Systems, devices, and methods for an analyte sensor

Patent metadata

Field	Value
Publication number	US-12576599-B2
Application number	US-202117475111-A
Country	US
Kind code	B2
Filing date	Sep 14, 2021
Priority date	Sep 15, 2020
Publication date	Mar 17, 2026
Grant date	Mar 17, 2026

Abstract

A method includes assembling a sensor subassembly that includes a sensor, a sensor mount, a collar, a sharp, and a sensor cap. The method includes loading a sensor in a sensor mount; dispensing adhesive into a mount channel of the sensor mount; clamping a collar to the sensor mount; and curing the adhesive to fix the collar to the sensor mount. The method can also include inserting a sharp into the sensor mount over the sensor an attaching a sensor cap to the sensor and sensor sharp to provide a sealed sensor subassembly. Methods of assembling an on-body sensor puck assembly and an applicator assembly, and a sensor including a tail, a flag, and a neck that interconnects the tail and the flag and methods of configuring a sensor are also disclosed.

First claim

What is claimed is:

1 . A method of assembling an on-body sensor assembly comprising a printed circuit board (PCB), a shell, and a sensor subassembly, the sensor subassembly comprising a sensor, a mount, a collar, and a sensor cap, the method comprising:
dispensing a first adhesive on an interior surface of the mount, the first adhesive configured to secure the PCB to the mount; after dispensing the first adhesive, aligning the PCB with the sensor and the sensor subassembly and loading the PCB onto the mount of the sensor subassembly; curing the first adhesive to secure the PCB to the mount; dispensing a second adhesive onto an outer diameter of the mount and inner diameter of the collar of the sensor subassembly; attaching the shell to the sensor subassembly; and curing the second adhesive to form the on-body sensor assembly.

2 . The method of claim 1 , wherein the PCB is a flexible PCB and the method further comprises folding the PCB to fit a footprint of the on-body sensor assembly.

3 . The method of claim 2 , wherein dispensing the first adhesive further comprises dispensing the first adhesive at a location of the fold, a battery location, or a PCB connector location.

4 . The method of claim 1 , wherein the PCB comprises a radio component and the method further comprises writing data to the radio component of the PCB by:
reading sensor data from the sensor subassembly, PCB, a shell, or a mount carrying the sensor subassembly; and writing the sensor data to the radio component of the PCB.

5 . The method of claim 1 , wherein dispensing the second adhesive onto the outer diameter of the mount and inner diameter of the collar of the sensor subassembly comprises:
tilting the mount along an axis to a predetermined angle; dispensing the second adhesive to the inner diameter of the collar of the sensor subassembly; returning the mount to a substantially horizontal position by tilting the mount along the axis; and dispensing the second adhesive to the outer diameter of the mount.

6 . The method of claim 1 , further comprising testing the on-body sensor assembly for leaks using a pressure-decay leak test, vacuum-decay leak test, tracer gas leak test, signature analysis test, or mass-flow leak test.

7 . The method of claim 6 , further comprising discarding the on-body sensor assembly when leaks are detected that exceed a predetermined threshold.

8 . The method of claim 1 , wherein the first adhesive or the second adhesive is a chemically-curable adhesive, and the method further comprises curing the first adhesive or the second adhesive by exposing the adhesive to one or more chemical bonding catalysts.

9 . The method of claim 1 , the first adhesive or the second adhesive is a heat-curable adhesive, and the method further comprises curing the first adhesive or the second adhesive by exposing the adhesive to heat suitable to cure the first adhesive or second adhesive.

10 . The method of claim 1 , wherein the first adhesive or the second adhesive is an ultraviolet (UV)-curable adhesive, and the method further comprises curing the first adhesive or the second adhesive using one or more UV light sources.

11 . The method of claim 10 , wherein the one or more UV light sources include a UV light emitting diode (LED) with light pipe and multiple angled spot LEDs.

12 . The method of claim 1 , further comprising loading the collar onto the mount.

13 . The method of claim 1 , wherein the method further comprises:
coupling a sharp hub to the mount, the sharp hub including a sharp; dispensing adhesive to a top surface of the sharp hub; and curing the adhesive to seal the sharp hub.

14 . The method of claim 1 , wherein the mount is tilted to a first predetermined angle before the first adhesive is dispensed and the mount is tilted to a second predetermined angle before the second adhesive is dispensed.

15 . The method of claim 1 , wherein the first or second adhesive is an aerobically-curable adhesive.

16 . The method of claim 1 , wherein aligning the PCB with the sensor and the sensor subassembly comprises aligning an aperture of the PCB with the sensor and a circumference of the PCB with the mount.

Assignees

• Abbott Diabetes Care Inc

Inventors

• Cole Jean-Pierre
• Voit Peter
• Kupa Edward
• Simmons Matthew
• Mitchell Steven
• Smith Timothy Frederick
• Rao Vivek
• Robinson Peter
• Kunich Theodore
• San Nicolas Anthony Joseph
• Pace Louis
• Nierlich Steve
• Patel Dharmendra
• Meyer thomas michael
• Lambert Byron J
• Pudjijanto Stephen T

Classifications

• B29C65/4845

  Radiation curing adhesives, e.g. UV light curing adhesives · CPC title

• B29C65/4835

  Heat curing adhesives · CPC title

• A61B5/6849

  in combination with a needle set · CPC title

• A61B2562/12

  Manufacturing methods specially adapted for producing sensors for in-vivo measurements · CPC title

• B29L2031/752

  Measuring equipment · CPC title