Method of making metal substrates with structures formed therein
US-2024404922-A1 · Dec 5, 2024 · US
Leadframe and the method to fabricate thereof
US2015027770A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015027770-A1 |
| Application number | US-201414337232-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 22, 2014 |
| Priority date | Jul 23, 2013 |
| Publication date | Jan 29, 2015 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.
First claim
Opening claim text (preview).
What is claimed is: 1 . A leadframe, comprising: a first lead and a second lead; a first conductive pillar formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar; and a second conductive pillar formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to fo…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2015027770A1 cover?
- The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first con…
- Who is the assignee on this patent?
- Cyntec Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/095. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jan 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).