Display module and substrate thereof having improved binding reliability of substrate and flexible circuit board

Patent metadata

Field	Value
Publication number	US-12599024-B2
Application number	US-202217901563-A
Country	US
Kind code	B2
Filing date	Sep 1, 2022
Priority date	May 6, 2022
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

A module and a substrate are provided in the present disclosure. The module includes an array substrate and a flexible circuit board. The array substrate includes a binding region including a first binding region and a second binding region; and in the binding region, the flexible circuit board is bound with the array substrate. In the first binding region, the array substrate includes a first conductive soldering pad; the flexible circuit board includes a second conductive soldering pad; and the first conductive soldering pad is electrically connected to the second conductive soldering pad. In the second binding region, the array substrate includes one or more of first soldering elements; the flexible circuit board includes one or more of second soldering elements; a first soldering element of the one or more of first soldering elements is fixed with a second soldering element of the one or more of second soldering elements.

First claim

What is claimed is:

1 . A module, comprising:
an array substrate and a flexible circuit board, wherein:
the array substrate includes a binding region; and the binding region includes a first binding region and a second binding region; and in the binding region, the flexible circuit board is bound with the array substrate through a conductive adhesive;
in the first binding region, the array substrate includes a first conductive soldering pad; the flexible circuit board includes a second conductive soldering pad; and the first conductive soldering pad is electrically connected to the second conductive soldering pad, wherein an opening is provided above the first conductive soldering pad to expose the first conductive soldering pad, at least a part of the conductive adhesive is filled into the opening such that the first conductive soldering pad directly binds to the at least a part of the conductive adhesive; and
in the second binding region, the array substrate includes one or more first soldering elements; the flexible circuit board includes one or more second soldering elements; a first soldering element of the one or more of first soldering elements is fixed with a second soldering element of the one or more of second soldering elements; and at least one first soldering element of the one or more of first soldering elements is insulated from the one or more of second soldering elements,
wherein at least one first soldering element of the one or more of first soldering elements includes a groove, and at least a part of the conductive adhesive is in the groove.

2 . The module according to claim 1 , wherein:
at least one first soldering element of the one or more of first soldering elements is free of a conductive material.

3 . The module according to claim 1 , wherein:
in the binding region, the array substrate includes a substrate, at least a metal layer, and an insulating layer on a side of the metal layer away from the substrate; and the groove is at least at the insulating layer.

4 . The module according to claim 3 , wherein:
in the first binding region, the first conductive soldering pad is at the metal layer, the insulating layer includes the opening; and the opening and the groove are formed using a same process.

5 . The module according to claim 1 , wherein:
each first soldering element is free of a conductive material, each first soldering element includes a groove, and at least a part of the conductive adhesive is filled in the groove.

6 . The module according to claim 1 , wherein:
at least one second soldering element of the one or more of second soldering elements is free of a conductive material.

7 . The module according to claim 1 , wherein:
the array substrate includes a substrate; the substrate includes a plurality of conductive parts; each conductive part is electrically connected to at least two first soldering elements, respectively; and different conductive parts are connected to different first soldering elements.

8 . The module according to claim 1 , wherein:
the one or more of first soldering elements are electrically connected through a same conductive part.

9 . The module according to claim 1 , wherein:
a first soldering element of the one or more of first soldering elements includes at least one layer of a conductive metal, and a conductive part is disposed in a same layer as the at least one layer of the conductive metal.

10 . The module according to claim 9 , wherein:
the substrate further include a disposed first wiring; the first wiring extends along a first direction; a connecting line is between the binding region and the first wiring; and a length of the connecting line is greater than a distance between the first conductive soldering pad and the first wiring or a distance between a first soldering element of the one or more of first soldering elements and the first wiring.

11 . The module according to claim 10 , wherein:
at least a part of the connecting line includes a serpentine line segment.

12 . The module according to claim 10 , wherein:
at least a part of the connecting line includes a first line segment and a second line segment that are electrically connected with each other; the first line segment extends along a second direction and is electrically connected to the first soldering element; and the second line segment extends along the first direction and is electrically connected to the first wiring, wherein the second direction intersects the first direction.

13 . The module according to claim 7 , wherein:
the array substrate is obtained by cutting the substrate; the substrate includes a first cutting line; and the first cutting line is between the binding region and the first wiring; and in the binding region, the flexible circuit board is bound with the array substrate through a conductive adhesive.

14 . The module according to claim 1 , wherein:
the flexible circuit board further includes a first led-out line and a second led-out line, wherein a first end of the first led-out line is electrically connected to a fourth soldering element, and a first end of the second led-out line is electrically connected to a ground soldering element; and the first led-out line and the second led-out line are wired along at least a part of an outer edge of the flexible circuit board; and a second end of the first led-out line is electrically connected to a second end of the second led-out line.

15 . The module according to claim 14 , wherein:
one or more of fourth soldering elements are electrically connected to the second led-out line through different first led-out lines.

Assignees

• Wuhan Tianma Micro Electronics Co Ltd
• Wuhan Tianma Microelectronics Co Ltd Shanghai Branch

Inventors

• Wei Qibing
• Zhang Peng
• Zhou Xingyao
• Liu Wei

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/344

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title