Micro-electro-mechanical system microphone package

Patent metadata

Field	Value
Publication number	US-12593178-B2
Application number	US-202217933222-A
Country	US
Kind code	B2
Filing date	Sep 19, 2022
Priority date	Apr 26, 2022
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

A micro-electro-mechanical system (MEMS) microphone package is provided. The MEMS microphone package includes a first micro-electro-mechanical system (MEMS) sensor die, an integrated circuit (IC) die and a first conductive lid. The first micro-electro-mechanical system (MEMS) sensor die has a first surface and a second surface opposite to the first surface. The IC die is stacked on the first surface of the first MEMS sensor die. The first conductive lid is disposed on the second surface of the first MEMS sensor die.

First claim

What is claimed is:

1 . A micro-electro-mechanical system (MEMS) microphone package, comprising:
a first micro-electro-mechanical system (MEMS) sensor die having a first surface and a second surface opposite to the first surface; an integrated circuit (IC) die stacked on the first surface of the first MEMS sensor die; a first conductive lid disposed on the second surface of the first MEMS sensor die; an additional integrated circuit (IC) die stacked on the first surface of the first MEMS sensor die, wherein the IC die is positioned beside and directly connected to the additional IC die; a second MEMS sensor die stacked on and electrically connected to the additional IC die, wherein the first MEMS sensor die is positioned beside and directly connected to the second MEMS sensor die; and a second conductive lid disposed on the second MEMS sensor die and positioned beside the first conductive lid, wherein a first sidewall portion of the first conductive lid is positioned directly on the first MEMS sensor die, and a second sidewall portion of the second conductive lid is positioned directly on the second MEMS sensor die, wherein the first MEMS sensor die and the second MEMS sensor die are included in a micro-electro-mechanical system (MEMS) sensor wafer, the IC die and the additional IC die are included in an IC wafer provided for the MEMS sensor wafer to be stacked upon, and opposite edges of the MEMS sensor wafer are aligned with the corresponding opposite edges of the IC wafer.

2 . The MEMS microphone package as claimed in claim 1 , wherein the integrated circuit (IC) die is electrically connected to the first MEMS sensor die by a first conductive bump structure on the first MEMS sensor die and a through silicon via (TSV) structure passing through the IC die.

3 . The MEMS microphone package as claimed in claim 1 , wherein a micro-electro-mechanical system (MEMS) substrate of the first MEMS sensor die, the IC die and the first conductive lid mounted on the MEMS substrate of the first MEMS sensor die collectively form a housing, such that a diaphragm of the first MEMS sensor die is enclosed in the housing.

4 . The MEMS microphone package as claimed in claim 1 , wherein the IC die has an acoustic port passing through the IC die such that the first MEMS sensor die is exposed from the acoustic port.

5 . The MEMS microphone package as claimed in claim 1 , wherein the first conductive lid is connected to the first MEMS sensor die and collectively form a cavity above the first MEMS sensor die.

6 . The MEMS microphone package as claimed in claim 1 , further comprising:
a printed circuit board (PCB) provided for the IC die to be stacked upon, such that the IC die is positioned between the first MEMS sensor die and the PCB, wherein the first conductive lid is connected to the first MEMS sensor die and the PCB to collectively form a cavity accommodating the first MEMS sensor die.

7 . The MEMS microphone package as claimed in claim 1 , wherein the first conductive lid is connected to the MEMS sensor wafer.

8 . The MEMS microphone package as claimed in claim 1 , wherein the first conductive lid and the first MEMS sensor die form a first cavity over the first MEMS sensor die, the second conductive lid and the second MEMS sensor die form a second cavity over the second MEMS sensor die and physically isolated from the first cavity, and the first cavity and the second cavity do not overlap each other in a direction substantially vertical to a top surface of the IC die.

Assignees

• Fortemedia Inc

Inventors

• Huang Yen-Son Paul
• Chen Iou-Din Jean
• Wang Shih-Chung
• Chen Yung-Wei

Classifications

• B81B2203/0315

  Cavities · CPC title

• B81B2207/096

  through the substrate · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title

• B81B2203/0127

  Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title