Visually undistorted thin film electronic devices

US12581750B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12581750-B2
Application numberUS-202418816575-A
CountryUS
Kind codeB2
Filing dateAug 27, 2024
Priority dateMay 18, 2018
Publication dateMar 17, 2026
Grant dateMar 17, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thin film semiconductor device includes a substrate, a stack of thin film material layers on the substrate, and a scribe fill material in the gap. The stack includes a scribe gap in at least one thin film material layer of the stack. The scribe fill material includes one or more coloring elements selected according to a difference between a baseline optical characteristics spectrum for the stack and an optical characteristics spectrum for thin film material remaining in the scribe gap.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A thin film semiconductor device comprising: a substrate; a stack of thin film material layers on the substrate; and a scribe fill material located within a scribe gap, wherein: the scribe gap is an area defined by an absence of at least one thin film material layer of the stack of thin film material layers; and the scribe fill material includes at least one coloring element that is selected according to a difference between (i) a first optical characteristics spectrum for the stack of thin film material layers and (ii) a second optical characteristics spectrum for thin film material layers remaining beneath the scribe gap. 2 . The thin film semiconductor device of claim 1 wherein: the at least one coloring element is selected such that a combined optical characteristics spectrum matches the first optical characteristics spectrum within a minimum perceptible difference for an industry defined standard observer, and the combined optical characteristics spectrum is based on the second optical characteristics spectrum and the scribe fill material. 3 . The thin film semiconductor device of claim 1 wherein: the at least one coloring element is selected such that a combined optical characteristics spectrum matches the first optical characteristics spectrum within a ΔE2000≤3, and the combined optical characteristics spectrum is based on the second optical characteristics spectrum and the scribe fill material. 4 . The thin film semiconductor device of claim 1 wherein: ratios of the at least one coloring element is selected such that the ratios of the at least one coloring element drive a combined optical characteristics spectrum to obtain the first optical characteristics spectrum, and the combined optical characteristics spectrum is based on the second optical characteristics spectrum and the scribe fill material. 5 . The thin film semiconductor device of claim 1 wherein: the at least one coloring element is selected such that a combined optical characteristics spectrum matches the first optical characteristics spectrum with ≤5% deviation across the visual light spectrum and ≤2% deviation for at least one wavelength within the visual light spectrum, and the combined optical characteristics spectrum is based on the second optical characteristics spectrum and the scribe fill material. 6 . The thin film semiconductor device of claim 1 wherein the scribe fill material includes an insulating material. 7 . The thin film semiconductor device of claim 6 wherein the scribe fill material includes at least one of: an organic polymer, an organic-inorganic hybrid material, an inorganic polymer, or a ceramic material. 8 . The thin film semiconductor device of claim 1 wherein the scribe fill material includes a conducting material. 9 . The thin film semiconductor device of claim 8 wherein the scribe fill material includes at least one of: a semitransparent conductor, a transparent conducting oxide (TCO), a semiconducting organic polymer, or an opaque conductor. 10 . The thin film semiconductor device of claim 1 wherein a thin film material of the stack of thin film material layers is incorporated as part of the at least one coloring element. 11 . The thin film semiconductor device of claim 1 wherein the substrate includes a rigid material. 12 . The thin film semiconductor device of claim 1 wherein the substrate includes a glass pane. 13 . The thin film semiconductor device of claim 1 wherein the substrate includes a plastic material. 14 . The thin film semiconductor device of claim 1 wherein the substrate includes an opaque material. 15 . The thin film semiconductor device of claim 1 wherein the scribe fill material and the at least one coloring element are soluble in a solvent. 16 . The thin film semiconductor device of claim 1 wherein the scribe fill material is deposited in the scribe gap by at least one of: aerosol jet printing, inkjet printing, screen printing, gravure printing, or spectrographic micro contract printing. 17 . The thin film semiconductor device of claim 1 wherein the at least one coloring element includes at least one of: a pigment material or a dye material. 18 . The thin film semiconductor device of claim 1 wherein the stack of thin film material layers includes at least one active semiconductor layer. 19 . The thin film semiconductor device of claim 18 wherein the at least one active semiconductor layer includes an organic photovoltaic semiconductor absorber layer. 20 . The thin film semiconductor device of claim 1 wherein the scribe fill material includes: a first scribe fill material embedded with a first coloring element of the at least one coloring element; and a second scribe fill material embedded with a second coloring element of the at least one coloring element.

Assignees

Inventors

Classifications

  • Structures for the connecting of adjacent photovoltaic cells, e.g. interconnections or insulating spacers · CPC title

  • Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

  • Organic photovoltaic [PV] modules; Arrays of single organic PV cells · CPC title

  • Constructional details · CPC title

  • Package configurations · CPC title

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Frequently asked questions

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What does patent US12581750B2 cover?
A thin film semiconductor device includes a substrate, a stack of thin film material layers on the substrate, and a scribe fill material in the gap. The stack includes a scribe gap in at least one thin film material layer of the stack. The scribe fill material includes one or more coloring elements selected according to a difference between a baseline optical characteristics spectrum for the st…
Who is the assignee on this patent?
Alliance Sustainable Energy, Solarwindow Tech Inc, Alliance For Energy Innovation Llc
What technology area does this patent fall under?
Primary CPC classification H10F19/906. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).