Conductive resin composition and method for manufacturing electronic component
US-2023170105-A1 · Jun 1, 2023 · US
Multilayer ceramic electronic device
US12592345B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12592345-B2 |
| Application number | US-202318324344-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 26, 2023 |
| Priority date | May 30, 2022 |
| Publication date | Mar 31, 2026 |
| Grant date | Mar 31, 2026 |
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- Title
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- Abstract
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Abstract
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A multilayer ceramic electronic device includes an element body including a ceramic layer and an internal electrode layer, and an external electrode formed on an outer surface of the element body and electrically connected to part of the internal electrode layer. The external electrode includes a first layer in direct contact with the element body and containing a first insulator phase and first metal phases, and a second layer in contact with an outer surface of the first layer and containing a second insulator phase and second metal phases. An area ratio of the first metal phases in the first layer is more than 8% and 30% or less. An area ratio of the second metal phases in the second layer is larger than the area ratio of the first metal phases in the first layer. The first metal phases have an average aspect ratio of 3.5 or more.
First claim
Opening claim text (preview).
What is claimed is: 1 . A multilayer ceramic electronic device comprising: an element body including a ceramic layer and an internal electrode layer; and an external electrode formed on an outer surface of the element body and electrically connected to part of the internal electrode layer, wherein the external electrode includes a first layer in direct contact with the element body and containing a first insulator phase and first metal phases, and a second layer in contact with an outer surface of the first layer and containing a second insulator phase and second metal phases; an area ratio of the first metal phases in the first layer is more than 8% and 30% or less; an area ratio of the second metal phases in the second layer is larger than the area ratio of the first metal phases in the first layer; the first metal phases have an average aspect ratio of 3.5 or more, and the first metal phases are not spherical particles. 2 . The multilayer ceramic electronic device according to claim 1 , wherein the area ratio of the first metal phases in the first layer is more than 8% and 18% or less. 3 . The multilayer ceramic electronic device according to claim 1 , wherein the first layer has an average thickness of 20 μm or more. 4 . The multilayer ceramic electronic device according to claim 1 , wherein a ratio of an average major diameter of the first metal phases to an average thickness of the first layer is 0.1 or more and 0.7 or less. 5 . The multilayer ceramic electronic device according to claim 1 , wherein the first insulator phase comprises an oxide containing boron. 6 . The multilayer ceramic electronic device according to claim 1 , wherein the first metal phases comprise copper or silver. 7 . The multilayer ceramic electronic device according to claim 1 , wherein the external electrode further comprises a plating electrode layer in contact with the second layer. 8 . A multilayer ceramic electronic device comprising: an element body including a ceramic layer and an internal electrode layer; and an external electrode formed on an outer surface of the element body and electrically connected to part of the internal electrode layer, wherein the external electrode includes a first layer in direct contact with the element body and containing a first insulator phase and first metal phases, and a second layer in contact with an outer surface of the first layer and containing a second insulator phase and second metal phases; an area ratio of the first metal phases in the first layer is more than 6% and 30% or less; an area ratio of the second metal phases in the second layer is larger than the area ratio of the first metal phases in the first layer; the first metal phases have an average aspect ratio of 5.0 or more, and the first metal phases are not spherical particles. 9 . The multilayer ceramic electronic device according to claim 1 , wherein the first metal phases have an average aspect ratio of 4.0 or more.
Assignees
Inventors
Classifications
Stacked capacitors (H01G4/33 takes precedence) · CPC title
Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title
- H01G4/2325Primary
characterised by the material of the terminals · CPC title
- H01G4/232Primary
electrically connecting two or more layers of a stacked or rolled capacitor · CPC title
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- What does patent US12592345B2 cover?
- A multilayer ceramic electronic device includes an element body including a ceramic layer and an internal electrode layer, and an external electrode formed on an outer surface of the element body and electrically connected to part of the internal electrode layer. The external electrode includes a first layer in direct contact with the element body and containing a first insulator phase and firs…
- Who is the assignee on this patent?
- Tdk Corp
- What technology area does this patent fall under?
- Primary CPC classification H01G4/2325. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).