Solid state cooling device
US-2018066875-A1 · Mar 8, 2018 · US
US12584663B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12584663-B2 |
| Application number | US-202218068544-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 20, 2022 |
| Priority date | Dec 20, 2022 |
| Publication date | Mar 24, 2026 |
| Grant date | Mar 24, 2026 |
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A system for magnetic refrigeration is provided. The system includes a layered structure formed by a sequence of a plurality of magnetocaloric material (MCM) components interlinked with a sequence of a plurality of Peltier modules. Each Peltier module of the plurality of Peltier modules is sandwiched between two MCM components of the plurality of MCM components. The system further includes a power source configured to concurrently power each Peltier module in the sequence of the plurality of Peltier modules. Current in each powered Peltier module flows in a constant direction. The system further includes a magnetic source configured to apply spatially uniform magnetic field to the sequence of the plurality of MCM components.
Opening claim text (preview).
The invention claimed is: 1 . A device for magnetic refrigeration, comprising: a layered structure formed by a sequence of a plurality of magnetocaloric material (MCM) components interlinked with a sequence of a plurality of Peltier modules, wherein each Peltier module of the plurality of Peltier modules is sandwiched between two MCM components of the plurality of MCM components and transfers heat between two adjacently arranged MCM components of the plurality of MCM components, wherein a first layer in the layered structure is a first MCM component in the sequence of the plurality of MCM components and a last layer in the layered structure is a last MCM component in the sequence of the plurality of MCM components, wherein the first MCM component and the last MCM component interact with hot and cold environments to enable transfer of heat between the hot and cold environments; a power source configured to concurrently power each Peltier module in the sequence of the plurality of Peltier modules, wherein current in each powered Peltier module flows in a constant direction; and a magnetic source configured to apply spatially uniform magnetic field to the sequence of the plurality of MCM components. 2 . The device of claim 1 , wherein at least the first MCM component and the last MCM component in the sequence of the plurality of MCM components possesses a porous structure. 3 . The device of claim 1 , wherein at least the first MCM component and the last MCM component in the sequence of the plurality of MCM components is coupled to a cooling unit, wherein the cooling unit includes at least one of: a pipe, a working fluid and a heat exchanger. 4 . The device of claim 1 , wherein the first MCM component or the last MCM component in the sequence of the plurality of MCM components receives air for cooling via a fan. 5 . The device of claim 1 , wherein a second layer in the layered structure is a first Peltier module, a third layer in the layered structure is a second MCM component and a fourth layer in the layered structure is a second Peltier module, and wherein the second MCM component is sandwiched between the first Peltier module and the second Peltier module. 6 . The device of claim 1 , wherein each MCM component of the plurality of MCM components is composed of a Gadolinium alloy. 7 . The device of claim 1 , wherein a number of the MCM components in the sequence of the plurality of MCM components is determined based on a required difference in temperature between the first MCM component and the last MCM component in the sequence of the plurality of MCM components. 8 . The device of claim 1 , wherein each Peltier module of the plurality of Peltier modules includes an n-doped semiconductor electrically connected with a p-doped semiconductor arranged in parallel with the n-doped semiconductor. 9 . The device of claim 8 , wherein the n-doped semiconductor and the p-doped semiconductor are at least one of: silicon based semiconductors or bismuth telluride based semiconductors. 10 . The device of claim 1 , wherein a thickness of each MCM component in the sequence of the plurality of MCM components is in a range of 0.1 centimeters (cm) to 1 cm. 11 . The device of claim 1 , wherein an amount of the current provided to each powered Peltier module is determined based on a number of the MCM components, and a coefficient of performance associated with the layered structure selected for the magnetic refrigeration. 12 . A method for magnetic refrigeration, comprising: forming a layered structure that includes a sequence of a plurality of magnetocaloric material (MCM) components interlinked with a sequence of a plurality of Peltier modules, wherein each Peltier module of the plurality of Peltier modules is sandwiched between two MCM components of the plurality of MCM components and transfers heat between two adjacently arranged MCM components of the plurality of MCM components, wherein a first layer in the layered structure is a first MCM component in the sequence of the plurality of MCM components and a last layer in the layered structure is a last MCM component in the sequence of the plurality of MCM components, wherein the first MCM component and the last MCM component interact with hot and cold environments to enable transfer of heat between the hot and cold environments; concurrently powering each Peltier module in the sequence of the plurality of Peltier modules by using a power source, wherein current in each powered Peltier module flows in a constant direction; and applying spatially uniform magnetic field to the sequence of the plurality of MCM components, by using a magnetic source. 13 . The method of claim 12 , wherein at least the first MCM component and the last MCM component in the sequence of the plurality of MCM components possesses a porous structure. 14 . The method of claim 12 , further comprising coupling a cooling unit to at least the first MCM component and the last MCM component in the sequence of the plurality of MCM components, wherein the cooling unit includes at least: a pipe, a working fluid and a heat exchanger. 15 . The method of claim 12 , further comprising receiving, by the first MCM component or the last MCM component in the sequence of the plurality of MCM components, air for cooling via a fan. 16 . The method of claim 12 , wherein a second layer in the layered structure is a first Peltier module, a third layer in the layered structure is a second MCM component and a fourth layer in the layered structure is a second Peltier module, and wherein the second MCM component is sandwiched between the first Peltier module and the second Peltier module. 17 . The method of claim 12 , further comprising determining a number of the MCM components in the sequence of the plurality of MCM components based on a required difference in temperature between the first MCM component and the last MCM component in the sequence of the plurality of MCM components. 18 . The method of claim 12 , further comprising determining an amount of the current provided to each powered Peltier module based on a number of the MCM components, and a coefficient of performance associated with the layered structure selected for the magnetic refrigeration.
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