Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module
US-2024260168-A1 · Aug 1, 2024 · US
Nano-copper solder for filling thermal vias
US2015114707A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114707-A1 |
| Application number | US-201414524894-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 27, 2014 |
| Priority date | Oct 28, 2013 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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Abstract
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A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a nanomaterial inside the one or more holes, and forming one or more filled holes on the electronic board. The nanomaterial can be nanocopper, which can be either push/pull into the holes on the electronic board or a combination of push and pull. The push/pull can be performed by using a mechanical device or by a person. A capping layer can be on both side of the via. The vias formed by using the nanomaterials provides a high efficient vertical heat transferring path from one side of the electronic board to the other side of the electronic board.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method of forming filled holes on an electronic board comprising: a) forming one or more holes on the electronic board; b) placing a nanomaterial inside the one or more holes; and c) forming one or more filled holes on the electronic board. 2 . The method of claim 1 , wherein the electronic board comprises a printed circuit board. 3 . The method of claim 1 , wherein the nanomaterial comprises nanocoppe…
Assignees
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Classifications
Electricity · mapped topic
- H05K1/0206Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015114707A1 cover?
- A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a nanomaterial inside the one or more holes, and forming one or more filled holes on the electronic board. The nanomaterial can be nanocopper, which can be either push/pull into the holes on the electronic board or a combination of push and pu…
- Who is the assignee on this patent?
- Flextronics Ap Llc
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0206. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).