Semiconductor device
US-9035441-B2 · May 19, 2015 · US
Semiconductor device
US2015228564A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015228564-A1 |
| Application number | US-201514692902-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 22, 2015 |
| Priority date | May 15, 2009 |
| Publication date | Aug 13, 2015 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
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A semiconductor device of the present invention includes a resin package, a semiconductor chip sealed in the resin package, and having first and second pads on a front surface, a lead integrated island sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of an opposite side to the one surface of which is partially exposed from a bottom surface of the resin package as a first pad connecting terminal for electrical connection between the first pad and outside and a back connecting terminal for electrical connection between the back surface of the semiconductor chip and outside separately from each other, and a lead formed separately from the lead integrated island, sealed in the resin package, one surface of which is connected with the second pad by a wire, and the other surface of an opposite side to the one surface of which is exposed from a bottom surface of the resin package as a second pad connecting terminal for electrical connection between the second pad and outside, and the semiconductor chip is, on the one surface of the lead integrated island, disposed at a position one-sided to the first pad connecting terminal side, and the first pad and the one surface of the lead integrated island are connected by a wire.
First claim
Opening claim text (preview).
1 . A semiconductor device comprising: a resin package; a semiconductor chip sealed in the resin package, and having first and second pads on a front surface; an island with projecting terminal sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of which is partially exposed from a bottom surface of the resin package as a first terminal; and a lead formed separately from the island with the projecting terminal, sea…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015228564A1 cover?
- A semiconductor device of the present invention includes a resin package, a semiconductor chip sealed in the resin package, and having first and second pads on a front surface, a lead integrated island sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of an opposite side to the one surface of which is partially exposed…
- Who is the assignee on this patent?
- Rohm Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W74/111. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Aug 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).