Light-emitting diode packages with directional emission intensity and color uniformity

Patent metadata

Field	Value
Publication number	US-12581997-B2
Application number	US-202217657236-A
Country	US
Kind code	B2
Filing date	Mar 30, 2022
Priority date	Mar 30, 2022
Publication date	Mar 17, 2026
Grant date	Mar 17, 2026

Abstract

Light-emitting diode (LED) packages and more particularly LED packages with directional emission intensity and color uniformity are disclosed. LED packages include one or more LED chips on a submount with arrangements of light-altering materials and lumiphoric material layers that provide directional light emissions with improved color over angle uniformity. Light-altering materials are provided that cover sidewalls of LED chips while lumiphoric material layers cover LED chips and light-altering materials. Such LED packages may avoid the need to include encapsulation materials and/or lenses that would otherwise cover the lumiphoric material layers. As such, exterior light-exiting faces of LED packages are formed by surfaces of lumiphoric material layers.

First claim

What is claimed is:

1 . A light-emitting diode (LED) package comprising:
a submount comprising a first side and a second side that opposes the first side, the first side comprising metal traces, and the second side comprising package bond pads that are electrically coupled to the metal traces; at least one LED chip including a first side and a second side that is mounted on and electrically coupled to the metal traces; and a lumiphoric material layer on the at least one LED chip such that a surface of the lumiphoric material layer forms an exterior light-exiting face for the LED package and a perpendicular distance from the first side of the LED chip to the exterior light-exiting face is no more than 100 microns (μm), and a total height of the LED package as measured from a mounting surface of the package bond pads to the exterior light-exiting face is no more than 900 μm.

2 . The LED package of claim 1 , wherein the perpendicular distance from the first side of the LED chip to the exterior light-exiting face is in a range from 50 μm to 100 μm.

3 . The LED package of claim 1 , further comprising a light-altering material on portions of the submount that are adjacent the at least one LED chip, wherein the light-altering material is arranged between the lumiphoric material layer and the submount.

4 . The LED package of claim 3 , wherein a height of the light-altering material above the submount decreases in a lateral direction away from the at least one LED chip.

5 . The LED package of claim 4 , wherein the lumiphoric material layer extends on a portion of the light-altering material with the height that decreases in the lateral direction away from the at least one LED chip such that a portion of the lumiphoric material layer is closer to the submount than the first side of the at least one LED chip.

6 . The LED package of claim 1 , wherein the total height is in a range from 600 μm to 800 μm.

7 . The LED package of claim 1 , wherein the exterior light-exiting face for the LED package is configured to form an interface with an ambient atmosphere that is separate from the LED package.

8 . The LED package of claim 1 , wherein the lumiphoric material layer comprises phosphor particles in a binder with a volume percentage of phosphor particles in a range from 25% to 45%.

9 . A light-emitting diode (LED) package comprising:
a submount comprising a first side and a second side that opposes the first side, the first side comprising metal traces, and the second side comprising package bond pads that are electrically coupled to the metal traces; at least one LED chip including a first side and a second side that is mounted on and electrically coupled to the metal traces; a lumiphoric material layer on the at least one LED chip such that a surface of the lumiphoric material layer forms an exterior light-exiting face for the LED package and a perpendicular distance from the first side of the LED chip to the exterior light-exiting face is no more than 100 microns (μm); and a light-altering material on portions of the submount that are adjacent the at least one LED chip, wherein the light-altering material is arranged between the lumiphoric material layer and the submount and a height of the light-altering material above the submount decreases in a lateral direction away from the at least one LED chip, and wherein the lumiphoric material layer extends on a portion of the light-altering material with the height that decreases in the lateral direction away from the at least one LED chip such that a portion of the lumiphoric material layer is closer to the submount than the first side of the at least one LED chip.

10 . The LED package of claim 9 , wherein the perpendicular distance from the first side of the LED chip to the exterior light-exiting face is in a range from 50 μm to 100 μm.

11 . The LED package of claim 10 , wherein a total height of the LED package as measured from a mounting surface of the package bond pads to the exterior light-exiting face is no more than 900 μm.

12 . The LED package of claim 11 , wherein the total height is in a range from 600 μm to 800 μm.

13 . The LED package of claim 9 , wherein the exterior light-exiting face for the LED package is configured to form an interface with an ambient atmosphere that is separate from the LED package.

14 . The LED package of claim 9 , wherein the lumiphoric material layer comprises phosphor particles in a binder with a volume percentage of phosphor particles in a range from 25% to 45%.

Assignees

• Creeled Inc

Inventors

• Francis Aaron
• Miller Derek

Classifications

• H10H20/8512

  Wavelength conversion materials · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/882

  Scattering means (H10H20/82 takes precedence) · CPC title

• H10H20/853

  characterised by their shape · CPC title

• H10H20/851

  Wavelength conversion means · CPC title