Photoelectric Conversion Module and Transmission Apparatus Using the Same

Patent metadata

Field	Value
Publication number	US-2015098675-A1
Application number	US-201414508418-A
Country	US
Kind code	A1
Filing date	Oct 7, 2014
Priority date	Oct 8, 2013
Publication date	Apr 9, 2015
Grant date	—

Abstract

There is provided a photoelectric conversion module that can be mounted two-dimensionally over a device board in a high-density, low-height manner and cooled efficiently with an easy-to-install collective-type radiator. In the photoelectric conversion module mounted over the device board, an optical connector is attached to that surface of an optical subassembly facing the device board. An electric connector has at least two sides thereof opened so that the optical transmission medium is threaded therethrough and extended through at least two facing sides of the optical subassembly. The optical transmission medium is thus extended between the optical subassembly and the device board in a vertically stacked manner.

First claim

What is claimed is:

1 . A photoelectric conversion module comprising:
an optical subassembly that has an optical device and an electronic circuit mounted over an electric wiring substrate, the optical device emitting or receiving an optical signal, the electronic circuit driving the optical device to convert an electric signal into the optical signal or amplifying the electric signal converted from the optical signal; an optical connector that permits optical coupling between the optical device and an optical transmission medium for transmitting the optical signal; and an electric connector that permits electric coupling between the electric wiring substrate and a device board; wherein the optical connector is mounted over that surface of the optical subassembly facing the device board; wherein the electric connector has at least two sides thereof opened so that the optical transmission medium is threaded therethrough and extended through at least two facing sides of the optical subassembly; and wherein the optical transmission medium is extended between the optical subassembly and the device board in a vertically stacked manner.

2 . The photoelectric conversion module according to claim 1 ,
wherein the electronic circuits having at least two channels are mounted over that surface of the electric wiring substrate opposite to the surface thereof facing the device board; and wherein at least either of the optical devices having at least two channels for emitting or receiving the optical signal is mounted over that surface of the electric wiring substrate different from the surface thereof carrying the electronic circuits.

3 . The photoelectric conversion module according to claim 1 ,
wherein the optical device for emitting or receiving the optical signal is an array of light emitters or an array of photodetectors, each of the arrays having at least two channels; wherein the optical connector is an array of optical connectors furnished with the optical transmission medium having at least four channels; and wherein at least either the array of light emitters or the array of photodetectors is optically coupled with an array of optical fibers.

4 . The photoelectric conversion module according to claim 2 ,
wherein, of the electronic circuits mounted over the electric wiring substrate, the electronic circuit for driving the optical device to convert the electric signal into the optical signal and the electronic circuit for amplifying the electric signal converted from the optical signal are installed in a manner facing one another across a straight line connecting light emitting parts or light receiving parts of at least two of the optical devices.

5 . The photoelectric conversion module according to claim 2 ,
wherein a radiator for heat dissipation of the electronic circuits is mounted over the same surface of the electric wiring substrate carrying the electronic circuits; and wherein a metal pattern coupled electrically with the electronic circuits and ground is formed over the electric wiring substrate, the radiator being in contact with the metal pattern.

6 . The photoelectric conversion module according to claim 3 ,
wherein the array of light emitters is mounted over that surface of the electric wiring substrate facing the device board, and the array of photodetectors is mounted over that surface of the electric wiring substrate opposite to the surface thereof facing the device board.

7 . The photoelectric conversion module according to claim 1 ,
wherein the electric connector is attached to one side of the optical subassembly so that the electric connector is substantially in parallel with the optical transmission medium.

8 . The photoelectric conversion module according to claim 1 ,
wherein the electric connectors are attached to the two facing sides of the optical subassembly so that the electric connectors are substantially in parallel with the optical transmission medium.

9 . The photoelectric conversion module according to claim 1 ,
wherein the electric connector is structured to surround the optical connector; and wherein at least two facing sides of the electric connector have at least two window regions through which the optical transmission medium is threaded.

10 . The photoelectric conversion module according to claim 9 ,
wherein the electric connector has electric pads arranged two-dimensionally thereon.

11 . The photoelectric conversion module according to claim 1 ,
wherein an electric connector socket to which the optical connector is fixed is furnished on the device board; and wherein the electric connector and an optical connector socket are furnished on the optical subassembly so that the electric connector and the optical connector are coupled collectively.

12 . The photoelectric conversion module according to claim 1 ,
wherein an optical coupling part for permitting optical coupling between the optical device and the optical transmission medium includes a first lens, an optical connector socket having a lens holder for holding the first lens, and an optical connector having a second lens and an optical path changing mirror; and wherein the light emitted from or incident on the second lens is substantially parallel light.

13 . The photoelectric conversion module according to claim 12 ,
wherein the thickness of the optical connector is varied among a plurality of photoelectric conversion modules.

14 . A transmission apparatus comprising the photoelectric conversion modules according to claim 1 ,
wherein the photoelectric conversion modules are arranged two-dimensionally over the device board; and wherein a water-cooled or air-cooled collective-type radiator is mounted over that surface of the optical subassembly opposite to the surface thereof carrying the optical connector.

Assignees

• Hitachi Metals Ltd

Inventors

• Ishiyama Kazuo
• Matsuoka Yasunobu
• Arimoto Hideo
• Chujo Norio
• Sunaga Yoshinori
• Yamazaki Kinya
• Ishigami Yoshiaki

Classifications

• G02B6/12

  of the integrated circuit kind (electric integrated circuits H10B, H10D84/00 - H10D89/00, H10F19/00, H10F39/00, H10H29/00, H10K19/00, H10K39/00, H10K59/00, H10N19/00, H10N39/00, H10N59/00, H10N69/00, H10N79/00, H10N89/00) · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4214 Primary

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/4268

  Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47) · CPC title

• G02B6/423

  using guiding surfaces for the alignment · CPC title