Terminal unit
US-9215799-B2 · Dec 15, 2015 · US
Printed circuit board
US2015114686A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114686-A1 |
| Application number | US-201414515967-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 16, 2014 |
| Priority date | Oct 24, 2013 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A printed circuit board includes a first dielectric layer, a first ground layer, a second dielectric layer, a first power layer, a first via hole, and a first ground hole. A first signal line is laid on the first dielectric layer. A third signal line is laid on the second dielectric layer. The first and third signal lines are electrically connected to the first via hole. An extending direction of the first signal line on the first dielectric layer is opposite to an extending direction of the third signal line is laid on the second dielectric layer. A first void area is defined in the first ground layer around the first via hole. A second void area is defined in the first power layer around the first via hole. The first ground hole is outside the first void area and the second void area.
First claim
Opening claim text (preview).
What is claimed is: 1 . A printed circuit board comprising: a first dielectric layer with a first signal line laid thereon; a first ground layer; a second dielectric layer with a third signal line laid thereon; a first power layer; and a first via hole and a first ground hole extending through the first dielectric layer, the first ground layer, the second dielectric layer, and the first power layer, wherein, the first signal line and the third signal line are electrica…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H05K1/0213Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015114686A1 cover?
- A printed circuit board includes a first dielectric layer, a first ground layer, a second dielectric layer, a first power layer, a first via hole, and a first ground hole. A first signal line is laid on the first dielectric layer. A third signal line is laid on the second dielectric layer. The first and third signal lines are electrically connected to the first via hole. An extending direction …
- Who is the assignee on this patent?
- Hongfujin Prec Ind Wuhan, Hon Hai Prec Ind Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0213. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).