Foaming thermoplastic polyurethane resin, producing method thereof, and molded article
US-2019211136-A1 · Jul 11, 2019 · US
US12576474B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12576474-B2 |
| Application number | US-202418753038-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 25, 2024 |
| Priority date | May 11, 2018 |
| Publication date | Mar 17, 2026 |
| Grant date | Mar 17, 2026 |
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A modification method of a polyurethane, including the steps of: preparing a polyurethane having an ethylenically unsaturated bond; and treating the polyurethane with a liquid containing a compound having a conjugated double bond, or a modification method of a polyurethane, including the steps of: preparing a polyurethane having a conjugated double bond; and treating the polyurethane with a liquid containing a compound having an ethylenically unsaturated bond is used.
Opening claim text (preview).
The invention claimed is: 1 . A polishing pad comprising, in at least a polishing surface thereof, a polyurethane having an ethylenically unsaturated bond, wherein a compound having a conjugated double bond and a functional group selected from the group consisting of a carboxyl group, a metal salt of a carboxyl group, a hydroxyl group, an amino group, a sulfonic acid group, a phosphoric acid group and an imidazole group is added to the ethylenically unsaturated bond to obtain a Diels Alder ring substituted with the functional group. 2 . The polishing pad according to claim 1 , wherein the polyurethane comprises a polymer constituent unit derived from a compound having an ethylenically unsaturated bond. 3 . The polishing pad according to claim 1 , wherein the polyurethane comprises a polymer constituent unit derived from at least one compound selected from the group consisting of cis-2-butene-1,4-diol, 4,5-bis(hydroxymethyl) imidazole, 5-norbornene-2,3-dimethanol, cis-2-nonene-1-ol, cis-3-nonene-1-ol, cis-3-octene-1-ol, and polybutadiene diol. 4 . The polishing pad according to claim 1 , wherein the functional group is a carboxyl group. 5 . The polishing pad according to claim 4 , wherein the polishing surface has a zeta potential at a pH of 3.0 of −1.0 mV or less. 6 . A polishing pad comprising, in at least a polishing surface thereof, a polyurethane having an ethylenically unsaturated bond, wherein the polyurethane comprises a polymer constituent unit derived from at least one compound selected from the group consisting of cis-2-butene-1,4-diol, 4,5-bis(hydroxymethyl) imidazole, 5-norbornene-2,3-dimethanol, cis-2-nonene-1-ol, cis-3-nonene-1-ol, and cis-3-octene-1-ol.
of semiconductor materials · CPC title
Chemically modified polymers · CPC title
containing carboxylic acid groups · CPC title
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
characterised by the composition or properties of the pad materials · CPC title
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