System

Patent metadata

Field	Value
Publication number	US-2015377734-A1
Application number	US-201414767044-A
Country	US
Kind code	A1
Filing date	Jan 20, 2014
Priority date	Feb 21, 2013
Publication date	Dec 31, 2015
Grant date	—

Abstract

A pressure sensor system having a pressure sensor chip is specified, which is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.

First claim

1 - 15 . (canceled)

16 . A pressure sensor system comprising:
a pressure sensor chip mounted on a mounting receptacle of a housing body comprising a ceramic material, the housing body having a pressure feed guided to the pressure sensor chip; wherein the housing body comprises a non-planar three-dimensional surface topography on a mounting side on which the sensor chip is mounted, wherein the housing body is a monolithic structure, and wherein a coefficient of thermal expansion of the housing body deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.

17 . The pressure sensor system according to claim 16 , wherein the pressure sensor chip is based on silicon.

18 . The pressure sensor system according to claim 16 , wherein the ceramic material comprises mullite.

19 . The pressure sensor system according to claim 16 , wherein the ceramic material comprises aluminum oxide, zirconium oxide, aluminum nitride, silicon carbide, and/or silicon nitride.

20 . The pressure sensor system according to claim 16 , the ceramic material consists of one or more selected from mullite, aluminum nitride, silicon carbide, and/or silicon nitride.

21 . The pressure sensor system according to claim 16 , wherein the coefficients of thermal expansion of the housing body and the pressure sensor chip deviate by less than 10% from one another in a temperature range of greater than or equal to −50° C. and less than or equal to 200° C.

22 . The pressure sensor system according to claim 16 , wherein the mounting receptacle is formed by a protrusion or a depression of the housing body and the pressure feed opens into the mounting receptacle.

23 . The pressure sensor system according to claim 16 , wherein the housing body comprises a pressure fitting and the pressure feed extends from the pressure fitting up to the pressure sensor chip.

24 . The pressure sensor system according to claim 16 , wherein a signal processing chip is mounted on a further mounting receptacle of the housing body.

25 . The pressure sensor system according to claim 16 , wherein the pressure sensor chip is mounted by a rigid connecting material directly on the mounting receptacle formed by a glass solder, a metallic solder, or an epoxy resin adhesive.

26 . The pressure sensor system according to claim 16 , wherein the housing body is three-dimensionally shaped and monolithically formed by a ceramic injection molding method.

27 . The pressure sensor system according to claim 16 , wherein the pressure sensor system comprises electrical connections on the housing body for the electrical connection of at least the pressure sensor chip, which comprise one or more of the following elements: wiring carrier, conductor tracks, and bond wires.

28 . The pressure sensor system according to claim 16 , wherein the pressure sensor chip is electrically contacted by bond wire connections covered with a polymer potting.

29 . The pressure sensor system according to claim 16 , wherein the pressure sensor system comprises a cover fastened on the housing body above the pressure sensor chip.

30 . The pressure sensor system according to claim 29 , wherein the cover is fastened on the housing body by a mechanical lock.

31 . A method of forming a pressure sensor system, the method comprising:
providing a pressure sensor chip; using a ceramic injection molding method or by an HTCC multi-layer method, forming a housing body having a monolithical structure and comprising a non-planar three-dimensional surface topography on a mounting side; and mounting the pressure sensor chip over the mounting side of the housing body, wherein the coefficient of thermal expansion of the housing body deviates from the coefficient of thermal expansion of the sensor chip by less than 30% in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.

32 . The method of claim 31 , wherein the housing body comprises mullite.

33 . The method of claim 31 , wherein forming the housing body comprises sintering at 1500° C. to 1750° C. in air.

34 . The method of claim 31 , wherein forming the housing body comprises fixing a cover on the housing body above the sensor chip.

35 . The method of claim 34 , wherein the cover is fastened on the housing by a mechanical lock.

Assignees

• Epcos Ag

Inventors

• Ihle Jan
• Peschka Andreas
• Hundertmark Bert
• Bohl Benjamin
• Ostrick Bernhard

Classifications

• G01L19/04 Primary

  Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} · CPC title

• G01L19/141 Primary

  Monolithic housings, e.g. molded or one-piece housings · CPC title

• G01L19/0681

  Protection against excessive heat · CPC title

• G01L19/0627

  Protection against aggressive medium in general · CPC title

• C04B35/64

  Burning or sintering processes (C04B33/32 takes precedence {; powder metallurgy B22F}) · CPC title