Multilayer electronic component and manufacturing method thereof
US-2015187486-A1 · Jul 2, 2015 · US
Multilayer inductor, and board having the same
US2015371754A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015371754-A1 |
| Application number | US-201414504084-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 1, 2014 |
| Priority date | Jun 24, 2014 |
| Publication date | Dec 24, 2015 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A multilayer inductor may include: a multilayer body including a plurality of insulation layers stacked therein and having a thickness greater than a width thereof; and an internal coil part formed in the multilayer body by electrically connecting a plurality of internal coil patterns disposed on the plurality of insulation layers. The internal coil part may be disposed to be biased toward one portion of the multilayer body from a central portion of the multilayer body in a thickness direction.
First claim
Opening claim text (preview).
What is claimed is: 1 . A multilayer inductor comprising: a multilayer body including a plurality of insulation layers stacked therein and having a thickness greater than a width thereof; and an internal coil part disposed in the multilayer body, a plurality of internal coil patterns being electrically connected and disposed on the plurality of insulation layers, wherein the internal coil part is disposed to be biased toward one portion of the multilayer body from a central portion of the multilayer body in a thickness direction. 2 . The multilayer inductor of claim 1 , wherein the multilayer body includes an active part including the internal coil part to form inductance, an upper cover part disposed on an upper portion of the active part in the thickness direction, and a lower cover part disposed on a lower portion of the active part in the thickness direction, the upper cover part having a thickness greater than that of the lower cover part. 3 . The multilayer inductor of claim 1 , wherein a distance between an upper portion of the internal coil part and an upper surface of the multilayer body is longer than a distance between a lower portion of the internal coil part and a lower surface of the multilayer body. 4 . The multilayer inductor of claim 1 , wherein a central portion of the internal coil part in the thickness direction is disposed below the central portion of the multilayer body in the thickness direction. 5 . The multilayer inductor of claim 1 , wherein the center of gravity of the multilayer body is disposed below the central portion of the multilayer body in the thickness direction. 6 . The multilayer inductor of claim 1 , wherein the insulation layers and the internal coil patterns are stacked in the thickness direction of the multilayer body. 7 . The multilayer inductor of claim 1 , wherein the insulation layers and the internal coil patterns are stacked in a length direction of the multilayer body. 8 . A board having a multilayer inductor, the board comprising: a printed circuit board having first and second electrode pads formed thereon; and a multilayer inductor mounted on the printed circuit board, wherein the multilayer inductor includes a multilayer body including a plurality of insulation layers stacked therein and having a thickness larger than a width thereof; and an internal coil part disposed in the multilayer body, a plurality of internal coil patterns being electrically connected and disposed on the plurality of insulation layers, the internal coil part being disposed to be biased toward one portion of the multilayer body from a central portion of the multilayer body in a thickness direction. 9 . The board of claim 8 , wherein the multilayer body includes an active part including the internal coil part to form inductance, an upper cover part disposed on an upper portion of the active part in the thickness direction, and a lower cover part disposed on a lower portion of the active part in the thickness direction, the upper cover part having a thickness greater than that of the lower cover part. 10 . The board of claim 8 , wherein a distance between an upper portion of the internal coil part and an upper surface of the multilayer body is longer than a distance between a lower portion of the internal coil part and a lower surface of the multilayer body. 11 . The board of claim 8 , wherein a central portion of the internal coil part in the thickness direction is disposed below the central portion of the multilayer body in the thickness direction. 12 . The board of claim 8 , wherein the center of gravity of the multilayer body is disposed below the central portion of the multilayer body in the thickness direction. 13 . The board of claim 8 , wherein the insulation layers and the internal coil patterns are stacked in the thickness direction of the multilayer body. 14 . The board of claim 8 , wherein the insulation layers and the internal coil patterns are stacked in a length direction of the multilayer body.
Assignees
Inventors
Classifications
associated with surface mounted components · CPC title
- H01F27/2804Primary
Printed windings · CPC title
on stacked layers · CPC title
Surface mounted devices · CPC title
Non-printed inductor · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2015371754A1 cover?
- A multilayer inductor may include: a multilayer body including a plurality of insulation layers stacked therein and having a thickness greater than a width thereof; and an internal coil part formed in the multilayer body by electrically connecting a plurality of internal coil patterns disposed on the plurality of insulation layers. The internal coil part may be disposed to be biased toward one …
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H01F27/2804. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Dec 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).