Method and system for thermomechanically decoupling heatsink

Patent metadata

Field	Value
Publication number	US-2015000868-A1
Application number	US-201313931098-A
Country	US
Kind code	A1
Filing date	Jun 28, 2013
Priority date	Jun 28, 2013
Publication date	Jan 1, 2015
Grant date	—

Abstract

A structure and method of mounting a heat sink having a body and mounting points configured so as to connect to a mounting medium, at least one of the mounting points being configured to allow movement in a thermally-induced expansion direction.

First claim

1 . A heat sink comprising:
a body; and mounting points configured so as to connect to a mounting medium; wherein at least one of the mounting points is configured to allow movement in a thermally-induced expansion direction.

2 . A heat sink according to claim 1 , wherein the mounting points include:
a mounting portion of the body; and a mounting member configured to connect the mounting portion to the mounting medium.

3 . A heat sink according to claim 2 , wherein the mounting member includes a flexural post which has a stiffness in the thermally-induced expansion direction less than a stiffness in a direction orthogonal to the thermally-induced expansion direction, respectively.

4 . A heat sink according to claim 2 , wherein the mounting member comprises a split-post pin having a space between split posts thereof so as to allow the mounting portion to move in the thermally-induced expansion direction.

5 . A heat sink according to claim 2 , wherein the mounting member comprises a shaft including a non-cylindrical flexing portion between two cylindrical portions.

6 . A heat sink according to claim 5 , wherein the non-cylindrical flexing portion includes:
a plurality of flexing parts; and a dampening material disposed on at least one of the plurality of flexing parts.

7 . A heat sink according to claim 5 , wherein the flexing portion is oriented such that a stiffness in a direction oriented along the thermally-induced expansion direction at the mounting member is less than a stiffness along an other direction at the mounting member.

8 . A heat sink according to claim 2 , wherein at least one of the mounting portions includes through a hole which is elongated in the thermally-induced expansion direction so as to allow the mounting portion to move relative to the mounting member.

9 . A heat sink according to claim 2 , wherein at least one of the mounting portions includes a slot cut in a Y-direction and so as to provide compliance in an X-direction.

10 . A heat sink according to claim 8 , wherein at least an other one of the mounting portions includes a non-slip connection.

11 . A heat sink according to claim 8 , wherein a dampening material is disposed in the through hole.

12 . A heat sink according to claim 1 , wherein the body comprises an in-line heat sink,
wherein at least an other one of the mounting points is configured to inhibit movement in the thermally-induced expansion direction, wherein the thermally-induced expansion direction extends along an X-axis, and wherein the mounting points are configured so as to inhibit movement along a Y-axis.

13 . A heat sink according to claim 5 , wherein the non-cylindrical flexing portion includes a rectangular portion of the mounting member.

14 . A heat sink according to claim 5 , wherein the non-cylindrical flexing portion includes two flexing parts, the flexing parts comprising a material different from a material of the two cylinder portions.

15 . (canceled)

16 . (canceled)

17 . (canceled)

18 . A heat sink to be mounted on a printed circuit board, the heat sink comprising:
a body; and flexural posts attached to the body so as to decouple thermally induced expansion.

19 . The heat sink according to claim 18 , wherein flexure orientation of the flexure posts is determined by a thermally-induced expansion direction at a mounting point of the flexural posts on the body.

20 . The heat sink according to claim 18 , further comprising at least one no-slip mounting post.

Assignees

• IBM

Inventors

• Sri-Jayantha Sri M
• Mcvicker Jr Gerard
• Khanna Jr Vijayeshwar D

Classifications

• Y10T29/49826

  Assembling or joining · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• B23P15/26 Primary

  heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title