Fingerprint array structure, fingerprint sensor chip, and electronic device

Patent metadata

Field	Value
Publication number	US-12586406-B2
Application number	US-202418824471-A
Country	US
Kind code	B2
Filing date	Sep 4, 2024
Priority date	Dec 8, 2023
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

Disclosed in the present application is a fingerprint array structure, a fingerprint sensor chip, and an electronic device and relates to the technical field of fingerprint identification. The fingerprint array structure comprises a pixel array, a circuit layer and a plurality of connecting line groups, where the pixel array comprises a plurality of pixel groups, each pixel group comprises at least two pixel units, the circuit layer comprises a plurality of pixel circuits and a plurality of non-pixel circuits, at least one portion of a projection of the circuit layer perpendicularly facing the pixel array overlaps the pixel array, each pixel circuit is electrically connected to one pixel group through one connecting line group. According to the present application, the proportion of the pixel array of the present application is higher and the chip area is smaller on the condition that the size specifications of pixel arrays are the same.

First claim

What is claimed is:

1 . A fingerprint array structure, comprising:
a pixel array, wherein the pixel array comprises a plurality of pixel units arranged in an array, the plurality of pixel units are divided into a plurality of pixel groups, and each pixel group comprises at least two pixel units; a circuit layer, wherein the circuit layer comprises a plurality of pixel circuits and a plurality of non-pixel circuits, wherein projections of the non-pixel circuit and the pixel circuit perpendicularly facing the pixel array are all positioned on the pixel array; a shielding layer, and a projection of the shielding layer perpendicularly facing the pixel array at least partially overlaps the projection of the non-pixel circuit perpendicularly facing the pixel array, wherein the shielding layer comprises power supplies and ground networks, and the power supplies and the ground networks are spaced apart from each other in a long strip shape; and a plurality of connecting line groups, wherein each connecting line group comprises a plurality of connecting lines, each connecting line is connected to one pixel unit, and each pixel circuit is electrically connected to a plurality of pixel units of one pixel group through one connecting line group.

2 . The fingerprint array structure according to claim 1 , wherein the pixel units located on the same row or the same column of the pixel array constitute one pixel group.

3 . The fingerprint array structure according to claim 1 , wherein connecting terminals of the plurality of connecting line groups are positioned on the same end.

4 . The fingerprint array structure according to claim 3 , wherein connecting terminals of the plurality of connecting line groups are positioned on the outer side of an area where the pixel array is located.

5 . The fingerprint array structure according to claim 1 , wherein the shielding layer comprises power supplies.

6 . The fingerprint array structure according to claim 1 , wherein the shielding layer comprises ground networks.

7 . A fingerprint sensor chip, comprising the fingerprint array structure according to claim 1 .

8 . The fingerprint sensor chip according to claim 7 , wherein the area outside the fingerprint array structure is provided with an IO circuit.

9 . An electronic device, comprising the fingerprint sensor chip according to claim 7 .

Assignees

• Shenzhen Goodix Tech Co Ltd

Inventors

• Wang Chengzuo
• Liu Yuping

Classifications

• G06V40/1306 Primary

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title