Gas collection apparatus

Patent metadata

Field	Value
Publication number	US-12588163-B2
Application number	US-202218550265-A
Country	US
Kind code	B2
Filing date	Mar 11, 2022
Priority date	Mar 12, 2021
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

This application relates to the field of liquid cooling technologies, and provides a gas collection apparatus, configured to collect bubbles generated due to loss of a working medium in a liquid cooling apparatus. The gas collection apparatus includes a cooling plate. The cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and at least one connecting channel configured to connect the first flow channel and the second flow channel. The at least one connecting channel is configured to transfer, to the second flow channel, bubbles carried when the working medium flows in the first flow channel. The at least one gas collection structure is configured to collect the bubbles from the second flow channel.

First claim

What is claimed is:

1 . A gas collection apparatus, comprising:
a cooling plate, wherein the cooling plate comprises at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and multiple connecting channels configured to couple the first flow channel and the second flow channel, wherein each of the multiple connecting channels is configured to transfer, to the second flow channel, bubbles carried when a working medium flows in the first flow channel, wherein the at least one gas collection structure is configured to collect the bubbles from the second flow channel, and wherein an inclination angle between the each of the connecting channels and a flow direction of the working medium in the first flow channel is greater than 90 degrees.

2 . The gas collection apparatus according to claim 1 , wherein local resistance to the working medium in a process of flowing in the second flow channel is greater than local resistance to the working medium in a process of flowing in the first flow channel.

3 . The gas collection apparatus according to claim 2 , wherein the local resistance to the working medium in the process of flowing in the second flow channel may be generated by changing a cross section of the each of the multiple connecting channels or increasing a quantity of bifurcation and confluence points in the second flow channel.

4 . The gas collection apparatus according to claim 1 , wherein a structural form of the each of the multiple connecting channels is a connecting pipeline, one end of the connecting pipeline is coupled to a local high point of the first flow channel, and the other end of the connecting pipeline is coupled to the second flow channel.

5 . The gas collection apparatus according to claim 1 , wherein a structural form of the each of the multiple connecting channels is a connecting opening, the connecting opening is located at a local high point of the first flow channel, one side of the connecting opening is coupled to the first flow channel, and the other side of the connecting opening is coupled to the second flow channel.

6 . The gas collection apparatus according to claim 4 , wherein a cross section of the connecting pipeline is smaller than a cross section of the first flow channel and a cross section of the second flow channel.

7 . The gas collection apparatus according to claim 1 , wherein the at least one gas collection structure is a barb structure, a circular structure, or a maze structure.

8 . The gas collection apparatus according to claim 1 , wherein the at least one gas collection structure comprises a plurality of barrier strips, and the plurality of barrier strips are configured to increase local resistance to the working medium in a process of flowing in the second flow channel.

9 . An electronic device, comprising:
a power component; a liquid cooling apparatus, wherein the power component generates heat in a working state, and the liquid cooling apparatus transfers the heat to the outside; and a gas collection apparatus, wherein the gas collection apparatus is located inside the liquid cooling apparatus, and is configured to collect bubbles in the liquid cooling apparatus, wherein the gas collection apparatus includes a cooling plate, wherein the cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and multiple connecting channels configured to couple the first flow channel and the second flow channel, wherein each of the multiple connecting channels is configured to transfer, to the second flow channel, bubbles carried when a working medium flows in the first flow channel, wherein the at least one gas collection structure is configured to collect the bubbles from the second flow channel, and wherein an inclination angle between the each of the connecting channels and a flow direction of the working medium in the first flow channel is greater than 90 degrees.

10 . The electronic device according to claim 9 , wherein local resistance to the working medium in a process of flowing in the second flow channel is greater than local resistance to the working medium in a process of flowing in the first flow channel.

11 . The electronic device according to claim 10 , wherein the local resistance to the working medium in the process of flowing in the second flow channel may be generated by changing a cross section of the each of the multiple connecting channels or increasing a quantity of bifurcation and confluence points in the second flow channel.

12 . The electronic device according to claim 9 , wherein a structural form of the each of the multiple connecting channels is a connecting pipeline, one end of the connecting pipeline is coupled to a local high point of the first flow channel, and the other end of the connecting pipeline is coupled to the second flow channel.

13 . The electronic device according to claim 9 , wherein a structural form of the each of the multiple connecting channels is a connecting opening, the connecting opening is located at a local high point of the first flow channel, one side of the connecting opening is coupled to the first flow channel, and the other side of the connecting opening is coupled to the second flow channel.

14 . The electronic device according to claim 12 , wherein a cross section of the connecting pipeline is smaller than a cross section of the first flow channel and a cross section of the second flow channel.

15 . The electronic device according to claim 9 , wherein the at least one gas collection structure is a barb structure, a circular structure, or a maze structure.

16 . The electronic device according to claim 9 , wherein the at least one gas collection structure comprises a plurality of barrier strips, and the plurality of barrier strips are configured to increase local resistance to the working medium in a process of flowing in the second flow channel.

Assignees

• Huawei Tech Co Ltd

Inventors

• Wu Huipeng
• Huang Xinpei
• Liu Tao
• Zhou Along
• Shi Jian

Classifications

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• F28D15/046

  characterised by the material or the construction of the capillary structure · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• F28D15/0233

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title