Thermal conductive addition-curable silicone composition and cured product thereof
US-2025171673-A1 · May 29, 2025 · US
Phenol compound, conductive paste composition, method for producing conductive paste composition, conductive wire, and method for producing conductive wire
US12590219B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12590219-B2 |
| Application number | US-202418915566-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 15, 2024 |
| Priority date | Nov 20, 2020 |
| Publication date | Mar 31, 2026 |
| Grant date | Mar 31, 2026 |
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- Title
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Abstract
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A phenol compound represented by the following general formula (1A) makes it possible to provide a phenol compound as an additive for a conductive paste composition having a small decrease in electric conductivity in repetitive elongations and shrinkages and excellent printing processability, a conductive paste composition containing the additive, and a conductive wire made by using the conductive paste composition
First claim
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The invention claimed is: 1 . A phenol compound selected from the group consisting of the following formulae:
Assignees
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Classifications
for heat treatment · CPC title
comprising conductive layers or films on insulating-supports · CPC title
the conductive material comprising metals or alloys · CPC title
containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds · CPC title
characterised by the pigment · CPC title
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- What does patent US12590219B2 cover?
- A phenol compound represented by the following general formula (1A) makes it possible to provide a phenol compound as an additive for a conductive paste composition having a small decrease in electric conductivity in repetitive elongations and shrinkages and excellent printing processability, a conductive paste composition containing the additive, and a conductive wire made by using the conduct…
- Who is the assignee on this patent?
- Shinetsu Chemical Co
- What technology area does this patent fall under?
- Primary CPC classification C07F7/081. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 31 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).