Resistive stabilization of a transmission line using a group of conductive fill components which are adjacent to and separated from the transmission line

Patent metadata

Field	Value
Publication number	US-12592467-B2
Application number	US-202218082647-A
Country	US
Kind code	B2
Filing date	Dec 16, 2022
Priority date	Dec 16, 2022
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

An enhanced electrical circuit can employ conductive fill components that can facilitate providing desirable resistive stabilization of the electrical circuit and other desirable circuit qualities without having to use a physical resistor. The electrical circuit can comprise a transmission line, which can be a microstrip line, that can have defined dimensions. The electrical circuit can comprise respective conductive fill components that can be in proximity to desired sides of the transmission line, wherein the respective conductive fill components can provide the desired resistive stabilization for the electrical circuit. The respective conductive fill components can be separated from, and not in contact with, each other based on respective gaps of a defined size(s) between respective adjacent conductive fill components. The respective conductive fill components can be across a single layer or multiple layers of conductive fill components.

First claim

What is claimed is:

1 . A system that facilitates resistive stabilization of an electrical circuit, comprising:
a transmission line having defined dimensions; and a group of conductive fill components in proximity to the transmission line, wherein the group of conductive fill components provides the resistive stabilization of the electrical circuit comprising the transmission line, wherein the group of conductive fill components comprises a first conductive fill component and a second conductive fill component that is adjacent to and separated from the first conductive fill component by a gap of a defined size between the first conductive fill component and the second conductive fill component, wherein the first conductive fill component and the second conductive fill component are not in contact with each other, and wherein the first conductive fill component and the second conductive fill component are formed of a conductive material.

2 . The system of claim 1 , wherein the first conductive fill component and the second conductive fill component form at least a portion of at least one of a first subgroup of conductive fill components in proximity to a first side of the transmission line, a second subgroup of conductive fill components in proximity to a second side of the transmission line, and a third subgroup of conductive fill components in proximity to a third side of the transmission line.

3 . The system of claim 2 , further comprising a ground plane that extends to a first region in proximity to the first side of the transmission line, a second region in proximity to the second side of the transmission line, or a third region in proximity to the third side of the transmission line.

4 . The system of claim 1 , wherein the transmission line is a microstrip line having the defined dimensions comprising a width on an order of micrometers.

5 . The system of claim 1 , wherein the first conductive fill component and the second conductive fill component form at least a portion of at least one of a first layer of first conductive fill components in proximity to the transmission line and a second layer of second conductive fill components in proximity to the first layer of the first conductive fill components, and wherein the first layer of the first conductive fill components is situated between the transmission line and the second layer of the second conductive fill components.

6 . The system of claim 5 , wherein the first conductive fill components of the first layer have first dimensions, and wherein the second conductive fill components of the second layer have second dimensions, in accordance with defined circuit design criteria relating to first characteristics of the group of conductive fill components or second characteristics of the electrical circuit.

7 . The system of claim 1 , wherein the resistive stabilization of the electrical circuit is a function of respective dimensions of the first conductive fill component and the second conductive fill component of the group of conductive fill components, respective conductive materials of the first conductive fill component and the second conductive fill component, the defined size of the gap between the first conductive fill component and the second conductive fill component, a number of layers of the group of conductive fill components, or respective locations of the first conductive fill component and the second conductive fill component in relation to the transmission line.

8 . The system of claim 1 , wherein, based on a group of characteristics of the group of conductive fill components, and based on the group of conductive fill components being located in proximity to the transmission line, an inductance of the electrical circuit is substantially same over a defined range of frequencies associated with the electrical circuit.

9 . The system of claim 1 , wherein, based on a group of characteristics of the group of conductive fill components, and based on the group of conductive fill components being located in proximity to the transmission line, a series resistance of the electrical circuit is substantially the same over a defined range of lower frequencies associated with the electrical circuit, and, at higher frequencies above the defined range of lower frequencies, the series resistance increases to higher series resistances as a function of an increase in frequency of the higher frequencies, and wherein the higher series resistances are higher in resistance than the series resistance.

10 . A method that facilitates resistive stabilization of an electrical circuit, comprising:
forming a transmission line having defined dimensions; and forming a group of conductive fill components in proximity to the transmission line, wherein the group of conductive fill components facilitates the resistive stabilization of the electrical circuit comprising the transmission line, wherein the group of conductive fill components comprises a first conductive fill component and a second conductive fill component that is adjacent to and separated from the first conductive fill component by a gap of a defined size between the first conductive fill component and the second conductive fill component, wherein the first conductive fill component and the second conductive fill component are not in contact with each other, and wherein the first conductive fill component and the second conductive fill component are formed of a conductive material.

11 . The method of claim 10 , wherein the first conductive fill component and the second conductive fill component form at least a portion of at least one of a first subgroup of conductive fill components in proximity to a first side of the transmission line, a second subgroup of conductive fill components in proximity to a second side of the transmission line, and a third subgroup of conductive fill components in proximity to a third side of the transmission line; and
wherein a ground plane is in proximity to the group of conductive fill components or the transmission line, and wherein the ground plane extends to a first region in proximity to the first side of the transmission line, a second region in proximity to the second side of the transmission line, or a third region in proximity to the third side of the transmission line.

12 . A device that facilitates resistive stabilization of an electronic circuit, comprising:
a conductive line having defined dimensions; and a group of conductive fill elements within a defined distance of the conductive line, wherein the group of conductive fill elements enables the resistive stabilization of the electronic circuit comprising the conductive line, wherein the group of conductive fill elements comprises a first conductive fill element and a second conductive fill element, wherein the second conductive fill element is adjacent to and separated from the first conductive fill element by a space of a defined size between the first conductive fill element and the second conductive fill element, wherein the first conductive fill element and the second conductive fill element are not in contact with each other, and wherein the first conductive fill element and the second conductive fill element are formed of a conductive material.

13 . The device of claim 12 , wherein the first conductive fill element and the second conductive fill element form at least a portion of at least one of a first subgroup of conductive fill elements within the defined distance of a first side of the conductive line, a second subgroup of conductive fill elements within the defined distance of a second side of the conductive line, and a third subgroup of conduc

Assignees

• Macom Tech Solutions Holdings Inc

Inventors

• Nguyen Nguyen
• Phan Trong
• Nguyen Duy
• Pham Thanh
• D'Agostino Stefano
• Kennan Wayne
• Allen William

Classifications

• H01P5/08

  for linking dissimilar lines or devices (H01P1/16, H01P5/04 take precedence; linking lines of the same kind but with different dimensions H01P5/02) · CPC title

• H01P3/081

  Microstriplines · CPC title

• H01P11/003

  Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

• H01P3/082 Primary

  Multilayer dielectric · CPC title

• H01P1/00 Primary

  Auxiliary devices (coupling devices of the waveguide type H01P5/00) · CPC title