Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-2015279562-A1
Application number	US-201514674373-A
Country	US
Kind code	A1
Filing date	Mar 31, 2015
Priority date	Mar 31, 2014
Publication date	Oct 1, 2015
Grant date	—

Abstract

A multilayer ceramic electronic component having outer electrodes that each include an end-face outer electrode disposed on an end face of a ceramic multilayer body and side-face outer electrodes formed by a sputtering method on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode. A sputtering electrode layer of each of the side-face outer electrodes in contact with the ceramic multilayer body is composed of a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of −2.36 to −0.74 V, and an outermost sputtering electrode layer which is an outermost layer of each of the side-face outer electrodes is composed of at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi.

First claim

What is claimed is:

1 . A multilayer ceramic electronic component comprising:
a ceramic multilayer body having stacked ceramic layers and inner electrodes disposed between adjacent ceramic layers of the stacked ceramic layers; and first and second outer electrodes disposed on respective surfaces of the ceramic multilayer body, the first outer electrode being electrically connected to a first set of electrodes of the inner electrodes, and the second outer electrode being electrically connected to a second set of electrodes of the inner electrodes, wherein the first and second outer electrodes each include: an end-face outer electrode disposed on an end face of the ceramic multilayer body; and side-face outer electrodes on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode, and wherein each of the side-face outer electrodes include: (a) a first sputtered electrode layer in contact with the ceramic multilayer body, the first sputtered electrode layer including a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of −2.36 to −0.74 V, and (b) a second sputtered electrode layer which is an outermost layer constituting each of the side-face outer electrodes and which includes at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi.

2 . The multilayer ceramic electronic component according to claim 1 , wherein the metal contained in the first sputtered electrode layer is at least one selected from the group consisting of Mg, Al, Ti, W, and Cr.

3 . The multilayer ceramic electronic component according to claim 1 , further comprising a plating metal film on a surface of each of the first and second outer electrodes.

4 . The multilayer ceramic electronic component according to claim 2 , further comprising a plating metal film on a surface of each of the first and second outer electrodes.

5 . The multilayer ceramic electronic component according to claim 1 , wherein the end-face outer electrode contains Ni.

6 . The multilayer ceramic electronic component according to claim 5 , wherein the end-face outer electrode is a baked Ni electrode.

Assignees

• Murata Manufacturing Co

Inventors

• Nishisaka Yasuhiro
• Shimizu Kotaro

Classifications

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/1245

  containing also titanates · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title