Communication socket

US12591097B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12591097-B2
Application numberUS-202418606105-A
CountryUS
Kind codeB2
Filing dateMar 15, 2024
Priority dateMar 15, 2024
Publication dateMar 31, 2026
Grant dateMar 31, 2026

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A communication socket includes a housing, a heat-dissipation element, and an adjustment frame. The housing includes a receiving cavity, and a heat-dissipation opening connected to the receiving cavity. The heat-dissipation element includes a heat-dissipation plate on the housing; a guide element connected to the heat-dissipation plate; and a thermal-conduction block connected to a lower surface of the heat-dissipation plate, and corresponding to the heat-dissipation opening. The adjustment frame is disposed on the heat-dissipation element to move the heat-dissipation element, and includes a pressing block corresponding to the guide element; and a blocking protrusion in the receiving cavity. When the communication module is in the receiving cavity, and adjacent to the blocking protrusion, the thermal-conduction block is separated from the communication module. After the communication module pushes the thermal-conduction block, the pressing block slides with the guide element to make the thermal-conduction block abutting the communication module through the heat-dissipation opening.

First claim

Opening claim text (preview).

What is claimed is: 1 . A communication socket comprising: a housing comprising a receiving cavity for a communication module, and a heat-dissipation opening connected to the receiving cavity; a heat-dissipation element comprising: a heat-dissipation plate placed on the housing; a guide element connected to the heat-dissipation plate; and a thermal-conduction block connected to a lower surface of the heat-dissipation plate, and located correspondingly to the heat-dissipation opening; and an adjustment frame disposed on the heat-dissipation element, the adjustment frame configured to move in an insertion direction of the communication module and to move the heat-dissipation element in the insertion direction of the communication module, and comprising: a pressing block corresponding to the guide element; and a blocking protrusion in the receiving cavity, wherein when the communication module is in the receiving cavity, and adjacent to the blocking protrusion of the adjustment frame, the thermal-conduction block of the heat-dissipation element is separated from the communication module, and after the communication module pushes the thermal-conduction block of the heat-dissipation element, the pressing block of the adjustment frame slides with the guide element of the heat-dissipation element to make the thermal-conduction block abutting the communication module through the heat-dissipation opening. 2 . The communication socket as claimed in claim 1 further comprising a connector disposed in the receiving cavity, wherein when the communication module is electrically connected to the connector, the thermal-conduction block abuts the communication module through the heat-dissipation opening. 3 . The communication socket as claimed in claim 2 , wherein the housing further comprises a through hole connected to the receiving cavity, the blocking protrusion protrudes into the receiving cavity through the through hole, and is close to the connector, a length of the through hole is greater than a length of the blocking protrusion, and the length of the through hole and the length of the blocking protrusion are measured in a same direction. 4 . The communication socket as claimed in claim 2 further comprising an elastic element abutting the adjustment frame, and close to the connector, wherein when the blocking protrusion is not being pushed by the communication module, the elastic element maintains the adjustment frame in an initial position wherein the thermal-conduction block is separated from the receiving cavity. 5 . The communication socket as claimed in claim 2 , wherein the connector is at a rear side of the housing, an insertion opening of the housing is defined at a front side of the housing, and the communication module is inserted into the receiving cavity through the insertion opening. 6 . The communication socket as claimed in claim 1 , wherein the heat-dissipation element further comprises a plurality of fins connected to an upper surface of the heat-dissipation plate. 7 . The communication socket as claimed in claim 1 , wherein the guide element further comprises an pressing surface which is inclined relative to the heat-dissipation plate, and when the communication module pushes the thermal-conduction block, the pressing block slides on the pressing surface. 8 . The communication socket as claimed in claim 1 , wherein the adjustment frame further comprises a lifting block located correspondingly to the guide element, when the adjustment frame is in an initial position, the lifting block maintains the heat-dissipation element in a lifting position, and the thermal-conduction block is separated from the receiving cavity. 9 . The communication socket as claimed in claim 8 , wherein the guide element further comprises a lifting surface which is inclined relative to the heat-dissipation plate, and when the heat-dissipation element is lifted from a pressing position to the lifting position, the lifting block slides on the lifting surface. 10 . The communication socket as claimed in claim 1 , wherein the guide element extends in the insertion direction, and connected to a side of the heat-dissipation plate. 11 . The communication socket as claimed in claim 1 , wherein the adjustment frame comprises a main rod, and a connection rod connected to the main rod, the main rod is adjacent to the guide element, the pressing block is connected to a side surface of the main rod, and the connection rod abuts an upper surface of the heat-dissipation plate. 12 . The communication socket as claimed in claim 11 , wherein the blocking protrusion is connected to a lower surface of the main rod. 13 . The communication socket as claimed in claim 1 further comprising a combination frame disposed on the housing, and restricting the heat-dissipation element and the adjustment frame on the housing. 14 . The communication socket as claimed in claim 13 , wherein the combination frame further comprises a main plate, the main plate comprises a locking hole, the housing comprises a locking structure, and the locking structure is fastened in the locking hole. 15 . The communication socket as claimed in claim 14 , wherein the combination frame further comprises an elastic sheet connected to the main plate, and abutting an upper surface of the heat-dissipation plate.

Assignees

Inventors

Classifications

  • Pressing means used to urge contact, e.g. springs · CPC title

  • of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627) · CPC title

  • Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title

  • G02B6/4269Primary

    with heat sinks or radiation fins · CPC title

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What does patent US12591097B2 cover?
A communication socket includes a housing, a heat-dissipation element, and an adjustment frame. The housing includes a receiving cavity, and a heat-dissipation opening connected to the receiving cavity. The heat-dissipation element includes a heat-dissipation plate on the housing; a guide element connected to the heat-dissipation plate; and a thermal-conduction block connected to a lower surfac…
Who is the assignee on this patent?
Nanning Fulian Fugui Prec Industrial Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02B6/4269. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 31 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).