Display device and method for manufacturing display device

Patent metadata

Field	Value
Publication number	US-12598808-B2
Application number	US-202118267676-A
Country	US
Kind code	B2
Filing date	Dec 2, 2021
Priority date	Dec 21, 2020
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

A display device includes a substrate including a first surface, a side surface, and a second surface opposite to the first surface, a pixel unit located on the first surface and including a light emitter, a first connection pad adjacent to an edge on the first surface and electrically connected to the pixel unit, a second connection pad adjacent to the edge on the second surface, and a side wire extending from the first surface through the side surface to the second surface and connecting the first connection pad and the second connection pad. The first connection pad and the second connection pad have different sizes.

First claim

The invention claimed is:

1 . A display device, comprising:
a substrate including a first surface, a side surface, and a second surface opposite to the first surface; a pixel unit on the first surface, the pixel unit including a light emitter; a first connection pad adjacent to an edge on the first surface, the first connection pad being electrically connected to the pixel unit; a second connection pad adjacent to the edge on the second surface; and a side wire extending from the first surface through the side surface to the second surface, the side wire connecting the first connection pad and the second connection pad, wherein the second connection pad is larger than the first connection pad and includes an extension extending in a direction along the edge.

2 . The display device according to claim 1 , wherein
the second connection pad is longer than the first connection pad in a direction along the edge.

3 . The display device according to claim 2 , wherein
the first connection pad is between two ends of the second connection pad in the direction along the edge as viewed in a plan view.

4 . The display device according to claim 1 , wherein
the second connection pad is longer than the first connection pad in a direction intersecting with a direction along the edge.

5 . The display device according to claim 1 , wherein
the second connection pad overlaps the first connection pad as viewed in the plan view.

6 . The display device according to claim 1 , wherein
the first connection pad is thicker than the second connection pad.

7 . The display device according to claim 1 , wherein
the first connection pad has a higher conductivity than the second connection pad.

8 . The display device according to claim 1 , wherein
a width in a portion of the side wire connected to the second connection pad is greater than a width in a portion of the side wire connected to the first connection pad.

9 . The display device according to claim 8 , wherein
the side wire from the portion connected to the first connection pad to the portion connected to the second connection pad increases in width.

10 . The display device according to claim 1 , wherein
a thickness in a portion of the side wire connected to the first connection pad is greater than a thickness in a portion of the side wire connected to the second connection pad.

11 . The display device according to claim 1 , wherein
the side wire includes a thicker portion thicker than another portion of the side wire, and the thicker portion is in a portion of the side wire corresponding to the side surface of the substrate.

12 . The display device according to claim 1 , wherein
the light emitter is a micro-light-emitting diode.

13 . A method for manufacturing a display device, the method comprising:
preparing a mother substrate including a first surface, a second surface opposite to the first surface, and a plurality of display device areas on the first surface; forming a plurality of pixel areas on each of the plurality of display device areas; forming a first connection pad on a portion adjacent to an edge on each of the plurality of display device areas; forming a second connection pad on a portion adjacent to the edge on the second surface, the second connection pad being larger than the first connection pad and including an extension extending in a direction along the edge; cutting the mother substrate along the edge of each of the plurality of display device areas to form display device substrates; and forming, on each of the display device substrates, a side wire extending from the first surface through a cut surface being a side surface of each of the display substrates to the second surface to connect the first connection pad and the second connection pad.

14 . The method according to claim 13 , wherein
cutting the mother substrate includes irradiating the second surface with a laser beam along the edge to cut the mother substrate.

15 . The method according to claim 13 , wherein
forming the side wire includes forming a side wire including a stack of a plurality of layers.

Assignees

• Kyocera Corp

Inventors

• Ito Hiroaki
• Hasegawa Nobuyuki
• Haraguchi Fumiaki

Classifications

• H10W90/00

  Package configurations · CPC title

• H10K59/131

  Interconnections, e.g. wiring lines or terminals · CPC title

• H10D86/021

  of multiple TFTs · CPC title

• H10D86/60

  wherein the TFTs are in active matrices · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title