Manufacturing method for display device and display device manufactured using the same

Patent metadata

Field	Value
Publication number	US-12575237-B2
Application number	US-202217994662-A
Country	US
Kind code	B2
Filing date	Nov 28, 2022
Priority date	Feb 24, 2022
Publication date	Mar 10, 2026
Grant date	Mar 10, 2026

Abstract

A method for manufacturing a display device includes providing a display layer including a light emitting element; providing a first coupling layer on the display layer; providing a chassis module including a chassis, a second coupling layer, and a chip-on-film; moving the chassis module; and disposing the chassis module on the first coupling layer.

First claim

What is claimed is:

1 . A method for manufacturing a display device, the method comprising:
providing a display layer including a light emitting element; providing a first coupling layer on the display layer; providing a chassis module including a chassis, a second coupling layer, and a chip-on-film; moving the chassis module; and disposing the chassis module on the first coupling layer, wherein the disposing of the chassis module on the first coupling layer includes deforming the first coupling layer and the second coupling layer by compressing the chassis module.

2 . The method of claim 1 , comprising:
disposing an overcoat layer on an area of the display layer; and disposing an outer film layer on the overcoat layer.

3 . The method of claim 1 , wherein the disposing of the chassis module on the first coupling layer includes allowing the first coupling layer to electrically connect a line included in the display layer and the chip-on-film to each other.

4 . The method of claim 3 , wherein, in the chassis module,
one surface of the second coupling layer contacts the chassis, and another surface of the second coupling layer contacts the chip-on-film.

5 . The method of claim 4 , wherein the disposing of the chassis module on the first coupling layer includes allowing the chip-on-film of the chassis module to face the first coupling layer.

6 . The method of claim 1 , wherein the moving of the chassis module includes simultaneously moving the chassis and the chip-on-film.

7 . The method of claim 6 , wherein the chassis module is moved by using a vacuum pick-up method or an electromagnet.

8 . The method of claim 1 , wherein the disposing of the chassis module on the first coupling layer includes:
allowing the chassis to be connected to the display layer by the first coupling layer and the second coupling layer; and allowing the chip-on-film to be connected to the display layer by the first coupling layer.

9 . The method of claim 1 , wherein the disposing of the chassis module on the first coupling layer includes curing the first coupling layer and the second coupling layer.

10 . The method of claim 2 , wherein, in an area in which the first coupling layer, the second coupling layer, the chip-on-film, and the chassis overlap one another in a plan view, a sum of thicknesses of the first coupling layer, the second coupling layer, the chip-on-film, and the chassis is equal to a sum of thicknesses of the overcoat layer and the outer film layer.

11 . The method of claim 1 , wherein the chassis is disposed at a side of the display device, and has a plate shape.

12 . The method of claim 11 , wherein the chassis has a thickness in a range of about 20 μm to about 100 μm.

13 . The method of claim 1 , wherein
the first coupling layer includes a conductive material and a resin material, the second coupling layer includes a resin material without including any conductive material, a portion of the second coupling layer contacts the first coupling layer, and another portion of the second coupling layer contacts the chassis.

14 . The method of claim 2 , wherein
the display layer includes a first area and a second area, in the first area, the display layer overlaps the first coupling layer, the second coupling layer, the chip-on-film, and the chassis in a plan view, and in the second area, the display layer overlaps the overcoat layer and the outer film layer in a plan view.

15 . A method for manufacturing a display device, the method comprising:
providing a display layer including a light emitting element; providing a first coupling layer on the display layer; connecting a chassis module to a chassis provider including a guide jig and a module catching part, the chassis module including a chassis, a second coupling layer, and a chip-on-film; moving the display layer on which the first coupling layer is provided along a gravity direction to be adjacent to the chassis module; disposing the chassis module on the display layer; and allowing the display layer to be spaced apart from the chassis provider.

16 . The method of claim 15 , wherein the disposing of the chassis module on the display layer includes:
deforming the first coupling layer and the second coupling layer by compressing the chassis module; and curing the first coupling layer and the second coupling layer.

17 . The method of claim 15 , wherein the module catching part includes an electromagnet, and is operated in a connection mode in which the module catching part is connected to the chassis module or a release module in which a connection between the module catching part and the chassis module is released.

18 . A display device manufactured according to the method of claim 15 .

19 . A display device comprising:
a display layer on a substrate, the display layer including a light emitting element; an outer film layer on the display layer; a flexible circuit board providing an electrical signal provided to the display layer; a chip-on-film including one end connected to the display layer and another end connected to the flexible circuit board; an anisotropic conductive film on the display layer, the anisotropic conductive film overlapping the chip-on-film in a plan view; a non-conductive film on the anisotropic conductive film and the chip-on-film; and a chassis on the non-conductive film, wherein the anisotropic conductive film connects the chip-on-film to the display layer, the non-conductive film connects the chassis to the anisotropic conductive film, and the chassis has a plate shape not including any bending area.

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Jun Young
• Song Si Joon
• Kang Youn Woong

Classifications

• H10H20/0364

  of interconnections · CPC title

• H10H20/034

  of coatings · CPC title

• H10H20/8312

  extending at least partially through the bodies · CPC title

• H10H20/84

  Coatings, e.g. passivation layers or antireflective coatings · CPC title

• H10H20/01

  Manufacture or treatment · CPC title