Haptic feedback substrate and haptic feedback apparatus

US12591309B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12591309-B2
Application numberUS-202218034549-A
CountryUS
Kind codeB2
Filing dateMar 25, 2022
Priority dateMar 25, 2022
Publication dateMar 31, 2026
Grant dateMar 31, 2026

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Provides are a haptic feedback substrate and apparatus. The haptic feedback substrate includes: a base substrate; a first electrode layer, the first electrode layer is electrically connected to a ground voltage input end; a piezoelectric film layer at one side of the first electrode layer facing away from the base substrate; a second electrode layer at one side of the piezoelectric film layer facing away from the base substrate, the second electrode layer is divided into vibration zones, each vibration zone includes at least one second electrode, second electrodes in each vibration zone are electrically connected to the same drive voltage input end, second electrodes in different vibration zones are electrically connected to different drive voltage input ends; the first and second electrode layers form an alternating electric field, the piezoelectric film layer vibrates under the action of the alternating electric field and drive the base substrate to resonate.

First claim

Opening claim text (preview).

What is claimed is: 1 . A haptic feedback substrate, comprising: a base substrate; a first electrode layer on the base substrate, wherein the first electrode layer is electrically connected to a ground voltage input end; a piezoelectric film layer at one side facing away from the base substrate, of the first electrode layer; and a second electrode layer at one side facing away from the base substrate, of the piezoelectric film layer, wherein the second electrode layer is divided into a plurality of vibration zones, each of the plurality of vibration zones comprises at least one second electrode, the at least one second electrode in each of the plurality of vibration zones is electrically connected to a same drive voltage input end, and second electrodes in different vibration zones are electrically connected to different drive voltage input ends; wherein the first electrode layer and the second electrode layer are configured to form an alternating electric field, and the piezoelectric film layer is configured to vibrate under an action of the alternating electric field and drive the base substrate to resonate; wherein the haptic feedback substrate further comprises: further comprising a wiring layer at one side facing away from the base substrate, of the piezoelectric film layer, wherein the wiring layer comprises a plurality of wires, and the at least one second electrode in each of the plurality of vibration zones is electrically connected to the same drive voltage input end through the wires; wherein the piezoelectric film layer comprises piezoelectric connectors, and orthographic projections of the wires on the base substrate are within a range of orthographic projections of the piezoelectric connectors on the base substrate. 2 . The haptic feedback substrate according to claim 1 , wherein the piezoelectric film layer further comprises a plurality of piezoelectric parts distributed in an array, and orthographic projections of the piezoelectric parts on the base substrate overlap orthographic projections of the second electrodes on the base substrate; and the piezoelectric parts are connected to the piezoelectric connectors, and the piezoelectric connector is arranged between adjacent piezoelectric parts; or the piezoelectric film layer further comprises a plurality of piezoelectric parts distributed in an array, and the plurality of piezoelectric parts and the connectors are of an integrally formed entire-surface structure. 3 . The haptic feedback substrate according to claim 2 , wherein the orthographic projections of the piezoelectric connectors on the base substrate are in one-to-one correspondence to the orthographic projections of the wires on the base substrate. 4 . The haptic feedback substrate according to claim 1 , wherein each of the plurality of vibration zones comprises a plurality of second electrodes, the plurality of second electrodes constitute one column, and two adjacent second electrodes in a same column are electrically connected through the wires. 5 . The haptic feedback substrate according to claim 4 , wherein the two adjacent second electrodes in the same column are electrically connected through a plurality of independent wires arranged in a row direction. 6 . The haptic feedback substrate according to claim 4 , wherein orthographic projections of the plurality of independent wires arranged in the row direction on the base substrate are between orthographic projections of the two adjacent second electrodes on the base substrate. 7 . The haptic feedback substrate according to claim 4 , wherein in response to the piezoelectric film layer comprising the plurality of piezoelectric parts distributed in an array, the piezoelectric film layer further comprises piezoelectric buffer parts respectively at one end of a first piezoelectric part and one end of a last piezoelectric part in a same column of piezoelectric parts, and the piezoelectric buffer parts are connected to the piezoelectric parts through a plurality of independent piezoelectric connectors arranged in the row direction; the haptic feedback substrate further comprises first binding parts and second binding parts arranged on a layer same as a layer on which the second electrodes are, and the first binding parts and the second binding parts are on corresponding piezoelectric buffer parts, respectively; and the first binding parts are electrically connected to the second electrodes through a plurality of independent wires arranged in the row direction, the second binding parts are electrically connected to the second electrodes through a plurality of independent wires arranged in the row direction, and the first binding parts and/or the second binding parts are electrically connected to the drive voltage input ends; or in response to the piezoelectric film layer being of an entire-surface structure, the haptic feedback substrate further comprises first binding parts and second binding parts arranged on a layer same as a layer on which the second electrodes are, and the first binding parts and the second binding parts are on the piezoelectric film layer separately; and the first binding parts are electrically connected to the second electrodes through a plurality of independent wires arranged in the row direction, the second binding parts are electrically connected to the second electrodes through a plurality of independent wires arranged in the row direction, and the first binding parts and/or the second binding parts are electrically connected to the drive voltage input ends. 8 . The haptic feedback substrate according to claim 7 , wherein a first binding part and a second binding part that are electrically connected to each column of second electrodes are symmetrically arranged with respect to a center line of the base substrate in the row direction. 9 . The haptic feedback substrate according to claim 7 , wherein a size of the piezoelectric buffer parts is smaller than a size of the piezoelectric parts. 10 . The haptic feedback substrate according to claim 1 , wherein each of the plurality of vibration zones comprises one second electrode, and all the second electrodes are electrically connected to different wires. 11 . The haptic feedback substrate according to claim 10 , wherein all the second electrodes are distributed in an array, the wires electrically connected to a first row of second electrodes and a last row of second electrodes are directly led out from ends of the first row of second electrodes and the last row of second electrodes, and the wires electrically connected to the other rows of second electrodes are led out from gaps between two adjacent columns of second electrodes. 12 . The haptic feedback substrate according to claim 11 , wherein in the other rows of second electrodes, the wires electrically connected to some rows of second electrodes are led out to one side of the first row of second electrodes, and the wires electrically connected to the other rows of second electrodes are led out to one side of the last row of second electrodes. 13 . The haptic feedback substrate according to claim 1 , wherein each of the plurality of vibration zones comprises at least two second electrodes in a same column, the plurality of vibration zones in a same column are independent of each other, and two adjacent second electrodes in each of the plurality of vibration zones are electrically connected through the wires. 14 . The haptic feedback substrate according to claim 13 , wherein two adjacent second electrodes in each of the plurality of vibration zones are electrically connected through a plurality of independent wir

Assignees

Inventors

Classifications

  • Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads · CPC title

  • using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes · CPC title

  • using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer · CPC title

  • Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

  • G06F3/016Primary

    Input arrangements with force or tactile feedback as computer generated output to the user · CPC title

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What does patent US12591309B2 cover?
Provides are a haptic feedback substrate and apparatus. The haptic feedback substrate includes: a base substrate; a first electrode layer, the first electrode layer is electrically connected to a ground voltage input end; a piezoelectric film layer at one side of the first electrode layer facing away from the base substrate; a second electrode layer at one side of the piezoelectric film layer f…
Who is the assignee on this patent?
Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification G06F3/04164. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 31 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).