Middle frame assembly, preparation method thereof, and electronic device

Patent metadata

Field	Value
Publication number	US-12592988-B2
Application number	US-202318272783-A
Country	US
Kind code	B2
Filing date	Jan 3, 2023
Priority date	Apr 1, 2022
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

Disclosed is a middle frame assembly, including a middle plate and a frame disposed around an outer edge of the middle plate, where the middle plate includes a first carbon fiber reinforced resin composite material base body and a first metal plating layer compounded on a surface of the base body. Some embodiments of this application further provide a preparation method for a middle frame assembly and an electronic device in the middle frame assembly. Some embodiments of this application use a carbon fiber reinforced resin composite material as a middle plate base body of the middle frame assembly.

First claim

What is claimed is:

1 . A middle frame assembly, comprising:
a middle plate; and a frame disposed around an outer edge of the middle plate, wherein the middle plate includes a base body comprising first carbon fiber reinforced resin composite material and a first metal plating layer compounded on a surface of the base body; wherein a first part of the base body that is not connected to the frame is compounded with the first metal plating layer; and wherein a second part of the base body that is connected to the frame is compounded with a second metal plating layer, and the second metal plating layer is connected to the first metal plating layer.

2 . The middle frame assembly according to claim 1 , wherein a thickness of the first metal plating layer is greater than or equal to a skin depth of the first metal plating layer.

3 . The middle frame assembly according to claim 2 , wherein a resistivity of the first metal plating layer is 1×10 −4 ohm·cm or below.

4 . The middle frame assembly according to claim 3 , wherein the resistivity of the first metal plating layer is in a range of 1×10 −5 ohm·cm to 1×10 −8 ohm·cm.

5 . The middle frame assembly according to claim 4 , wherein the first metal plating layer is selected from one of zinc, copper, nickel, gold, silver, tin, or aluminum, or an alloy thereof.

6 . A middle frame assembly, comprising:
a middle plate; and a frame disposed around an outer edge of the middle plate, wherein the middle plate includes a base body comprising first carbon fiber reinforced resin composite material and a first metal plating layer compounded on a surface of the base body; wherein a part of the base body that is not connected to the frame is compounded with the first metal plating layer; and wherein a through hole is provided on the base body, a second metal plating layer is compounded on a surface of the through hole, and the second metal plating layer is connected to the first metal plating layer.

7 . The middle frame assembly according to claim 1 , wherein the middle plate further comprises a protective layer compounded on a surface of the first metal plating layer.

8 . The middle frame assembly according to claim 1 , further comprising an antenna radiator arranged on the frame.

9 . The middle frame assembly according to claim 8 , wherein the frame comprises a plastic frame and a metallized frame, wherein the metallized frame is connected to the middle plate through the plastic frame.

10 . The middle frame assembly according to claim 8 , wherein the frame comprises a plastic frame and a metallized frame, wherein the metallized frame is connected to the middle plate through the plastic frame, wherein the metallized frame comprises a third carbon fiber reinforced resin composite material base body and a third metal plating layer compounded on the third carbon fiber reinforced resin composite material base body.

11 . The middle frame assembly according to claim 9 , wherein at least a portion of a frame body of the metallized frame is used as the antenna radiator.

12 . The middle frame assembly according to claim 11 , wherein the antenna radiator is electrically connected to the middle plate through a conductive layer.

13 . The middle frame assembly according to claim 11 , wherein the antenna radiator is electrically connected to the middle plate through a conductive auxiliary material.

14 . The middle frame assembly according to claim 13 , wherein the conductive auxiliary material is a metal elastic piece, a metal gasket, a conductive fabric, a conductive adhesive, or a conductive foam.

15 . The middle frame assembly according to claim 8 , wherein the antenna radiator is arranged on one side of the frame facing the middle plate.

16 . The middle frame assembly according to claim 15 , wherein the antenna radiator is electrically connected to the middle plate through a conductive layer.

17 . The middle frame assembly according to claim 15 , wherein the antenna radiator is electrically connected to the middle plate through a conductive auxiliary material.

18 . The middle frame assembly according to claim 1 , wherein the base body comprises a carbon fiber reinforced epoxy resin composite material base body, a carbon fiber reinforced phenolic resin composite material base body, or a carbon fiber reinforced polytetrafluoroethylene resin composite material base body.

19 . An electronic device comprising a middle frame assembly, wherein the middle frame assembly includes:
a middle plate; and a frame disposed around an outer edge of the middle plate, wherein the middle plate includes a base body comprising first carbon fiber reinforced resin composite material and a first metal plating layer compounded on a surface of the base body; wherein a first part of the base body that is not connected to the frame is compounded with the first metal plating layer; and wherein a second part of the base body that is connected to the frame is compounded with a second metal plating layer, and the second metal plating layer is connected to the first metal plating layer.

Assignees

• Honor Device Co Ltd

Inventors

• Meng Yin
• Gao Jing
• Jiang Cheng

Classifications

• H01Q1/243

  with built-in antennas · CPC title

• H01Q13/10

  Resonant slot antennas · CPC title

• H01Q21/28

  Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} · CPC title

• H04M1/0202

  Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03) · CPC title

• Y02T50/40

  Weight reduction · CPC title