Articles with conductive micro-wire pattern

Patent metadata

Field	Value
Publication number	US-2015366057-A1
Application number	US-201514836052-A
Country	US
Kind code	A1
Filing date	Aug 26, 2015
Priority date	Dec 3, 2013
Publication date	Dec 17, 2015
Grant date	—

Abstract

Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity <5,000 Pascal-seconds at the temperature micro-channels formation and the micro-channels having an average width of less than or equal to 4 μm and an average depth to average width ratio that is greater than or equal to 1. The photocurable layer is exposed to curing ultraviolet radiation to form a pattern of photocured micro-channels and a conductive composition comprising metal nano-particles is formed in the photocured micro-channels. The conductive composition is cured in the pattern of photocured micro-channels to provide a pattern of conductive micro-wires in the pattern of photocured micro-channels on the transparent flexible substrate. Each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohms/sq.

First claim

1 . A device comprising a conductive article, the conductive article comprising a transparent flexible substrate and a pattern of conductive micro-wires disposed thereon in photocured micro-channels that have been formed by imprinting and curing a photocurable composition that has a viscosity of less than 5,000 Pascal-seconds at the temperature at which the micro-channels are formed, which conductive micro-wires have an average width of less than or equal to 4 μm and an average depth to average width ratio greater than 1, and each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohm/sq.

2 . The device of claim 1 , wherein the pattern of conductive micro-wires comprises at least one of silver, palladium, platinum, copper, and indium-tin oxide.

3 . The device of claim 2 wherein the pattern of conductive micro-wires comprises silver that has been electrolessly plated with copper, nickel, gold, platinum, or palladium.

4 . The device of claim 1 , wherein the photocured micro-channels and resulting conductive micro-wires have an average width of at least 0.5 μm and up to and including 4 μm.

5 . The device of claim 1 , wherein the photocured micro-channels have been formed from a photocurable composition comprising: a compound that generates an acid upon exposure to radiation of at least 190 nm and up to and including 500 nm, a multifunctional epoxy compound having an epoxy equivalent molecular weight of less than 1,000, and an epoxysilane oligomer that is represented by the following Structure (I):

wherein R and R 1 are independently substituted or unsubstituted alkyl groups, R 2 is a substituted or unsubstituted linear, branched, or cyclic alkyl group or an alkyl ether residue substituted with an epoxide, R 3 is hydrogen or a substituted or unsubstituted alkyl, and x+y≧2.

6 . The device of claim 1 , wherein the pattern of conductive micro-wires is connected to at least one electrical contact.

7 . The device of claim 1 , wherein the conductive article exhibits a haze of less than 10% and a light transmission of at least 80%.

8 . The device of claim 1 , wherein the conductive article exhibits a haze of less than 5% and a light transmission of at least 85%.

9 . The device of claim 1 , wherein the pattern of conductive micro-wires comprises at least silver, the average width of the micro-wires is at least 0.5 μm and less than or equal to 4 μm and the average depth to average width ratio is greater than 0.5 and up to and including 3.

Assignees

• Eastman Kodak Co

Inventors

• Wang Yongcai
• Lebens John Andrew
• Wright Mitchell Lawrence
• Cummings Julie A

Classifications

• G03F7/0035

  Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title