Heating assembly, vaporizer, and electronic vaporization device

US12588705B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12588705-B2
Application numberUS-202218091991-A
CountryUS
Kind codeB2
Filing dateDec 30, 2022
Priority dateDec 30, 2021
Publication dateMar 31, 2026
Grant dateMar 31, 2026

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A heating assembly for an electronic vaporization device having an aerosol-generation substrate is disclosed. The heating assembly comprises a first substrate comprising a first surface and a second surface arranged opposite to each other, and a second substrate, comprising a third surface and a fourth surface arranged opposite to each other. The second surface and the third surface are arranged opposite to each other to form a gap having a capillary effect and a gradually changing height. An edge of the first substrate is provided with a liquid inlet formed thereon or by the edge of the first substrate with another component. The gap communicates the plurality of second micropores and the liquid inlet. The second substrate comprises a plurality of second micropores configured to guide the aerosol-generation substrate from the gap to the fourth surface.

First claim

Opening claim text (preview).

What is claimed is: 1 . A heating assembly for an electronic vaporization device having an aerosol-generation substrate, comprising: a first substrate, comprising a first surface and a second surface arranged opposite to each other; and a second substrate, comprising a third surface and a fourth surface arranged opposite to each other, wherein: the second surface and the third surface are arranged opposite to each other to form a gap having a capillary effect and a gradually changing height from a first end of the gap to a second end of the gap, an edge of the first substrate is provided with a liquid inlet formed thereon or by the edge of the first substrate with another component, the gap communicates the plurality of second micropores and the liquid inlet, and the second substrate comprises a plurality of second micropores configured to guide the aerosol-generation substrate from the gap to the fourth surface. 2 . The heating assembly according to claim 1 , wherein: the first substrate comprises a plurality of first micropores configured to guide the aerosol-generation substrate from the first surface to the second surface, and the gap communicates the plurality of first micropores and the plurality of second micropores. 3 . The heating assembly according to claim 1 , wherein: the second substrate comprises a vaporization region and a non-vaporization region, and the heating assembly further comprises a heating component arranged on the fourth surface and corresponding to the vaporization region to heat and vaporize the aerosol-generation substrate. 4 . The heating assembly according to claim 1 , wherein: the second substrate comprises a vaporization region and a non-vaporization region, and at least a part of the vaporization region of the second substrate comprises a conductive function to heat and vaporize the aerosol-generation substrate. 5 . The heating assembly according to claim 1 , wherein the height of the gap corresponding to the vaporization region is less than 30 μm. 6 . The heating assembly according to claim 5 , wherein the height of the gap corresponding to the vaporization region is less than 5 μm. 7 . The heating assembly according to claim 5 , wherein the third surface is provided with a groove structure, and the height of the gap corresponding to the vaporization region is less than 30 μm. 8 . The heating assembly according to claim 5 , wherein the third surface is a flat surface and the height of the gap is less than 20 μm. 9 . The heating assembly according to claim 1 , wherein both the second surface and the third surface are flat surfaces; or one of the second surface and the third surface is a flat surface, and the other is a curved surface; or one of the second surface and the third surface is a flat surface, and the other is a step surface. 10 . The heating assembly according to claim 1 , wherein: the first substrate has a first direction and a second direction that are perpendicular to each other, the height of the gap is gradually increased in the first direction, and the edge of the first substrate is provided with two liquid inlets disposed on two opposite sides of the first substrate in the first direction or in the second direction. 11 . The heating assembly according to claim 1 , further comprising at least a spacer arranged between the second surface and the third surface and at at least one of the edge of the first substrate and an edge of the second substrate, wherein the first substrate and the second substrate are arranged opposite to each other to form the gap. 12 . The heating assembly according to claim 11 wherein the spacer is a gasket; or the spacer is a support column, a support frame, or a coating fixed to the second surface and/or the third surface; or the spacer is a protrusion integrally formed with the first substrate and/or the second substrate. 13 . The heating assembly according to claim 11 , wherein the first substrate abuts against an edge of one end of the second substrate, and the spacer is arranged between the first substrate and an edge of the other end of the second substrate. 14 . The heating assembly according to claim 11 , wherein the spacers respectively arranged at the edges of the first substrate and the second substrate have different heights. 15 . The heating assembly according to claim 1 wherein: the spacer comprises a plurality of first sub-spacers and a plurality of second sub-spacers, heights of the plurality of first sub-spacers and the plurality of second sub-spacers are different, the plurality of first sub-spacers are spaced and arranged at one of an edge of one end of the first substrate and an edge of one end of the second substrate, and the plurality of second sub-spacers are spaced and arranged at one of an edge of the other end of the first substrate and an edge of the other end of the second substrate. 16 . The heating assembly according to claim 1 , further comprising: a fixing member having a liquid supplying hole; and a fixing structure arranged on a wall of the liquid supplying hole to fix at least one of the first substrate and the second substrate so that the first substrate and the second substrate form the gap, wherein at least a part of the edge of the first substrate and the wall of the liquid supplying hole are spaced to form the liquid inlet, and the second substrate crosses the liquid supplying hole. 17 . The heating assembly according to claim 2 , wherein the plurality of second micropores have a capillary force greater than a capillary force of the plurality of first micropores. 18 . The heating assembly according to claim 2 , wherein the plurality of second micropores are straight through holes running through the third surface and the fourth surface. 19 . The heating assembly according to claim 18 , wherein the plurality of first micropores are straight through holes running through the first surface and the second surface. 20 . The heating assembly according to claim 19 , wherein a pore size of each of the plurality of first micropores ranges from 10 μm to 150 μm. 21 . The heating assembly according to claim 1 , wherein the liquid inlet includes a through hole disposed on the edge of the first substrate. 22 . The heating assembly according to claim 1 , wherein both the first substrate and the second substrate are plate structures, and a thickness of the first substrate ranges from 0.1 mm to 1 mm, and a thickness of the second substrate ranges from 0.1 mm to 1 mm. 23 . A vaporizer, comprising: a liquid storage cavity, configured to store an aerosol-generation substrate; and a heating assembly, comprising: a first substrate, comprising a first surface and a second surface arranged opposite to each other; and a second substrate, comprising a third surface and a fourth surface arranged opposite to each other, wherein: the second surface and the third surface are arranged opposite to each other to form a gap having a capillary effect and a gradually changing height from a first end of the gap to a second end of the gap, an edge of the first substrate is provided with a liquid inlet formed thereon or by the edge of the first substrate with another component, the gap communicates the plurality of second micropores and the liquid inlet, and the second substrate comprises a plurality of second micropores configured to guide the aerosol-generation substrate from the gap t

Assignees

Inventors

Classifications

  • Heaters specially adapted for heating liquids · CPC title

  • Heater elements structurally combined with coupling elements or holders · CPC title

  • Wicks · CPC title

  • A24F40/10Primary

    Devices using liquid inhalable precursors · CPC title

  • Valves; Apertures · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12588705B2 cover?
A heating assembly for an electronic vaporization device having an aerosol-generation substrate is disclosed. The heating assembly comprises a first substrate comprising a first surface and a second surface arranged opposite to each other, and a second substrate, comprising a third surface and a fourth surface arranged opposite to each other. The second surface and the third surface are arrange…
Who is the assignee on this patent?
Shenzhen Smoore Technology Ltd
What technology area does this patent fall under?
Primary CPC classification A24F40/10. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Mar 31 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).