Visually undistorted thin film electronic devices
US-11575096-B2 · Feb 7, 2023 · US
US12581750B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12581750-B2 |
| Application number | US-202418816575-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 27, 2024 |
| Priority date | May 18, 2018 |
| Publication date | Mar 17, 2026 |
| Grant date | Mar 17, 2026 |
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A thin film semiconductor device includes a substrate, a stack of thin film material layers on the substrate, and a scribe fill material in the gap. The stack includes a scribe gap in at least one thin film material layer of the stack. The scribe fill material includes one or more coloring elements selected according to a difference between a baseline optical characteristics spectrum for the stack and an optical characteristics spectrum for thin film material remaining in the scribe gap.
Opening claim text (preview).
The invention claimed is: 1 . A thin film semiconductor device comprising: a substrate; a stack of thin film material layers on the substrate; and a scribe fill material located within a scribe gap, wherein: the scribe gap is an area defined by an absence of at least one thin film material layer of the stack of thin film material layers; and the scribe fill material includes at least one coloring element that is selected according to a difference between (i) a first optical characteristics spectrum for the stack of thin film material layers and (ii) a second optical characteristics spectrum for thin film material layers remaining beneath the scribe gap. 2 . The thin film semiconductor device of claim 1 wherein: the at least one coloring element is selected such that a combined optical characteristics spectrum matches the first optical characteristics spectrum within a minimum perceptible difference for an industry defined standard observer, and the combined optical characteristics spectrum is based on the second optical characteristics spectrum and the scribe fill material. 3 . The thin film semiconductor device of claim 1 wherein: the at least one coloring element is selected such that a combined optical characteristics spectrum matches the first optical characteristics spectrum within a ΔE2000≤3, and the combined optical characteristics spectrum is based on the second optical characteristics spectrum and the scribe fill material. 4 . The thin film semiconductor device of claim 1 wherein: ratios of the at least one coloring element is selected such that the ratios of the at least one coloring element drive a combined optical characteristics spectrum to obtain the first optical characteristics spectrum, and the combined optical characteristics spectrum is based on the second optical characteristics spectrum and the scribe fill material. 5 . The thin film semiconductor device of claim 1 wherein: the at least one coloring element is selected such that a combined optical characteristics spectrum matches the first optical characteristics spectrum with ≤5% deviation across the visual light spectrum and ≤2% deviation for at least one wavelength within the visual light spectrum, and the combined optical characteristics spectrum is based on the second optical characteristics spectrum and the scribe fill material. 6 . The thin film semiconductor device of claim 1 wherein the scribe fill material includes an insulating material. 7 . The thin film semiconductor device of claim 6 wherein the scribe fill material includes at least one of: an organic polymer, an organic-inorganic hybrid material, an inorganic polymer, or a ceramic material. 8 . The thin film semiconductor device of claim 1 wherein the scribe fill material includes a conducting material. 9 . The thin film semiconductor device of claim 8 wherein the scribe fill material includes at least one of: a semitransparent conductor, a transparent conducting oxide (TCO), a semiconducting organic polymer, or an opaque conductor. 10 . The thin film semiconductor device of claim 1 wherein a thin film material of the stack of thin film material layers is incorporated as part of the at least one coloring element. 11 . The thin film semiconductor device of claim 1 wherein the substrate includes a rigid material. 12 . The thin film semiconductor device of claim 1 wherein the substrate includes a glass pane. 13 . The thin film semiconductor device of claim 1 wherein the substrate includes a plastic material. 14 . The thin film semiconductor device of claim 1 wherein the substrate includes an opaque material. 15 . The thin film semiconductor device of claim 1 wherein the scribe fill material and the at least one coloring element are soluble in a solvent. 16 . The thin film semiconductor device of claim 1 wherein the scribe fill material is deposited in the scribe gap by at least one of: aerosol jet printing, inkjet printing, screen printing, gravure printing, or spectrographic micro contract printing. 17 . The thin film semiconductor device of claim 1 wherein the at least one coloring element includes at least one of: a pigment material or a dye material. 18 . The thin film semiconductor device of claim 1 wherein the stack of thin film material layers includes at least one active semiconductor layer. 19 . The thin film semiconductor device of claim 18 wherein the at least one active semiconductor layer includes an organic photovoltaic semiconductor absorber layer. 20 . The thin film semiconductor device of claim 1 wherein the scribe fill material includes: a first scribe fill material embedded with a first coloring element of the at least one coloring element; and a second scribe fill material embedded with a second coloring element of the at least one coloring element.
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Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title
Organic photovoltaic [PV] modules; Arrays of single organic PV cells · CPC title
Constructional details · CPC title
Package configurations · CPC title
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