Semiconductor device and mounting structure for semiconductor element
US-2024170353-A1 · May 23, 2024 · US
Electronic component package, electronic component series, and carrier tape
US2015114695A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114695-A1 |
| Application number | US-201414516624-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 17, 2014 |
| Priority date | Oct 31, 2013 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electronic component package comprising: a carrier tape in which a plurality of recess-shaped or substantially recess-shaped electronic component holding portions are provided in a base material made of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material; and a cover tape affixed to the one surface of the carrier tape so as to cover…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H05K1/183Primary
Electricity · mapped topic
- H05K5/0217Primary
Electricity · mapped topic
Electricity · mapped topic
- B65D73/02Primary
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US2015114695A1 cover?
- An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover ta…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H05K1/183. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).