Listening device

Patent metadata

Field	Value
Publication number	US-12593158-B2
Application number	US-202318500130-A
Country	US
Kind code	B2
Filing date	Nov 2, 2023
Priority date	Sep 21, 2023
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

A listening device includes a housing and a circuit board assembly. The housing includes at least one sound outlet. The circuit board assembly is disposed on the housing and includes a microphone, a proximity sensing chip, and a proximity sensing pattern. The microphone and the proximity sensing chip are close to each other and are disposed in a first area of the circuit board assembly. The proximity sensing pattern is disposed in a second area of the circuit board assembly. The second area is connected to the first area. The proximity sensing pattern surrounds and is staggered with the at least one sound outlet.

First claim

What is claimed is:

1 . A listening device, comprising:
a housing, comprising at least one sound outlet; and a circuit board assembly, disposed on the housing, and comprising a microphone, a proximity sensing chip, and a proximity sensing pattern, wherein the microphone and the proximity sensing chip are close to each other and are disposed in a first area of the circuit board assembly, the proximity sensing pattern is disposed in a second area of the circuit board assembly, the second area is connected to the first area, and the proximity sensing pattern surrounds and is staggered with the at least one sound outlet, wherein the at least one sound outlet comprises a plurality of sound outlets arranged in a ring shape, the proximity sensing pattern comprises an inner ring, an outer ring surrounding the inner ring, and a plurality of connecting parts connecting the inner ring and the outer ring, the inner ring is located on inner sides of the sound outlets, the outer ring is located on outer sides of the sound outlets, and the connecting parts are located between the sound outlets, so that the proximity sensing pattern surrounds the sound outlets.

2 . The listening device according to claim 1 , wherein the circuit board assembly comprises a sensing layer, and the microphone, the proximity sensing chip, and the proximity sensing pattern are disposed on the sensing layer.

3 . The listening device according to claim 2 , wherein the circuit board assembly further comprises a reference ground layer disposed below the sensing layer, the reference ground layer comprises a microphone power circuit and a system ground plane electrically connected to the microphone, and projections of the microphone power circuit and the system ground plane onto a plane where the sensing layer is located overlap the first area.

4 . The listening device according to claim 3 , wherein the reference ground layer comprises a first ground layer and a second ground layer, the second ground layer is disposed below the first ground layer, the second ground layer is electrically connected to the first ground layer, and the microphone power circuit is disposed on the second ground layer.

5 . The listening device according to claim 3 , wherein the circuit board assembly further comprises a correction layer disposed below the reference ground layer, and the correction layer comprises an environmental parameter sensing circuit electrically connected to the proximity sensing chip.

6 . The listening device according to claim 5 , wherein a projection of the environmental parameter sensing circuit onto the plane where the sensing layer is located overlaps the second area.

7 . The listening device according to claim 1 , wherein the second area is in a C-shape, and the first area where the microphone and the proximity sensing chip are disposed extends from a gap of the second area to a center of the C-shape, so that the second area and a portion of the first area together form a closed ring shape.

8 . The listening device according to claim 1 , wherein the microphone is disposed at a central position above the housing.

9 . The listening device according to claim 1 , wherein a width of the outer ring is greater than or equal to a width of the inner ring.

Assignees

• Merry Electronics Shenzhen Co Ltd

Inventors

• Liu Yi-Po
• Tseng Chien-Cheng
• Tsai Hun-Yun

Classifications

• H04R1/1008

  Earpieces of the supra-aural or circum-aural type · CPC title

• H04R1/08

  Mouthpieces; {Microphones;} Attachments therefor · CPC title

• H04R1/02

  Casings; Cabinets {; Supports therefor;} Mountings therein (H04R1/28 takes precedence {; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075}) · CPC title

• H04R1/1041 Primary

  Mechanical or electronic switches, or control elements (switches in general H01H) · CPC title

• H04R1/04 Primary

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title