Control device for injection molding machine and control method for injection molding machine

US12583155B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12583155-B2
Application numberUS-202218059062-A
CountryUS
Kind codeB2
Filing dateNov 28, 2022
Priority dateDec 3, 2021
Publication dateMar 24, 2026
Grant dateMar 24, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention offers a technique for providing assistance in setting at least one of the temperature of a nozzle and the temperature of a cylinder. A control device for an injection molding machine includes a monitoring part configured to monitor, during a filling step of filling the inside of a mold device with a molding material, a change in the filling pressure acting on the molding material.

First claim

Opening claim text (preview).

What is claimed is: 1 . A control device for an injection molding machine, the control device comprising: processing circuitry configured to monitor, during a filling step of filling an inside of a mold device with a molding material, a change in a filling pressure acting on the molding material, wherein the processing circuitry is configured to monitor, as the change in the filling pressure, at least one of whether the filling pressure peaks when a foremost position of the molding material is forced out of a nozzle provided at a tip of a cylinder to inject the molding material into the mold device or whether there is a pulsation of the filling pressure, the pulsation being recurring small peaks and small valleys of the filling pressure, during the filling step. 2 . The control device for the injection molding machine according to claim 1 , wherein the processing circuitry is further configured to determine an adequacy of at least one of a temperature of the nozzle or a temperature of the cylinder, based on the monitored change in the filling pressure. 3 . The control device for the injection molding machine according to claim 1 , wherein the processing circuitry is configured to monitor a peak of the filling pressure caused by nozzle clogging at an early stage of the filling step in a case of monitoring whether the filling pressure peaks when the foremost position of the molding material is forced out of the nozzle, the nozzle clogging being a phenomenon in which the molding material is not injected from the nozzle even when the filling step is started and an injection member is moved forward. 4 . The control device for the injection molding machine according to claim 1 , wherein the processing circuitry is further configured to change a setting of at least one of a temperature of the nozzle or a temperature of the cylinder, based on the monitored change in the filling pressure. 5 . The control device for the injection molding machine according to claim 4 , wherein the processing circuitry is configured to change the setting of the temperature higher when the filling pressure peaks during the filling step. 6 . The control device for the injection molding machine according to claim 5 , wherein an amount of changing the setting of the temperature corresponds to a height of the peak of the filling pressure. 7 . The control device for the injection molding machine according to claim 6 , wherein the amount of changing the setting of the temperature increases as the height of the peak increases. 8 . The control device for the injection molding machine according to claim 4 , wherein the processing circuitry is configured to change the setting of the temperature lower when the filling pressure pulsates during the filling step. 9 . The control device for the injection molding machine according to claim 8 , wherein an amount of changing the setting of the temperature corresponds to an amplitude of the pulsation of the filling pressure. 10 . The control device for the injection molding machine according to claim 9 , wherein the amount of changing the setting of the temperature increases as the amplitude of the pulsation increases. 11 . The control device for the injection molding machine according to claim 1 , wherein the processing circuitry is further configured to display, on a display device, a waveform of actual values of the filling pressure as a result of monitoring the change in the filling pressure and an ideal waveform of the filling pressure. 12 . A method of controlling an injection molding machine, the method comprising monitoring, during a filling step of filling an inside of a mold device with a molding material, a change in a filling pressure acting on the molding material, wherein said monitoring monitors, as the change in the filling pressure, at least one of whether the filling pressure peaks when a foremost position of the molding material is forced out of a nozzle provided at a tip of a cylinder to inject the molding material into the mold device or whether there is a pulsation of the filling pressure, the pulsation being recurring small peaks and small valleys of the filling pressure, during the filling step.

Assignees

Inventors

Classifications

  • controlling the temperature or heat-transfer in fluid injection nozzles · CPC title

  • derivative, change thereof · CPC title

  • Display units or mountings therefor; Switch cabinets · CPC title

  • of velocity or pressure of moulding material · CPC title

  • Drive means therefor · CPC title

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Frequently asked questions

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What does patent US12583155B2 cover?
The present invention offers a technique for providing assistance in setting at least one of the temperature of a nozzle and the temperature of a cylinder. A control device for an injection molding machine includes a monitoring part configured to monitor, during a filling step of filling the inside of a mold device with a molding material, a change in the filling pressure acting on the molding …
Who is the assignee on this patent?
Sumitomo Heavy Industries
What technology area does this patent fall under?
Primary CPC classification B29C45/78. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 24 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).