Radio frequency transmission circuit board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12588138-B2
Application number	US-202418618153-A
Country	US
Kind code	B2
Filing date	Mar 27, 2024
Priority date	Mar 27, 2024
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

A radio frequency transmission circuit board has a bending portion, a signal transmitting portion and a signal receiving portion, and includes a first multilayer structure, a second multilayer structure, a third multilayer structure, a blind hole, a lens and an optical fiber. The blind hole extends from the second multilayer structure to the first multilayer structure. A reflective layer is arranged in the blind hole. The lens is embedded in the first multilayer structure and partially exposed in the blind hole. The optical fiber is embedded in the first multilayer structure and connected to the lens. The bending portion does not include the second multilayer structure and the third multilayer structure. The blind hole and the lens are located in the signal transmitting portion. The optical fiber is located in the bending portion.

First claim

What is claimed is:

1 . A radio frequency transmission circuit board, having a bending portion, a signal transmitting portion and a signal receiving portion, wherein the bending portion is respectively connected to and is located between the signal transmitting portion and the signal receiving portion, and the radio frequency transmission circuit board comprises:
a first multilayer structure, comprising:
a first dielectric layer; and
two first metal layers, wherein the first dielectric layer is respectively connected to and is located between the two first metal layers;
a second multilayer structure, comprising:
a second dielectric layer; and
a second metal layer arranged on the second dielectric layer;
a third multilayer structure, comprising:
a third dielectric layer; and
a third metal layer arranged on the third dielectric layer;
a first bonding layer arranged between the first multilayer structure and the second multilayer structure, and bonding one of the two first metal layers to the second dielectric layer; a second bonding layer arranged between the first multilayer structure and the third multilayer structure, and bonding the other of the two first metal layers to the third dielectric layer; a blind hole extends from the second metal layer to the first dielectric layer, wherein a reflective layer is arranged at a bottom end of the blind hole; a lens embedded in the first multilayer structure, wherein the lens is partially exposed in the blind hole; an active component electrically connected to the second metal layer and aligned with the blind hole; a chip electrically connected to the second metal layer; an optical fiber embedded in the first multilayer structure, wherein the optical fiber has a first end and a second end opposite to the first end, and the first end is connected to the lens; an optoelectronic coupling component embedded in the first multilayer structure and connected to the second end of the optical fiber, wherein the optoelectronic coupling component is electrically connected to the one of the two first metal layers; and an antenna component electrically connected to the one of the two first metal layers; wherein the bending portion does not comprise the second multilayer structure and the third multilayer structure; wherein the blind hole, the lens, the active component and the chip are located in the signal transmitting portion, the optical fiber is located in the bending portion, and the optoelectronic coupling component and the antenna component are located in the signal receiving portion.

2 . The radio frequency transmission circuit board of claim 1 , wherein the bending portion is without the first bonding layer.

3 . The radio frequency transmission circuit board of claim 2 , further comprising two covering films, wherein one of the two covering films covers the one of the two first metal layers and the second metal layer, and the other of the two covering films covers the second bonding layer and the third metal layer.

4 . The radio frequency transmission circuit board of claim 1 , wherein a material of the reflective layer comprises at least one of gold, silver, titanium and chromium.

5 . The radio frequency transmission circuit board of claim 1 , wherein a distance between the active component and the chip is 2 mm to 10 mm.

6 . The radio frequency transmission circuit board of claim 1 , wherein each of materials of the first dielectric layer, the second dielectric layer and the third dielectric layer comprises at least one of modified polyimide, liquid crystal polymer and polytetraethylene.

7 . A manufacturing method of a radio frequency transmission circuit board, comprising:
embedding an optical fiber, a lens and an optoelectronic coupling component in a first multilayer structure, wherein the optical fiber has a first end and a second end opposite to the first end, the first end is connected to the lens, the second end is connected to the optoelectronic coupling component, and the optoelectronic coupling component is electrically connected to one of two first metal layers of the first multilayer structure; bonding a second multilayer structure to the first multilayer structure through a first bonding layer, wherein the first bonding layer is bonding the one of the two first metal layers to a second dielectric layer of the second multilayer structure; bonding a third multilayer structure to the first multilayer structure through a second bonding layer, wherein the second bonding layer is bonding the other of the two first metal layers to a third dielectric layer of the third multilayer structure; cutting the second multilayer structure and the third multilayer structure so as to make a portion of the first multilayer structure embedded with the optical fiber not to be covered by the second multilayer structure and the third multilayer structure; drilling the second multilayer structure and the first multilayer structure to form a blind hole, and the blind hole extending from a second metal layer of the second multilayer structure to a first dielectric layer of the first multilayer structure, wherein the second metal layer is arranged on the second dielectric layer, and the first dielectric layer is respectively connected to and is located between the two first metal layers; performing vacuum sputtering on the first dielectric layer so as to form a reflective layer at a bottom end of the blind hole; and disposing an active component, a chip and an antenna component, wherein the active component is electrically connected to the second metal layer and aligned with the blind hole, the chip is electrically connected to the second metal layer, and the antenna component is electrically connected to the one of the two first metal layers.

8 . The manufacturing method of the radio frequency transmission circuit board of claim 7 , wherein embedding the optical fiber, the lens and the optoelectronic coupling component in the first multilayer structure is to cut the first multilayer structure first to form a plurality of embedded holes on the first multilayer structure, and the optical fiber, the lens and the optoelectronic coupling component are disposed into the plurality of embedded holes.

9 . The manufacturing method of the radio frequency transmission circuit board of claim 7 , wherein before the second multilayer structure and the first multilayer structure are drilled, the one of the two first metal layers and the second metal layer are sequentially covered by a covering film and a sputtering protection film.

10 . The manufacturing method of the radio frequency transmission circuit board of claim 7 , wherein a material of the reflective layer comprises at least one of gold, silver, titanium and chromium.

11 . The manufacturing method of the radio frequency transmission circuit board of claim 7 , wherein after performing vacuum sputtering on the first dielectric layer, the blind hole is further enlarged to make the lens be partially exposed in the blind hole.

12 . The manufacturing method of the radio frequency transmission circuit board of claim 7 , wherein the portion of the first multilayer structure embedded with the optical fiber is not covered by the first bonding layer.

13 . The manufacturing method of the radio frequency transmission circuit board of claim 7 , wherein a distance between the active component and the chip is 2 mm to 10 mm.

14 . The manufacturing method of the radio frequency transmission circuit board of claim 7 , wherein a material of the first dielectric layer comprises at least one of modified polyimide, liquid crystal polymer

Assignees

• Qingding Prec Electronics Huaian Co Ltd
• Avary Holding Shenzhen Co Ltd
• Garuda Tech Co Ltd

Inventors

• Chen Kuan-Ying

Classifications

• G02B6/4293

  hybrid electrical and optical connections for transmitting electrical and optical signals · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/024

  Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title

• G02B6/4206

  Optical features (G02B6/4207, G02B6/421 take precedence) · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title