Method for fabricating an assembly for a card and a card comprising a metallized film, a microcircuit card and an assembly for said card

Patent metadata

Field	Value
Publication number	US-12589583-B2
Application number	US-202318309040-A
Country	US
Kind code	B2
Filing date	Apr 28, 2023
Priority date	May 10, 2022
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

A method for fabricating a metallized assembly for a microcircuit card exhibiting a metallized effect, the assembly forming an internal layer of the card. The method comprises providing a support layer formed of a plastic material sensitive to heat exhibiting a first shrinkage ratio, the support layer having, on a surface, at least the dimensions of a microcircuit card, providing a metallized film held on a first non-adhesive bearing liner, the first non-adhesive bearing liner exhibiting a shrinkage ratio less than that of the support layer, transferring the metallized film onto the support layer by applying heat and pressure, and removing the first non-adhesive bearing liner. Also provided are a method for fabricating a microcircuit card and a microcircuit card obtained by this method.

First claim

The invention claimed is:

1 . A method for fabricating a metallized assembly for a microcircuit card having a metallized effect, the metallized assembly forming an internal layer of the microcircuit card, the method comprising
providing a support layer comprising a plastic material sensitive to heat and exhibiting a first shrinkage ratio, the support layer having, on a surface, at least dimensions of the microcircuit card, providing a metallized film held on a first non-adhesive bearing liner, the first non-adhesive bearing liner exhibiting a shrinkage ratio less than that of the support layer, transferring the metallized film onto the support layer by applying heat and pressure on the surface of the support layer, and removing the first non-adhesive bearing liner.

2 . The method of claim 1 , further comprising, prior to the transferring, passing the support layer and the metallized film between two rollers in a continuous manner, two plates in a sheet-by-sheet manner, or between a roller and a plate, wherein a dimension of a surface of each recited roller and of each recited plate is at least equal to a dimension of the microcircuit card.

3 . The method of claim 1 , wherein the transferring the metallized film is performed by applying heat and pressure on a surface covering at least all of the support layer.

4 . The method of claim 1 , wherein the transferring is performed at a temperature greater than a glass transition temperature of the support layer and is between 90° C. and 170° C.

5 . The method of claim 1 , wherein the support layer is made of a material selected from the group consisting of PVC, a mixture of PVC-ABS, PC, and PETg.

6 . The method of claim 1 , wherein the first non-adhesive bearing liner is made of PET.

7 . The method of claim 1 , further comprising
positioning at least one central layer covered by a print layer on a side of the support layer opposite to the metallized film, positioning a transparent overlay substrate on a side of the at least one central layer opposite to the support layer, the transparent overlay substrate being configured to form an outer face of the microcircuit card, positioning a second bearing liner on top of the metallized film, the second bearing liner exhibiting a shrinkage ratio less than that of the support layer, laminating at a temperature higher than a glass transition temperature of the support layer, and removing the second bearing liner.

8 . The method of claim 7 , wherein the second bearing liner is a sheet of PET.

9 . The method of claim 7 , further comprising printing on the metallized film.

10 . The method of claim 7 , further comprising depositing varnish on the metallized film.

11 . The method of claim 7 , further comprising adding a transparent overlay layer on the metallized film, and
laminating at a temperature lower than the glass transition temperature of the support layer.

12 . The method of claim 7 , wherein the at least one central layer covered by a print layer comprises a substrate comprising an antenna.

Assignees

• Idemia France

Inventors

• Pompeani Sylvie
• Guyon Le Bouffy Joseph

Classifications

• B32B7/028

  Heat-shrinkability · CPC title

• B32B37/0015

  to avoid warp or curl · CPC title

• B32B2255/205

  Metallic coating · CPC title

• B32B2425/00

  Cards, e.g. identity cards, credit cards · CPC title

• B32B2307/412

  Transparent · CPC title