Flexible packaging for microelectronic devices

Patent metadata

Field	Value
Publication number	US-2015114451-A1
Application number	US-201314068189-A
Country	US
Kind code	A1
Filing date	Oct 31, 2013
Priority date	Oct 31, 2013
Publication date	Apr 30, 2015
Grant date	—

Abstract

An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

First claim

What is claimed is:

1 . A flexible microsystems enabled microelectronic device package comprising:
a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible package around the microelectronic device.

2 . The device package of claim 1 wherein the microelectronic device is a first photovoltaic solar cell, the device package further comprising a second photovoltaic solar cell.

3 . The device package of claim 1 wherein the substrate is a substantially flexible plastic substrate including circuitry for providing electrical connections to the microelectronic device.

4 . The device package of claim 1 wherein the encapsulation layer is an optically transparent encapsulating layer capable of transmitting light waves to the microelectronic device.

5 . The device package of claim 1 wherein the encapsulation layer comprises a silicone material.

6 . The device package of claim 1 wherein the protective layer comprises a moisture resistant material that protects the microelectronic device from moisture.

7 . The device package of claim 1 wherein the protective layer comprises a thermoplastic material.

8 . The device package of claim 1 wherein the protective layer comprises a first protective layer and a second protective layer positioned over opposing faces of the microelectronic device and a third protective layer positioned around a perimeter of the microelectronic device, between the first protective layer and the second protective layer.

9 . The device package of claim 1 wherein the reinforcing layer is coupled to a side of the protective layer opposite the microelectronic device.

10 . The device package of claim 1 wherein the reinforcing layer comprises a fiber reinforced material that is substantially abrasion and penetration resistant.

11 . The device package of claim 1 wherein a thickness of the package is less than 3 millimeters.

12 . A method of forming a flexible microsystems enabled microelectronic device package comprising:
encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

13 . The method of claim 12 wherein encapsulating comprises covering the microelectronic device and the substrate with an optically transparent encapsulating material.

14 . The method of claim 12 wherein the protective layer comprises a plurality of protective layers and sealing comprises:
covering a side of the encapsulation layer overlying the microelectronic device with a first protective layer;
covering an edge of the encapsulation layer with a second protective layer;
covering an exposed surface of the substrate with a third protective layer; and
sealing the first protective layer, the second protective layer and the third protective layer together.

15 . The method of claim 12 wherein coupling the protective layer to the reinforcing layer comprises:
applying an adhesive layer to the protective layer; and
bonding the reinforcing layer to the protective layer through the adhesive layer.

16 . The method of claim 12 wherein the encapsulation layer is selected from the group consisting of polydimethylsiloxane, ethylene vinyl acetate polyurethane, and polyolefin.

17 . The method of claim 12 wherein the protective layer is selected from the group consisting of polychlorotrifluoroethylene, polytetrafluoroethylene, ethylene chlorotrifluoroethylene, ethylene tetrafluoroethylene and polyvinylidene difluoride.

18 . The method of claim 12 wherein the reinforcing layer comprises a material selected from one of Vectran®, polyester, aramid, twaron, Kevlar®, Spectra®, polyethylene, carbon fiber, polyesters, nylon, acrylic Marko®, Marlan® and Nomex®.

19 . A system comprising:
a microelectronic device module comprising a plurality of photovoltaic cells electrically coupled to a substrate; an optically transparent and moisture resistant encapsulation module encapsulating the plurality of photovoltaic cells and the substrate; and a reinforcing layer coupled to the encapsulation module, wherein the reinforcing layer and the encapsulation module form a flexible package around the plurality of photovoltaic cells.

20 . The system of claim 19 wherein the encapsulation module comprises:
an optically transparent encapsulation layer surrounding the photovoltaic cells; and
a moisture resistant protective layer surrounding the optically transparent encapsulation layer.

Assignees

• Sandia Corp

Inventors

• Anderson Benjamin John
• Nielson Gregory N
• Cruz-Campa Jose Luis
• Okandan Murat
• Lentine Anthony L
• Resnick Paul J

Classifications

• H10F71/139

  using temporary substrates · CPC title

• H10F19/85

  Protective back sheets · CPC title

• Y02E10/50

  Photovoltaic [PV] energy · CPC title

• H10F19/80 Primary

  Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells · CPC title

• H01L31/0203 Primary

  Electricity · mapped topic