Cooling system with intermediate chamber

Patent metadata

Field	Value
Publication number	US-12590716-B2
Application number	US-202118020410-A
Country	US
Kind code	B2
Filing date	Aug 11, 2021
Priority date	Aug 11, 2020
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

The present disclosure relates to a cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system. The cooling system includes an enclosure defining a fluid chamber, and the enclosure includes an evaporating surface configured to be in thermal communication with a liquid fluid in the fluid chamber and with an electronic component coupled to the enclosure, where the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid, such that the liquid fluid transitions to a vapor fluid within the fluid chamber, and includes a condensing surface configured to absorb thermal energy from the vapor fluid, such that the vapor fluid condenses into the liquid fluid within the fluid chamber. The cooling system also includes a heat rejection system coupled to an exterior surface of the enclosure, where the heat rejection system is configured to absorb thermal energy from the condensing surface.

First claim

The invention claimed is:

1 . A cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising:
an enclosure defining a fluid chamber and comprising:
an evaporating surface configured to be in thermal communication with a liquid fluid in the fluid chamber and with an electronic component of the HVAC&R system coupled to the enclosure, wherein the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid, such that the liquid fluid transitions to a vapor fluid within the fluid chamber; and
a condensing surface configured to absorb thermal energy from the vapor fluid, such that the vapor fluid condenses into the liquid fluid within the fluid chamber;
a heat rejection system coupled to an exterior surface of the enclosure, wherein the heat rejection system is configured to absorb thermal energy from the condensing surface; and a plurality of baffles positioned within the enclosure, wherein the plurality of baffles is configured to direct the vapor fluid toward the condensing surface, and each baffle of the plurality of baffles is sloped at a downward angle toward the condensing surface.

2 . The cooling system of claim 1 , wherein the heat rejection system comprises a plurality of fins.

3 . The cooling system of claim 2 , comprising a fan configured to force air across the plurality of fins.

4 . The cooling system of claim 2 , comprising an additional enclosure configured to guide air across the plurality of fins, wherein at least a portion of the cooling system is disposed within the additional enclosure.

5 . The cooling system of claim 1 , comprising an additional baffle positioned within the fluid chamber and configured to create a column of the liquid fluid within the fluid chamber and to direct the liquid fluid toward the evaporating surface.

6 . The cooling system of claim 5 , wherein the additional baffle is disposed above a bottom surface of the enclosure, relative to gravity, to form a gap between the additional baffle and the bottom surface.

7 . A cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising:
a heat rejection system; and an enclosure defining a fluid chamber configured to contain a fluid therein, wherein the enclosure comprises:
a first surface configured to be in thermal communication with an electronic component of the HVAC&R system coupled to the enclosure, wherein the first surface is configured to transfer thermal energy from the electronic component to the fluid to vaporize the fluid within the enclosure;
a second surface in thermal communication with the heat rejection system, wherein the second surface is configured to transfer thermal energy from the fluid to the heat rejection system to condense the fluid within the enclosure; and
a third surface opposite the second surface relative to the fluid chamber, wherein the third surface is angled toward the second surface to direct fluid vaporized in the fluid chamber from the first surface toward the second surface.

8 . The cooling system of claim 7 , wherein the heat rejection system comprises a plurality of fins coupled to an exterior surface of the enclosure on a lateral side of the enclosure.

9 . The cooling system of claim 8 , comprising a fan configured to direct an air flow across the plurality of fins, wherein the cooling system is configured to direct fluid vaporized in the fluid chamber in a first direction, the cooling system is configured to direct fluid condensed in the fluid chamber in a second direction, opposite the first direction, and the fan is configured to direct the air flow across the plurality of fins in the first direction.

10 . The cooling system of claim 9 , comprising:
a sensor configured to detect an operating parameter of the fluid within the fluid chamber and to output feedback indicative of the operating parameter; and a controller communicatively coupled to the sensor and to the fan, wherein the controller is configured to regulate operation of the fan in response to the feedback.

11 . The cooling system of claim 7 , wherein the first surface is a bottom surface of the enclosure, and the second surface extends crosswise to the first surface.

12 . The cooling system of claim 7 , comprising the electronic component coupled to the enclosure, wherein the first surface comprises an opening, and the electronic component is aligned with the opening such that at least a portion of the electronic component forms at least a portion of the first surface to enable direct contact between the electronic component and the fluid.

13 . A heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, comprising:
an electronic component of the HVAC&R system configured to generate heat during operation of the HVAC&R system; and a cooling system coupled to the electronic component, wherein the cooling system comprises:
an enclosure defining a fluid chamber configured to contain liquid fluid;
an evaporating surface of the enclosure in thermal communication with the electronic component, wherein the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid in the fluid chamber to vaporize the liquid fluid into a vapor fluid;
a condensing surface of the enclosure configured to be in thermal communication with a heat rejection system of the cooling system, wherein the condensing surface is configured to transfer thermal energy from the vapor fluid to the heat rejection system to condense the vapor fluid into the liquid fluid; and
a baffle disposed within the enclosure and configured to direct the vapor fluid from the evaporating surface toward the condensing surface, wherein the baffle is sloped at a downward angle toward the condensing surface.

14 . The HVAC&R system of claim 13 , wherein the evaporating surface is disposed on a first side of the enclosure, and the condensing surface is disposed on a second side, opposite the first side, of the enclosure.

15 . The HVAC&R system of claim 14 , comprising an additional baffle positioned within the enclosure and between the evaporating surface and the condensing surface, wherein the additional baffle is configured to create a column of the liquid fluid between the additional baffle and the condensing surface and to direct the liquid fluid from the condensing surface toward the evaporating surface.

16 . The HVAC&R system of claim 13 , wherein the enclosure comprises a pressure relief device configured to actuate in response to a pressure within the enclosure exceeding a predetermined threshold.

17 . The HVAC&R system of claim 13 , comprising the heat rejection system, wherein the heat rejection system comprises a plurality of fins coupled to the enclosure, and wherein the plurality of fins is configured to transfer thermal energy from the condensing surface to an air flow directed across the plurality of fins.

Assignees

• Johnson Controls Tyco IP Holdings LLP
• Tyco Fire & Security Gmbh

Inventors

• Nelson Cameron Stuart
• Kopko William Leslie

Classifications

• H05K7/20309

  Evaporators · CPC title

• H05K7/20263

  Heat dissipaters releasing heat from coolant · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• H05K7/20318

  Condensers · CPC title

• F25B7/00

  Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit (F25B9/00 takes precedence) · CPC title