Light source module and display device

Patent metadata

Field	Value
Publication number	US-12581783-B2
Application number	US-202217759646-A
Country	US
Kind code	B2
Filing date	Jul 5, 2022
Priority date	Jun 16, 2022
Publication date	Mar 17, 2026
Grant date	Mar 17, 2026

Abstract

The embodiment of the disclosure provides a light source module and a display device. The light source module includes a substrate, a pad, a light emitting unit, and a cover layer, and at least one opening is provided on the pad. The opening and a via hole are provided on the pad. A cover layer is provided on the substrate. Metal material with good heat dissipation performance is filled in the corresponding opening or via hole. When the light emitting unit operates for a long time, the display device has a good heat dissipation effect, thereby improving the comprehensive performance.

First claim

What is claimed is:

1 . A light source module comprising:
a substrate; a pad portion disposed on the substrate, wherein the pad portion comprises a first pad and a second pad, a gap is formed between the first pad and the second pad, the first pad is provided with at least one first opening, and the second pad is provided with at least one second opening symmetrical to the at least one first opening about the gap; and a light emitting device disposed at least on the first pad and the second pad, the pad portion further comprises a first back pad and a second back pad that are disposed on a side of the substrate away from the light emitting device to be opposite to the first pad and the second pad, respectively; and the light source module further comprises a first via hole extending through the first pad, the substrate and the first back pad, and a second via hole extending through the second pad, the substrate and the second back pad, and each of the first via hole and the second via hole is filled with thermally conductive metal material; the first pad comprises a first flat portion and a first annular portion surrounding and electrically connected to the first flat portion; the at least one first opening comprises two first openings disposed in a region between the first annular portion and the first flat portion to be centrally symmetric about a center of the first pad; and the second pad comprises a second flat portion and a second annular portion surrounding and electrically connected to the second flat portion; and the at least one second opening comprises two second openings disposed in a region between the second annular portion and the second flat portion to be centrally symmetric about a center of the second pad.

2 . The light source module according to claim 1 , wherein the at least one first opening extends from a side edge of the first pad close to the gap toward a middle region of the first pad, and the at least one second opening extends from a side edge of the second pad close to the gap toward a middle region of the second pad.

3 . The light source module according to claim 1 , wherein an area of the first back pad is smaller than an area of the first pad, and an area of the second back pad is smaller than an area of the second pad.

4 . A light source module comprising:
a substrate; a pad portion disposed on the substrate, wherein the pad portion comprises a first pad and a second pad, a gap is formed between the first pad and the second pad, the first pad is provided with at least one first opening, and the second pad is provided with at least one second opening; and a light emitting device disposed at least on the first pad and the second pad, wherein the pad portion further comprises a first back pad and a second back pad that are disposed on a side of the substrate away from the light emitting device to be opposite to the first pad and the second pad, respectively; and the light source module further comprises a first via hole extending through the first pad, the substrate and the first back pad, and a second via hole extending through the second pad, the substrate and the second back pad, and each of the first via hole and the second via hole is filled with thermally conductive metal material; the first pad comprises a first flat portion and a first annular portion surrounding and electrically connected to the first flat portion; the at least one first opening comprises two first openings disposed in a region between the first annular portion and the first flat portion to be centrally symmetric about a center of the first pad; and the second pad comprises a second flat portion and a second annular portion surrounding and electrically connected to the second flat portion; and the at least one second opening comprises two second openings disposed in a region between the second annular portion and the second flat portion to be centrally symmetric about a center of the second pad.

5 . The light source module according to claim 4 , wherein the at least one first opening extends from a side edge of the first pad close to the gap toward a middle region of the first pad, and the at least one second opening extends from a side edge of the second pad close to the gap toward a middle region of the second pad.

6 . The light source module according to claim 4 , wherein the light source module further comprises: a cover portion disposed on the substrate and covering the light emitting device,
wherein the cover portion comprises: a first cover layer disposed at least on the substrate; a second cover layer disposed at least on the first cover layer; and wherein the first cover layer is disposed around the light emitting device, and the second cover layer covers the light emitting device.

7 . The light source module according to claim 6 , wherein the first cover layer comprises any one of white ink and reflective ink, and the second cover layer comprises any one of silica gel and clear glue.

8 . A display device comprising:
a light source module; and a functional film layer disposed on the light source module; wherein the light source module is configured to provide light to the functional film layer, and the light source module comprises: a substrate; a pad portion disposed on the substrate, wherein the pad portion comprises a first pad and a second pad, a gap is formed between the first pad and the second pad, the first pad is provided with at least one first opening, and the second pad is provided with at least one second opening; and a plurality of light emitting devices arranged in an array on the substrate, one of the light emitting devices being disposed at least on the first pad and the second pad, wherein the pad portion further comprises a first back pad and a second back pad that are disposed on a side of the substrate away from the light emitting device to be opposite to the first pad and the second pad, respectively; and the light source module further comprises a first via hole extending through the first pad, the substrate and the first back pad, and a second via hole extending through the second pad, the substrate and the second back pad, and each of the first via hole and the second via hole is filled with thermally conductive metal material; the first pad comprises a first flat portion and a first annular portion surrounding and electrically connected to the first flat portion; the at least one first opening comprises two first openings disposed in a region between the first annular portion and the first flat portion to be centrally symmetric about a center of the first pad; and the second pad comprises a second flat portion and a second annular portion surrounding and electrically connected to the second flat portion; and the at least one second opening comprises two second openings disposed in a region between the second annular portion and the second flat portion to be centrally symmetric about a center of the second pad.

Assignees

• Huizhou China Star Optoelectronics Display Co Ltd

Inventors

• Wang Xinyu
• Kuang Guofeng
• Geng Yuqing

Classifications

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/852

  Encapsulations · CPC title

• H10H20/8585 Primary

  being an interconnection · CPC title

• H10H20/8583

  not being in contact with the bodies · CPC title

• H10H20/8581

  characterised by their material · CPC title