Electronic device including antenna

Patent metadata

Field	Value
Publication number	US-12597699-B2
Application number	US-202418819286-A
Country	US
Kind code	B2
Filing date	Aug 29, 2024
Priority date	Jul 18, 2023
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

An electronic device is provided. The electronic device includes a housing, an antenna structure disposed in the housing, wherein the antenna structure includes a substrate including a first substrate surface, a second substrate surface facing away from the first substrate surface, and a ground layer disposed between the first substrate surface and the second substrate surface, a first conductive patch including a plurality of sub-patches arranged to correspond to the ground layer, and a second conductive patch disposed between a first sub-patch and a second sub-patch among the plurality of sub-patches of the first conductive patch when viewed from above the first substrate surface, and a wireless communication circuit configured to transmit or receive a first wireless signal in a first frequency band through the plurality of sub-patches of the first conductive patch and to transmit or receive a second wireless signal in a second frequency band through the second conductive patch. The electronic device further includes a first non-conductive area disposed in a position overlapping at least a portion of the second conductive patch when viewed from above the first substrate surface.

First claim

What is claimed is:

1 . An electronic device comprising:
a housing; an antenna structure disposed in the housing, the antenna structure comprising; a substrate including a first substrate surface, a second substrate surface facing away from the first substrate surface, and a ground layer disposed between the first substrate surface and the second substrate surface, a first conductive patch including a plurality of sub-patches arranged to correspond to the ground layer, and a second conductive patch disposed between a first sub-patch and a second sub-patch among the plurality of sub-patches of the first conductive patch when viewed from above the first substrate surface; and a wireless communication circuit configured to transmit or receive a first wireless signal in a first frequency band through the plurality of sub-patches of the first conductive patch and to transmit or receive a second wireless signal in a second frequency band through the second conductive patch, wherein the electronic device comprises a first non-conductive area disposed in a position overlapping at least a portion of the second conductive patch when viewed from above the first substrate surface.

2 . The electronic device of claim 1 , wherein the first non-conductive area is provided through omission of a portion of the ground layer.

3 . The electronic device of claim 1 , wherein the first non-conductive area has a first length along an edge of the substrate and a second length in a direction perpendicular to the first length.

4 . The electronic device of claim 3 , wherein the second length is greater than λ/4 based on the first frequency band.

5 . The electronic device of claim 3 , wherein the second frequency band is determined by the second length of the first non-conductive area.

6 . The electronic device of one of claim 3 , wherein the second frequency band is determined by the first length of the first non-conductive area.

7 . The electronic device of claim 1 , wherein the first conductive patch includes a circular polarization antenna.

8 . The electronic device of claim 1 ,
wherein the second conductive patch comprises at least one slot, and wherein the second frequency band is determined based on a shape of the at least one slot.

9 . The electronic device of claim 1 ,
wherein the housing comprises: a front surface cover, a rear surface cover facing away from the front surface cover, and a side surface member surrounding a space between the front surface cover and the rear surface cover and at least partially exposed outside of the electronic device, and wherein the antenna structure is disposed such that the first substrate surface faces the rear surface cover.

10 . The electronic device of claim 9 ,
wherein at least a portion of the side surface member comprises a conductive portion, and wherein the wireless communication circuit is configured to transmit or receive at least one of the first wireless signal in the first frequency band or the second wireless signal in the second frequency band via the conductive portion.

11 . The electronic device of claim 10 , wherein the second conductive patch and the conductive portion are configured to operate as a diversity antenna in the second frequency band via the wireless communication circuit.

12 . The electronic device of claim 10 , wherein the first conductive patch and the conductive portion are configured to operate as a diversity antenna in the first frequency band via the wireless communication circuit.

13 . The electronic device of claim 1 ,
wherein the first sub-patch and the second sub-patch are arranged side by side along a first direction, and wherein the first conductive patch further includes a third sub-patch disposed to be spaced apart from the first sub-patch in a second direction perpendicular to the first direction.

14 . The electronic device of claim 13 ,
wherein the antenna structure includes a third conductive patch disposed between the first sub-patch and the third sub-patch, and wherein the wireless communication circuit is configured to transmit or receive the second wireless signal in the second frequency band via the third conductive patch.

15 . The electronic device of claim 14 , further comprising:
a second non-conductive area disposed in a position overlapping the third conductive patch when viewed from above the first substrate surface.

16 . The electronic device of claim 1 , wherein at least another portion of the second conductive patch is in a position overlapping the ground layer when viewed from above the first substrate surface.

17 . The electronic device of claim 16 ,
wherein at least one dielectric layer of the substrate is disposed between the ground layer and the plurality of sub-patches of the first conductive patch, and wherein the at least one dielectric layer of the substrate is disposed between the ground layer and the at least the another portion of the second conductive patch overlapping the ground layer when viewed from above the first substrate surface.

18 . The electronic device of claim 1 ,
wherein the substrate includes a plurality of dielectric layers, and wherein the plurality of sub-patches of the first conductive patch are disposed on a different dielectric layer of the plurality of dielectric layers than the second conductive patch is disposed on.

19 . The electronic device of claim 1 , wherein the plurality of sub-patches of the first conductive patch and the second conductive patch are disposed between the first substrate surface and the second substrate surface.

20 . The electronic device of claim 1 , wherein the second conductive patch operates as a monopole antenna via the first non-conductive area.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Yun Sumin
• Kim Hosaeng
• Park Seongjin
• Lee Hyunjeong
• Lee Hyungjoo

Classifications

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q9/0492

  circularly polarised · CPC title

• H04M1/0216 Primary

  Foldable in one direction, i.e. using a one degree of freedom hinge · CPC title

• H01Q1/523

  between antennas of an array · CPC title

• H01Q21/0075

  Stripline fed arrays (H01Q21/065 takes precedence) · CPC title