Locking tensioner cooling assembly for pluggable electronic component

Patent metadata

Field	Value
Publication number	US-12598692-B2
Application number	US-202217697909-A
Country	US
Kind code	B2
Filing date	Mar 17, 2022
Priority date	Mar 17, 2022
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

An apparatus is described. The apparatus includes a cooling assembly. The cooling assembly includes a cooling mass; a first heat spreader; a second heat spreader; a spring element; and, hinge components to form a hinge that the first and second heat spreaders rotate about. The spring element to apply a force to the first and second heat spreaders that causes the first and second heat spreaders to rotate about the hinge toward a circuit board located between the first and second heat spreaders.

First claim

The invention claimed is:

1 . An apparatus, comprising:
a cooling assembly comprising i), ii), iii), iv), v), and vi) below:
i) a cooling mass;
ii) a first heat spreader;
iii) a second heat spreader;
iv) a spring element to be coupled to the first and the second heat spreaders;
v) a hinge component to form a hinge that the first and the second heat spreaders rotate about, the spring element to apply a force to the first and the second heat spreaders that causes the first and the second heat spreaders to rotate about the hinge toward a circuit board located between the first and the second heat spreaders wherein a first end of the first heat spreader comprises an angled support arm that couples to the cooling mass and a first end of the second heat spreader also comprises an angled support arm that couples to the cooling mass; and
vi) a wedge element, the wedge element to be inserted between the first and the second heat spreaders to induce rotation of the first and the second heat spreaders toward the circuit board.

2 . The apparatus of claim 1 wherein the cooling mass comprises a heat sink.

3 . The apparatus of claim 1 wherein the cooling mass comprises at least one of a) and b) below:
a) a liquid cooling cold plate;
b) a vapor chamber.

4 . The apparatus of claim 1 wherein the circuit board is a dual in-line memory module (DIMM) circuit board.

5 . The apparatus of claim 1 wherein the wedge element is integrated with the cooling mass.

6 . The apparatus of claim 1 wherein the spring element comprises a U clip.

7 . An apparatus, comprising:
a pluggable module, the pluggable module comprising a circuit board, the circuit board comprising a first side having a first semiconductor chip package and a second, opposite side having a second semiconductor chip package, the pluggable module comprising a connector, the connector connecting the pluggable module into a system; a cooling assembly comprising i), ii), iii), iv), v), and vi) below:
i) a cooling mass;
ii) a first heat spreader that is thermally coupled to the first semiconductor chip package on a first side of the circuit board;
iii) a second heat spreader that is thermally coupled to the second semiconductor chip package on a second side of the circuit board that is opposite the first side;
iv) a spring element coupled to the first and the second heat spreaders;
v) a hinge, the first heat spreader pressed against the first semiconductor chip package and the second heat spreader pressed against the second semiconductor chip package in response to rotational forces about the hinge induced by the spring element wherein a first end of the first heat spreader comprises an angled support arm that couples to the cooling mass and a first end of the second heat spreader also comprises an angled support arm that couples to the cooling mass; and
vi) a wedge element, the wedge element to be inserted between the first and the second heat spreaders to induce rotation of the first and the second heat spreaders toward the circuit board.

8 . The apparatus of claim 7 wherein the pluggable module is a dual in-line memory module (DIMM).

9 . The apparatus of claim 7 wherein the cooling mass comprises a heat sink.

10 . The apparatus of claim 7 wherein the cooling mass comprises one of a) and b) below:
a) a liquid cooling cold plate;
b) a vapor chamber.

11 . The apparatus of claim 7 wherein the cooling mass is mounted directly to the first and the second heat spreaders.

12 . The apparatus of claim 7 wherein the spring element comprises one or more U clips.

13 . An apparatus, comprising:
a wedge element; a first heat spreader to be placed in thermal contact with a semiconductor chip package on a first side of a circuit board, the first heat spreader comprising a first hinge component; and, a second heat spreader to be placed in thermal contact with a second semiconductor chip package on a second, opposite side of the circuit board, the second heat spreader comprising a second hinge component, the first and second hinge components to form a hinge, the first and the second heat spreaders to rotate about the hinge toward the circuit board in response to the wedge element being inserted between the first and the second heat spreaders.

14 . The apparatus of claim 13 also including a cooling mass wherein the cooling mass comprises a heat sink.

15 . The apparatus of claim 13 also including a cooling mass wherein the cooling mass comprises one of a) and b) below:
a) a liquid cooling cold plate;
b) a vapor chamber.

16 . The apparatus of claim 13 wherein the circuit board is a dual in-line memory (DIMM) circuit board.

17 . The apparatus of claim 13 wherein the apparatus further comprises a spring element, the spring element to be coupled to both the first and the second heat spreaders to induce rotation of the heat spreaders about the hinge toward the circuit board.

18 . The apparatus of claim 17 wherein the spring element comprises a U clip.

Assignees

• Intel Corp

Inventors

• Subrahmanyam Prabhakar
• Sprenger Mark E

Classifications

• H05K7/2049 Primary

  Pressing means used to urge contact, e.g. springs · CPC title

• H05K2201/10159

  Memory · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title