Integrated vapor chamber
US-2024240873-A1 · Jul 18, 2024 · US
Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
US2015114602A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114602-A1 |
| Application number | US-201414564265-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 9, 2014 |
| Priority date | May 6, 2011 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method of facilitating dissipation of heat from at least one electronic component, the method comprising: providing a cooling apparatus configured to coupled to at least one electronic component to be cooled, the cooling apparatus having a larger footprint size than the at least one electronic component to be cooled, and the cooling apparatus comprising a liquid-cooled cold plate comprising a thermally conductive material with a plurality of coolant-ca…
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Classifications
- H05K7/20336Primary
Electricity · mapped topic
Mechanical Engineering · mapped topic
- H05K7/20772Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015114602A1 cover?
- Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. …
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20336. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).