Electronic devices with yielding substrates

Patent metadata

Field	Value
Publication number	US-2015236214-A1
Application number	US-201514704334-A
Country	US
Kind code	A1
Filing date	May 5, 2015
Priority date	Jun 29, 2010
Publication date	Aug 20, 2015
Grant date	—

Abstract

In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

First claim

What is claimed is:

1 .- 62 . (canceled)

63 . An electronic device comprising:
a light-emitting diode (LED) having first and second spaced-apart contacts; and a substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween, the substrate being at least one of (i) pliant in response to force and resilient or (ii) permanently deformable in response to force, wherein (i) the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces with an adhesive material without electrically bridging the traces or the contacts, (ii) stud bumps are not disposed between the contacts and traces, and (iii) the substrate comprises a local flexing or a local deformation for maintaining electrical contact between the contacts and traces during operation of the LED.

64 . The electronic device of claim 63 , wherein the substrate is (i) pliant in response to force and resilient but not (ii) permanently deformable in response to force.

65 . The electronic device of claim 63 , wherein the substrate is (i) permanently deformable in response to force but not (ii) pliant in response to force and resilient.

66 . The electronic device of claim 63 , wherein the substrate is (i) pliant in response to force and resilient and (ii) permanently deformable in response to force.

67 . The electronic device of claim 63 , wherein the adhesive material comprises a pressure-activated adhesive.

68 . The electronic device of claim 63 , wherein the substrate comprises a localized deformation between the first and second traces, whereby a distance between the first contact and the substrate is substantially equal to a distance between the second contact and the substrate.

69 . The electronic device of claim 63 , wherein the first and second spaced-apart contacts are substantially coplanar.

70 . The electronic device of claim 63 , wherein the first and second spaced-apart contacts are non-coplanar, and the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces notwithstanding the non-coplanarity of the first and second contacts.

71 . The electronic device of claim 63 , wherein the LED comprises a semiconductor material comprising at least one of GaN, AlN, InN, or an alloy or mixture thereof.

72 . The electronic device of claim 63 , wherein the adhesive material comprises a heat-activated and pressure-activated adhesive material.

73 . The electronic device of claim 63 , wherein the adhesive material comprises an anisotropic conductive adhesive (ACA) electrically connecting the first contact only to the first trace and the second contact only to the second trace.

74 . The electronic device of claim 73 , wherein a portion of the ACA is disposed in the gap and substantially isolates the first contact from the second contact.

75 . The electronic device of claim 63 , wherein the adhesive material comprises a substantially isotropic conductive adhesive electrically connecting the first contact only to the first trace and the second contact only to the second trace.

76 . The electronic device of claim 63 , wherein the LED extends across the gap between the first and second traces, and further comprising a second LED, proximate the LED, extending across the gap between the first and second traces.

77 . The electronic device of claim 63 , wherein the substrate is flexible and deformable.

78 . The electronic device of claim 63 , wherein a reflectivity of the substrate for a wavelength emitted by the LED is greater than 80%.

79 . The electronic device of claim 63 , wherein a transmittance of the substrate for a wavelength emitted by the LED is greater than 80%.

80 . The electronic device of claim 63 , wherein the LED emits white light having a color temperature in the range of 2000K to 7000K.

81 . The electronic device of claim 63 , further comprising a power supply electrically connected to the LED.

82 . The electronic device of claim 63 , further comprising an optical element arranged to transmit light emitted by the LED.

Assignees

• Tischler Michael A
• Schick Philippe
• Ashdown Ian
• Sheen Calvin Wade
• Jungwirth Paul

Inventors

• Tischler Michael A
• Schick Philippe
• Ashdown Ian
• Sheen Calvin Wade
• Jungwirth Paul

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title