Flux-free Joining of Aluminium Composite Materials
US-2016325367-A1 · Nov 10, 2016 · US
Reducing formation of oxide on solder
US2015076216A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015076216-A1 |
| Application number | US-201414468660-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 26, 2014 |
| Priority date | Nov 5, 2010 |
| Publication date | Mar 19, 2015 |
| Grant date | — |
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Abstract
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In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the solder. In certain embodiments, a method comprises depositing solder outwardly from a substrate, removing metal oxide from the substrate, and depositing a capping layer outwardly from the substrate to at least reduce reoxidation of the solder.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method, comprising: receiving a first substrate into a first chamber having an interior space substantially sealed from an environment external to the first chamber, wherein the first substrate comprises a portion of solder formed therein; and performing all of the following actions while the first substrate is disposed within the first chamber: plasma cleaning the first substrate under substantial vacuum conditions, a first time; depositing a cap…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2015076216A1 cover?
- In certain embodiments, a system includes a deposition system and a plasma/bonding system. The deposition system deposits a solder outwardly from a substrate of a number of substrates. The plasma/bonding system comprises a plasma system configured to plasma clean the substrate and a bonding system configured to bond the substrates. The plasma/bonding system at least reduces reoxidation of the s…
- Who is the assignee on this patent?
- Raytheon Co
- What technology area does this patent fall under?
- Primary CPC classification B23K1/206. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Mar 19 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).