Imaging system lens mounting arrangement

Patent metadata

Field	Value
Publication number	US-12593117-B2
Application number	US-202318355204-A
Country	US
Kind code	B2
Filing date	Jul 19, 2023
Priority date	Jul 22, 2022
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

According to the specification there is provided an imaging system that includes: an imaging device mounted on a PCB of the imaging system; a lens; and a lens holder. The imaging system further includes an electrically conducting element configured to provide an electrical grounding connection between the lens and the PCB. According to further aspects, arrangements of a conducting element for providing an electrical grounding of lens of an imaging system are provided.

First claim

What is claimed is:

1 . An imaging system comprising:
an imaging device mounted on a printed circuit board (PCB) of the imaging system; a lens; a lens holder; and an electrically conducting element configured to provide an electrical grounding connection between the lens and the PCB; wherein: the lens is attached to the lens holder at an interface between a first upper bearing surface of the lens and a second lower bearing surface of the lens holder; the lens is attachable to the lens holder at an adhesive layer located between the bearing surfaces at a first interface portion; the adhesive layer is non-conducting and configured to provide a stabilized coupling between lens and the lens holder for precision alignment of optically active components; at least one recess is provided at a second interface portion between the first bearing surface and the second bearing surface; wherein the conducting element is configured for engagement with the bearing surfaces of each of the lens and the lens holder at least one corresponding recess to provide an electrically conducting connection between the lens and lens holder; and the conducting element is resilient and of annular or c-shaped form, deformable for location in the recess.

2 . The imaging system of claim 1 , wherein:
the first interface portion and the second interface portions are arranged radially side by side, and the adhesive layer is located at first interface portion, and the recess is located at the second interface portion.

3 . The imaging system of claim 1 , wherein the at least one recess is at least partially defined by the adhesive layer, and portions of the first and second bearing surfaces of the lens and lens holder adjacent to the adhesive layer, said bearing surfaces being spaced apart in a vertical direction by the adhesive layer located therebetween.

4 . The imaging system of claim 1 , wherein the at least one recess is at least partially defined by a groove mechanically formed in one or both of the bearing surfaces of the lens and lens holder.

5 . The imaging system of claim 1 , wherein the conducting element comprises a conducting adhesive or paste configured to be located in a conducting layer in the recess such that engagement surfaces of the conducting layer are in contact with corresponding portions of bearing surfaces of each of the lens and the lens holder at the recess to provide an electrically conducting connection between the lens and the lens holder.

6 . The imaging system of claim 1 , wherein the conducting element comprises:
a support configured in use for engagement with a corresponding bearing surface of the lens or the lens holder; and one or more contact arms circumferentially spaced apart on the support and extending therefrom, wherein each contact arm comprises an engagement surface, and wherein each contact arm is resilient and biased in a direction inwardly relative to the support, such that in use when the support is located on externally on the lens or the lens holder, the engagement surface configured for engagement in a corresponding recess such that the conducting element is in contact with a corresponding bearing surface of each of the lens and the lens holder to provide an electrically conducting connection between the lens and the lens holder.

7 . The imaging system of claim 6 ,
wherein in use, the support of the conducting element is receivable at an external portion of the lens holder, and wherein the one or more contact arms extend upwardly from the support in the direction of the lens.

8 . The imaging system of claim 6 ,
wherein in use, the support of the conducting element is receivable at an external portion of the lens, and wherein the one or more contact arms extend downwardly from the support in the direction of the lens holder.

9 . The imaging system of claim 6 , wherein the conducting element comprises:
a support comprising a support wall having a first internal peripheral wall and a second external peripheral wall surface and extending between a first end and a second end with an opening therebetween, in a C-shaped form, the support configured to expand for locating externally on the lens and the lens holder near the interface, wherein the internal peripheral wall comprises an engagement surface for engagement with corresponding portions of both the lens and the lens holder to provide an electrically conducting connection between the lens and the lens holder.

10 . The imaging system of claim 9 , wherein the engagement surface is arranged according to at least one of the following:
(i) wherein the engagement surface comprises one or more protrusions formed protruding inwardly relative to the engagement surface in the direction of the lens and lens holder, each protrusion being receivable in the recess; (ii) wherein the engagement surface comprises one or more protrusions comprising a ridge arranged extending circumferentially around the internal peripheral wall, each protrusion being receivable in the recess; (iii) wherein the engagement surface comprises a protrusion receivable in the recess at the interface; or (iv) wherein the engagement surface is comprised of a metal and is electrically conducting.

11 . The imaging system of claim 6 , wherein the support is resilient and is deformable for locating on a body of the lens and/or the lens holder and is biased to engage with the body of the lens and/or the lens holder.

Assignees

• Aptiv Technologies AG

Inventors

• Hebda Pawel
• Antos Przemyslaw
• Rafalowski Arkadiusz
• Ochala Rafal G

Classifications

• H01R12/718

  Contact members provided on the PCB without an insulating housing (contacts for abutting H01R12/714) · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• G02B7/025

  using glue · CPC title

• G02B7/02

  for lenses {(supports for magnifying lenses G02B25/002)} · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title