Electronic device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12593399-B2
Application number	US-202318536250-A
Country	US
Kind code	B2
Filing date	Dec 12, 2023
Priority date	Jan 5, 2023
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

An electronic device and a method of manufacturing the electronic device are provided. The method of manufacturing the electronic device includes the following steps: providing a circuit board; performing a first pre-bending step on the circuit board so that the circuit board is bent to have a first radius of curvature; providing a back frame having a second radius of curvature; attaching the circuit board having the first radius of curvature to the back frame through an adhesive. A difference between the first radius of curvature and the second radius of curvature is within 10%.

First claim

What is claimed is:

1 . A method of manufacturing an electronic device, comprising:
providing a circuit board; performing a first pre-bending step on the circuit board so that the circuit board is bent to have a first radius of curvature; providing a back frame having a second radius of curvature; and attaching the circuit board having the first radius of curvature to the back frame through an adhesive, wherein a difference between the first radius of curvature and the second radius of curvature is within 10%.

2 . The method of manufacturing the electronic device according to claim 1 , wherein the adhesive is a patterned adhesive.

3 . The method of manufacturing the electronic device according to claim 1 , wherein the first pre-bending step comprises:
configuring the circuit board to a carrier having a curved surface; and absorbing the circuit board by an adsorption mechanism, so that the circuit board is bent to have the first radius of curvature.

4 . The method of manufacturing the electronic device according to claim 1 , wherein when the circuit board having the first radius of curvature is attached to the back frame through the adhesive, pressing the circuit board with a pressing mechanism having a third radius of curvature, wherein a difference between the third radius of curvature and the second radius of curvature is within 10%.

5 . The method of manufacturing the electronic device according to claim 4 , wherein the pressing mechanism has a plurality of pressing bars, and the plurality of pressing bars do not overlap a plurality of electronic components of the circuit board in a normal direction of the circuit board.

6 . The method of manufacturing the electronic device according to claim 5 , wherein a width of the plurality of pressing bars is smaller than a width of a gap between two adjacent electronic components of the plurality of electronic components.

7 . The method of manufacturing the electronic device according to claim 1 , wherein the first radius of curvature and the second radius of curvature are smaller than 5000 mm.

8 . An electronic device, comprising:
a back frame having a first curved surface; a circuit board disposed on the back frame and having a second curved surface; and a patterned adhesive disposed between the back frame and the circuit board, wherein the patterned adhesive has an adhesive area attached to the circuit board, a surface of the circuit board adjacent to the patterned adhesive has a surface area, and the adhesive area and the surface area meet the following relationship: 30%≤adhesive area/surface area≤99%.

9 . The electronic device according to claim 8 , wherein the patterned adhesive has a concave-convex surface.

10 . The electronic device according to claim 9 , wherein the concave-convex surface comprises a concave surface and a convex surface, and a ratio of a thickness of the concave surface to a thickness of the convex surface is between 0.1 and 0.9.

11 . The electronic device according to claim 9 , wherein the concave-convex surface is adjacent to the circuit board.

12 . The electronic device according to claim 9 , wherein the concave-convex surface is far away from the circuit board.

13 . The electronic device according to claim 8 , wherein the patterned adhesive comprises a plurality of sub-parts separated from each other, and the plurality of sub-parts overlap the circuit board.

14 . The electronic device according to claim 13 , wherein the patterned adhesive further comprises a gap disposed between two adjacent sub-parts of the plurality of sub-parts.

15 . The electronic device according to claim 8 , wherein the adhesive area and the surface area meet the following relationship: 30%≤adhesive area/surface area≤80%.

16 . The electronic device according to claim 8 , wherein the back frame comprises a accommodating groove, there is a gap between a side wall of the accommodating groove and an edge of the circuit board, and a width of the gap is 0.1 mm to 20 mm.

17 . The electronic device according to claim 8 , wherein an edge of the circuit board is not aligned with an edge of the patterned adhesive.

18 . A method of manufacturing an electronic device, comprising:
providing a protective substrate; performing a second pre-bending step on the protective substrate so that the protective substrate is bent to have a fourth radius of curvature; providing a back frame having a second radius of curvature; and assembling the protective substrate having the fourth radius of curvature to the back frame, wherein the second radius of curvature is smaller than the fourth radius of curvature, and a difference between the fourth radius of curvature and the second radius of curvature is greater than 0 mm and less than 8000 mm.

19 . The method of manufacturing the electronic device according to claim 18 , wherein a process temperature of the second pre-bending step is between 600° C. and 900° C.

20 . The method of manufacturing the electronic device according to claim 18 , wherein the difference is greater than 0 mm and less than 6000 mm.

Assignees

• Carux Tech Pte Ltd

Inventors

• Nien Chueh-Yuan
• Lo Ching-I
• Sung Li-Wei
• Hung Yu-Ling

Classifications

• H05K3/0044

  Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence) · CPC title

• H05K2203/0522

  Using an adhesive pattern · CPC title

• H05K2203/0195

  Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure · CPC title

• G09F9/30

  in which the desired character or characters are formed by combining individual elements (panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00) · CPC title

• H05K3/0058

  Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title