Inflexible voltage reference circuit card, and method for manufacturing an inflexible voltage reference circuit card
US-2024215166-A1 · Jun 27, 2024 · US
Printed circuit board
US2015114688A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114688-A1 |
| Application number | US-201414522316-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 23, 2014 |
| Priority date | Oct 29, 2013 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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Abstract
Official abstract text for this publication.
Disclosed herein is a printed circuit board having an improved structure of a dummy part to improve warpage strength of the printed circuit board, the printed circuit board including: a plurality of insulating layers built-up therein, the plurality of insulating layers including copper clad layers; and a product zone and a dummy zone formed at a central part and along an edge part of the insulating layers, respectively, wherein the copper clad layers included in each insulating layer are arranged in the dummy zone at predetermined intervals in a longitudinal direction.
First claim
Opening claim text (preview).
What is claimed is: 1 . A printed circuit board comprising: a plurality of insulating layers built-up therein, the plurality of insulating layers including copper clad layers; and a product zone and a dummy zone formed at a central part and along an edge part of the insulating layers, respectively, wherein the copper clad layers included in each insulating layer are arranged in the dummy zone at predetermined intervals in a longitudinal direction. 2 .…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H05K1/0271Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K1/0306Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015114688A1 cover?
- Disclosed herein is a printed circuit board having an improved structure of a dummy part to improve warpage strength of the printed circuit board, the printed circuit board including: a plurality of insulating layers built-up therein, the plurality of insulating layers including copper clad layers; and a product zone and a dummy zone formed at a central part and along an edge part of the insula…
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0271. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).