Adhesive composition and film-shaped sealing material

Patent metadata

Field	Value
Publication number	US-12584050-B2
Application number	US-202318237950-A
Country	US
Kind code	B2
Filing date	Aug 25, 2023
Priority date	Sep 1, 2022
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

An adhesive composition, including: a reaction product (A) among a bifunctional epoxy resin represented by the formula (2), a tri- or more functional epoxy resin represented by the formula (3), and a saturated acid anhydride represented by the following general formula (4); a UV-sensitive reaction initiator (B); and a dilution solvent (C), wherein the component (A) is a compound represented by the formula (1), a ratio of a total mole of epoxy groups in the multi-functional epoxy resin to a mole of the saturated acid anhydride is 1.30 to 3.00, and a mole of the bifunctional epoxy resin relative to a total mole of the multi-functional epoxy resin is 0.001 to 0.15. This provides a highly reliable epoxy-resin-based adhesive composition and film-shaped sealing material having a low viscosity, curability at low temperature, and high adhesiveness, and retaining power generation performance of a perovskite solar cell before and after sealing.

First claim

The invention claimed is:

1 . An adhesive composition, comprising:
a reaction product (A) among a bifunctional epoxy resin represented by the following general formula (2), a tri- or more functional epoxy resin represented by the following general formula (3), and a saturated acid anhydride represented by the following general formula (4); a UV-sensitive reaction initiator (B); and a dilution solvent (C), wherein the component (A) is a compound represented by the following general formula (1), wherein the adhesive composition further contains a reaction product represented by the following general formula (5) in which the compound represented by the general formula (1) is reacted with an alkoxysilane compound represented by the following general formula (6) or a partially hydrolyzed products thereof,

wherein A represents a saturated divalent hydrocarbon group; B each independently represents a group represented by the general formula (1a) or the general formula (1b); R 2 represents a substituted or unsubstituted divalent organic group having an aliphatic hydrocarbon group, an aromatic ring, or a heteroring; R 3 represents a substituted or unsubstituted tri- or more valent organic group having an aliphatic hydrocarbon group, an aromatic ring, or a heteroring; Z each independently represents a single bond or an oxygen atom; “k” represents an integer of 2 or more; “*” represents an attachment point, and an order of the repeating unit “1” and the repeating unit “m” may be any,

wherein R 2 and Z are same as above,

wherein R 3 , Z, and “k” are same as above,

wherein A is same as above, and

wherein A, R 2 , R 3 , Z, “k”, and “are same as above; B′ each independently represents a group represented by the general formula (5a) or the general formula (5b); Z′ each independently represents R 4 (OR 5 )2Si— or a group derived from the partially hydrolyzed product of the alkoxysilane compound represented by the general formula (6); R 4 represents a monovalent organic group having a vinyl group, a styryl group, an acryl group, a methacryl group, an amino group, a mercapto group, a ureido group, or an isocyanate group; and R 5 represents a monovalent organic group having a methyl group, an ethyl group, a propyl group, or an isopropyl group; and wherein
amounts of the bifunctional epoxy resin, the tri- or more functional epoxy resin, and the saturated acid anhydride are such that a ratio of a total number of moles of epoxy groups in the bifunctional epoxy resin and the tri- or more functional epoxy resin to a number of moles of the saturated acid anhydride is 1.30 to 3.00, and such that a number of moles of the bifunctional epoxy resin relative to a total number of moles of the bifunctional epoxy resin and the tri- or more functional epoxy resin is 0.001 to 0.15.

2 . The adhesive composition according to claim 1 , wherein the reaction product is a polymer polymerized with the bifunctional epoxy resin, the tri- or more functional epoxy resin, and the saturated acid anhydride, and a weight-average molecular weight of the polymer is 2000 to 20000, wherein the weight-average molecular weight is measured by gel permeation chromatography (GPC) in terms of polystyrene standard using a solvent of tetrahydrofuran.

3 . The adhesive composition according to claim 1 , wherein the bifunctional epoxy resin is a BisA epoxy resin represented by the following general formula (2′), the tri- or more functional epoxy resin is a triazine-ring trifunctional epoxy resin represented by the following general formula (3′), and the saturated acid anhydride is a saturated-hydrocarbon acid anhydride represented by the following general formula (4′),

wherein “n” represents an integer of 1 or more

4 . The adhesive composition according to claim 2 , wherein the bifunctional epoxy resin is a BisA epoxy resin represented by the following general formula (2′), the tri- or more functional epoxy resin is a triazine-ring trifunctional epoxy resin represented by the following general formula (3′), and the saturated acid anhydride is a saturated-hydrocarbon acid anhydride represented by the following general formula (4′),

wherein “n” represents an integer of 1 or more

5 . A film-shaped sealing material, comprising a dried solid of the adhesive composition according to claim 1 .

6 . A film-shaped sealing material, comprising a dried solid of the adhesive composition according to claim 2 .

7 . A film-shaped sealing material, comprising a dried solid of the adhesive composition according to claim 3 .

8 . The film-shaped sealing material according to claim 5 , further comprising a residual solvent, wherein the residual solvent is dimethylformamide and/or dimethyl sulfoxide, and a residual amount thereof per mass of the film-shaped sealing material is 5000 ppm or less.

9 . The film-shaped sealing material according to claim 6 , further comprising a residual solvent, wherein the residual solvent is dimethylformamide and/or dimethyl sulfoxide, and a residual amount thereof per mass of the film-shaped sealing material is 5000 ppm or less.

10 . The film-shaped sealing material according to claim 7 , further comprising a residual solvent, wherein the residual solvent is dimethylformamide and/or dimethyl sulfoxide, and a residual amount thereof per mass of the film-shaped sealing material is 5000 ppm or less.

Assignees

• Shinetsu Chemical Co

Inventors

• Kusunoki Takayuki
• Ando Masao
• Ichiroku Nobuhiro
• Nakagawa Hideo
• Wakamiya Atsushi
• Matsushige Yuko

Classifications

• C09J11/06

  organic · CPC title

• C09J2301/408

  additives as essential feature of the adhesive layer · CPC title

• C09J2301/312

  parameters being the characterizing feature · CPC title

• C09J2203/33

  for batteries or fuel cells · CPC title

• C09J7/30

  characterised by the adhesive composition · CPC title