Methods and structures of integrated MEMS-CMOS devices
US-9276080-B2 · Mar 1, 2016 · US
Method and structure of mems wlcsp fabrication
US2015166330A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015166330-A1 |
| Application number | US-201414507177-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 6, 2014 |
| Priority date | Nov 12, 2010 |
| Publication date | Jun 18, 2015 |
| Grant date | — |
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Abstract
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A method for fabricating a MEMS-IC device structure can include receiving a CMOS substrate comprising a plurality of CMOS circuits and a surface portion. A MEMS substrate having at least one MEMS device can be received and coupled to the CMOS substrate. The MEMS substrate and the surface portion of the CMOS substrate can be encapsulated with a molding material, which forms a top surface. A first plurality of vias can be created in the molding material from the top surface to the surface portion of the CMOS substrate. A conductive material can be disposed within the first plurality of vias such that the conductive material is electrically coupled to a portion of the CMOS substrate. A plurality of interconnects can be formed from the conductive material to the top surface of the molding material and a plurality of solder balls can be formed upon these interconnects.
First claim
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What is claimed is: 1 . A method for fabricating a MEMS (Micro Electro Mechanical System) IC (Integrated Circuit) device comprising: receiving a CMOS substrate comprising a plurality of CMOS circuits and a first plurality of interconnection locations, wherein the first plurality of interconnection locations comprises a first set of locations and a second set of locations, wherein the CMOS substrate includes a surface portion, and wherein the first set of locations is disposed up…
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Electricity · mapped topic
Operations & Transport · mapped topic
- B81C1/00301Primary
Operations & Transport · mapped topic
- B81B7/007Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US2015166330A1 cover?
- A method for fabricating a MEMS-IC device structure can include receiving a CMOS substrate comprising a plurality of CMOS circuits and a surface portion. A MEMS substrate having at least one MEMS device can be received and coupled to the CMOS substrate. The MEMS substrate and the surface portion of the CMOS substrate can be encapsulated with a molding material, which forms a top surface. A firs…
- Who is the assignee on this patent?
- Mcube Inc
- What technology area does this patent fall under?
- Primary CPC classification B81C1/00301. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Jun 18 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).