Resin composition
US-2020283551-A1 · Sep 10, 2020 · US
Resin composition
US12577331B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12577331-B2 |
| Application number | US-202017784987-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 9, 2020 |
| Priority date | Dec 16, 2019 |
| Publication date | Mar 17, 2026 |
| Grant date | Mar 17, 2026 |
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- Title
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Abstract
Official abstract text for this publication.
A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A resin composition comprising the following components (a) to (c): (a) at least one 2-methylene-1,3-dicarbonyl compound; (b) at least one type of conductive particles; and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more. 2 . The resin composition according to claim 1 , wherein the at least one type of conductive particles comprise silver or copper. 3 . The resin composition according to claim 1 , which is used for manufacturing a conductive cured product. 4 . The resin composition according to claim 1 , wherein the monocarboxylic acid is a saturated or unsaturated aliphatic monocarboxylic acid. 5 . The resin composition according to claim 4 , wherein the at least one type of conductive particles comprise silver or copper. 6 . The resin composition according to claim 4 , wherein the saturated or unsaturated aliphatic monocarboxylic acid is linear or branched. 7 . The resin composition according to claim 6 , wherein the at least one type of conductive particles comprise silver or copper. 8 . The resin composition according to claim 4 , wherein the number of carbon atoms in the saturated or unsaturated aliphatic monocarboxylic acid is 6 or more. 9 . The resin composition according to claim 8 , wherein the at least one type of conductive particles comprise silver or copper. 10 . A paste for electronic components, which comprises the resin composition of claim 1 and an initiator comprising at least one basic substance. 11 . The paste for electronic components according to claim 10 , which can be cured by heating to a temperature of 150° C. or less. 12 . A semiconductor device comprising the paste for electronic components of claim 10 . 13 . A cured product obtained by curing the paste for electronic components of claim 10 . 14 . An electromagnetic wave shielding material comprising the cured product of claim 13 . 15 . A semiconductor device comprising the cured product of claim 13 . 16 . A paste for electronic components, which comprises the resin composition of claim 4 and an initiator comprising at least one basic substance. 17 . A paste for electronic components, which comprises the resin composition of claim 6 and an initiator comprising at least one basic substance. 18 . A paste for electronic components, which comprises the resin composition of claim 8 and an initiator comprising at least one basic substance. 19 . A paste for electronic components, which comprises the resin composition of claim 2 and an initiator comprising at least one basic substance.
Assignees
Inventors
Classifications
Copper · CPC title
Silver · CPC title
Metals · CPC title
the conductive material comprising metals or alloys · CPC title
- C08F2/44Primary
Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers · CPC title
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Frequently asked questions
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- What does patent US12577331B2 cover?
- A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least on…
- Who is the assignee on this patent?
- Namics Corp
- What technology area does this patent fall under?
- Primary CPC classification C08F2/44. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).